SG157985A1 - Method and apparatus for solder ball placement - Google Patents

Method and apparatus for solder ball placement

Info

Publication number
SG157985A1
SG157985A1 SG200804966-0A SG2008049660A SG157985A1 SG 157985 A1 SG157985 A1 SG 157985A1 SG 2008049660 A SG2008049660 A SG 2008049660A SG 157985 A1 SG157985 A1 SG 157985A1
Authority
SG
Singapore
Prior art keywords
solder ball
ball placement
recess
recesses
array
Prior art date
Application number
SG200804966-0A
Inventor
Soo Loo Ang
Nee Seng Ling
Kam Hung Yau
Luke Pai
Original Assignee
Rokko Ventures Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Ventures Pte Ltd filed Critical Rokko Ventures Pte Ltd
Priority to SG200804966-0A priority Critical patent/SG157985A1/en
Priority to PCT/SG2009/000224 priority patent/WO2009157876A1/en
Priority to CN2009801237878A priority patent/CN102105254A/en
Priority to TW098121248A priority patent/TW201010033A/en
Publication of SG157985A1 publication Critical patent/SG157985A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns

Abstract

A solder ball mounting module comprising a solder ball template having an array of recesses, each recess being in communication with a vacuum source, and each arranged to receive a solder ball; wherein each recess further includes an ejector pin for selectively ejecting the respective solder ball engaged therein. Figure.1
SG200804966-0A 2008-06-24 2008-06-24 Method and apparatus for solder ball placement SG157985A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SG200804966-0A SG157985A1 (en) 2008-06-24 2008-06-24 Method and apparatus for solder ball placement
PCT/SG2009/000224 WO2009157876A1 (en) 2008-06-24 2009-06-19 Method and apparatus for solder ball placement
CN2009801237878A CN102105254A (en) 2008-06-24 2009-06-19 Method and apparatus for solder ball placement
TW098121248A TW201010033A (en) 2008-06-24 2009-06-24 Method and apparatus for solder ball placement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200804966-0A SG157985A1 (en) 2008-06-24 2008-06-24 Method and apparatus for solder ball placement

Publications (1)

Publication Number Publication Date
SG157985A1 true SG157985A1 (en) 2010-01-29

Family

ID=41444785

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200804966-0A SG157985A1 (en) 2008-06-24 2008-06-24 Method and apparatus for solder ball placement

Country Status (4)

Country Link
CN (1) CN102105254A (en)
SG (1) SG157985A1 (en)
TW (1) TW201010033A (en)
WO (1) WO2009157876A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5997136B2 (en) * 2010-05-03 2016-09-28 ア レイモン エ シーＡ． Ｒａｙｍｏｎｄ Ｅｔ Ｃｉｅ Method and apparatus for picking and bonding to carry an adhesive element to a substrate
CN109148311B (en) * 2018-08-22 2020-05-12 重庆市嘉凌新科技有限公司 Chip welding device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3419554B2 (en) * 1994-07-19 2003-06-23 株式会社日立製作所 Semiconductor device manufacturing method and manufacturing apparatus
US5655704A (en) * 1994-08-30 1997-08-12 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component
US6607118B2 (en) * 2001-04-30 2003-08-19 Asm Assembly Automation Limited Apparatus and method for ball release
JP2003110234A (en) * 2001-09-28 2003-04-11 Hitachi Via Mechanics Ltd Conductive ball mounting apparatus
TWI272708B (en) * 2002-10-14 2007-02-01 Aurigin Technology Pte Ltd Apparatus and method for filling a ball grid array template

Also Published As

Publication number Publication date
TW201010033A (en) 2010-03-01
CN102105254A (en) 2011-06-22
WO2009157876A1 (en) 2009-12-30

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