PL2567104T3 - Sposób mocowania elementu adhezyjnego do podłoża w rodzaju weź i połącz - Google Patents
Sposób mocowania elementu adhezyjnego do podłoża w rodzaju weź i połączInfo
- Publication number
- PL2567104T3 PL2567104T3 PL11738479T PL11738479T PL2567104T3 PL 2567104 T3 PL2567104 T3 PL 2567104T3 PL 11738479 T PL11738479 T PL 11738479T PL 11738479 T PL11738479 T PL 11738479T PL 2567104 T3 PL2567104 T3 PL 2567104T3
- Authority
- PL
- Poland
- Prior art keywords
- attach
- substrate
- connect
- adhesive element
- type take
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G65/00—Loading or unloading
- B65G65/30—Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
- B65G65/34—Emptying devices
- B65G65/40—Devices for emptying otherwise than from the top
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
- B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33057710P | 2010-05-03 | 2010-05-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2567104T3 true PL2567104T3 (pl) | 2017-08-31 |
Family
ID=44511095
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL11738479T PL2567104T3 (pl) | 2010-05-03 | 2011-05-03 | Sposób mocowania elementu adhezyjnego do podłoża w rodzaju weź i połącz |
| PL11740717T PL2567105T3 (pl) | 2010-05-03 | 2011-05-03 | Sposób weź i przyklej i urządzenie do przenoszenia elementu adhezyjnego na podłoże |
| PL11738478T PL2567103T3 (pl) | 2010-05-03 | 2011-05-03 | Sposób i urządzenie dla umieszczania elementu adhezyjnego na matrycy |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL11740717T PL2567105T3 (pl) | 2010-05-03 | 2011-05-03 | Sposób weź i przyklej i urządzenie do przenoszenia elementu adhezyjnego na podłoże |
| PL11738478T PL2567103T3 (pl) | 2010-05-03 | 2011-05-03 | Sposób i urządzenie dla umieszczania elementu adhezyjnego na matrycy |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US9592971B2 (pl) |
| EP (3) | EP2567105B1 (pl) |
| JP (3) | JP5997136B2 (pl) |
| CN (3) | CN103069176B (pl) |
| BR (2) | BR112012028237A2 (pl) |
| ES (3) | ES2614462T3 (pl) |
| PL (3) | PL2567104T3 (pl) |
| SI (3) | SI2567103T1 (pl) |
| WO (3) | WO2011138674A2 (pl) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103863837B (zh) * | 2013-11-29 | 2016-06-15 | 山东汉菱电气有限公司 | 错位往复式排料装置和具有其的气化炉 |
| US10446728B2 (en) * | 2014-10-31 | 2019-10-15 | eLux, Inc. | Pick-and remove system and method for emissive display repair |
| DE102016104187A1 (de) * | 2016-03-08 | 2017-09-14 | Profil Verbindungstechnik Gmbh & Co. Kg | Funktionselement |
| DE102016117418A1 (de) * | 2016-09-15 | 2018-03-15 | Profil Verbindungstechnik Gmbh & Co. Kg | Funktionselement |
| KR102126901B1 (ko) * | 2019-08-21 | 2020-06-25 | 문영진 | 지중 매립형 화목보일러 연소시스템 |
| CN110694860B (zh) * | 2019-11-08 | 2021-08-24 | 中车青岛四方机车车辆股份有限公司 | 一种胶接工艺方法 |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS5564362A (en) * | 1978-11-10 | 1980-05-15 | Tokyo Shibaura Electric Co | Base adhesive for bulb |
| JPS60257873A (ja) * | 1984-06-04 | 1985-12-19 | Kyoritsu Kikai Shoji Kk | 接着剤自動供給装置 |
| DE4105949A1 (de) * | 1991-02-26 | 1992-08-27 | Uwe Dr Skurnia | Recyclingfaehiges verbundmaterial |
| JP3092215B2 (ja) * | 1991-06-14 | 2000-09-25 | トヨタ自動車株式会社 | 接着装置 |
| JPH05314700A (ja) * | 1992-05-06 | 1993-11-26 | Hitachi Ltd | 磁気ヘッドスライダ支持構造体の製造方法 |
| JPH06130895A (ja) * | 1992-10-21 | 1994-05-13 | Nippon Telegr & Teleph Corp <Ntt> | 三次元立体模型の製造方法 |
| JPH07212023A (ja) * | 1994-01-26 | 1995-08-11 | Matsushita Electric Works Ltd | 半田ボール供給方法及びその半田ボール供給方法に用いる半田ボール供給治具 |
| US5531942A (en) * | 1994-06-16 | 1996-07-02 | Fry's Metals, Inc. | Method of making electroconductive adhesive particles for Z-axis application |
| JP3419554B2 (ja) | 1994-07-19 | 2003-06-23 | 株式会社日立製作所 | 半導体装置の製造方法および製造装置 |
| JP3528264B2 (ja) * | 1994-08-19 | 2004-05-17 | ソニー株式会社 | ソルダーボールのマウント装置 |
| US5497938A (en) * | 1994-09-01 | 1996-03-12 | Intel Corporation | Tape with solder forms and methods for transferring solder to chip assemblies |
| JP3360435B2 (ja) * | 1994-10-14 | 2002-12-24 | 株式会社日立製作所 | 電子回路装置の製造方法 |
| JP2926308B2 (ja) * | 1995-03-24 | 1999-07-28 | 澁谷工業株式会社 | ハンダボール供給方法 |
| JPH08288291A (ja) * | 1995-04-18 | 1996-11-01 | Citizen Watch Co Ltd | 半導体装置 |
| US5685477A (en) * | 1995-06-28 | 1997-11-11 | Intel Corporation | Method for attaching and handling conductive spheres to a substrate |
| JP3214316B2 (ja) * | 1995-09-29 | 2001-10-02 | 松下電器産業株式会社 | 導電性ボールの搭載装置および搭載方法およびバンプの形成方法 |
| JPH09213742A (ja) * | 1996-01-31 | 1997-08-15 | Toshiba Corp | 半導体装置の製造方法および製造装置 |
| KR100268632B1 (ko) * | 1996-03-08 | 2000-10-16 | 야마구치 다케시 | 범프형성방법 및 장치 |
| US5761048A (en) * | 1996-04-16 | 1998-06-02 | Lsi Logic Corp. | Conductive polymer ball attachment for grid array semiconductor packages |
| JP3315871B2 (ja) * | 1996-09-03 | 2002-08-19 | 日本特殊陶業株式会社 | 半田バンプを有する配線基板及びその製造方法 |
| DE19645000B4 (de) * | 1996-10-30 | 2005-04-07 | A. Raymond & Cie | Verfahren zum Beschichten der Klebeflächen von Befestigungselementen mit Schmelzklebstoffen |
| JP3252748B2 (ja) * | 1997-04-25 | 2002-02-04 | 松下電器産業株式会社 | 導電性ボールの移載方法 |
| JP2850901B2 (ja) * | 1997-06-02 | 1999-01-27 | 日本電気株式会社 | ボール配列治具及びその製造方法 |
| JP3376875B2 (ja) * | 1997-09-08 | 2003-02-10 | 松下電器産業株式会社 | 導電性ボールの移載装置および移載方法 |
| JP2925534B1 (ja) * | 1998-04-28 | 1999-07-28 | 株式会社日鉄マイクロメタル | 金属球配列方法及び配列装置 |
| JPH11219975A (ja) * | 1998-01-30 | 1999-08-10 | Kyocera Corp | 半田ボールの整列方法 |
| US6072233A (en) * | 1998-05-04 | 2000-06-06 | Micron Technology, Inc. | Stackable ball grid array package |
| US6595408B1 (en) * | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
| FR2785140B1 (fr) * | 1998-10-27 | 2007-04-20 | Novatec Sa Soc | Dispositif de mise a disposition de billes ou de preformes pour la fabrication de connexions a billes |
| US6426564B1 (en) * | 1999-02-24 | 2002-07-30 | Micron Technology, Inc. | Recessed tape and method for forming a BGA assembly |
| JP4080635B2 (ja) * | 1999-05-24 | 2008-04-23 | 日立ビアメカニクス株式会社 | 導電性ボール搭載装置における導電性ボールの吸着方法 |
| JP3346345B2 (ja) * | 1999-07-27 | 2002-11-18 | 日本電気株式会社 | 微細ボール供給装置 |
| US6371174B1 (en) * | 2001-01-25 | 2002-04-16 | Illinois Tool Works, Inc. | Adhesive application system and method of use |
| JP2003110234A (ja) * | 2001-09-28 | 2003-04-11 | Hitachi Via Mechanics Ltd | 導電性ボール搭載装置 |
| DE10333152B3 (de) * | 2003-07-22 | 2005-01-20 | A. Raymond & Cie | Verfahren und Vorrichtung zum Beschichten der Klebeflächen von Befestigungselementen mit Schmelzklebstoff |
| JP2005048042A (ja) * | 2003-07-28 | 2005-02-24 | Nec Corp | 接着による部品の搭載方法および構造 |
| US7483114B2 (en) * | 2003-10-20 | 2009-01-27 | Lg Display Co., Ltd. | Liquid crystal display device, substrate bonding apparatus, and method for fabricating liquid crystal display device using the same |
| JP4749791B2 (ja) * | 2005-07-29 | 2011-08-17 | 新日鉄マテリアルズ株式会社 | はんだボールの製造方法 |
| DE102006001885B4 (de) * | 2006-01-13 | 2010-03-04 | Siemens Ag | Detektormodul eines Detektors und Verwendung eines Schmelzklebstoffes zur Herstellung eines Detektormoduls |
| JP4854481B2 (ja) * | 2006-11-22 | 2012-01-18 | ニスカ株式会社 | 製本装置に於ける接着剤塗布方法及び製本装置 |
| CN101276759B (zh) * | 2007-03-26 | 2012-10-10 | 矽品精密工业股份有限公司 | 焊球植球设备及其撷取装置 |
| CN101604641B (zh) * | 2008-06-13 | 2013-02-27 | 涩谷工业株式会社 | 导电性球的搭载方法及搭载装置 |
| SG157985A1 (en) * | 2008-06-24 | 2010-01-29 | Rokko Ventures Pte Ltd | Method and apparatus for solder ball placement |
| JP2010021445A (ja) * | 2008-07-11 | 2010-01-28 | Nippon Steel Materials Co Ltd | 微細ボール除去方法及び除去装置、並びに微細ボール一括搭載方法及び一括搭載装置 |
-
2011
- 2011-05-03 PL PL11738479T patent/PL2567104T3/pl unknown
- 2011-05-03 PL PL11740717T patent/PL2567105T3/pl unknown
- 2011-05-03 JP JP2013508579A patent/JP5997136B2/ja not_active Expired - Fee Related
- 2011-05-03 EP EP11740717.1A patent/EP2567105B1/en not_active Not-in-force
- 2011-05-03 SI SI201131117A patent/SI2567103T1/sl unknown
- 2011-05-03 CN CN201180032452.2A patent/CN103069176B/zh active Active
- 2011-05-03 EP EP11738479.2A patent/EP2567104B1/en active Active
- 2011-05-03 ES ES11738479.2T patent/ES2614462T3/es active Active
- 2011-05-03 SI SI201131100A patent/SI2567104T1/sl unknown
- 2011-05-03 WO PCT/IB2011/001349 patent/WO2011138674A2/en not_active Ceased
- 2011-05-03 US US13/695,910 patent/US9592971B2/en not_active Expired - Fee Related
- 2011-05-03 ES ES11738478.4T patent/ES2617302T3/es active Active
- 2011-05-03 CN CN201180032627.XA patent/CN103080568B/zh not_active Expired - Fee Related
- 2011-05-03 BR BR112012028237A patent/BR112012028237A2/pt not_active Application Discontinuation
- 2011-05-03 US US13/695,905 patent/US9284134B2/en active Active
- 2011-05-03 US US13/695,896 patent/US9266689B2/en active Active
- 2011-05-03 WO PCT/IB2011/001384 patent/WO2011161514A2/en not_active Ceased
- 2011-05-03 EP EP11738478.4A patent/EP2567103B1/en active Active
- 2011-05-03 BR BR112012028236A patent/BR112012028236A2/pt active Search and Examination
- 2011-05-03 PL PL11738478T patent/PL2567103T3/pl unknown
- 2011-05-03 ES ES11740717.1T patent/ES2616919T3/es active Active
- 2011-05-03 SI SI201131118A patent/SI2567105T1/sl unknown
- 2011-05-03 CN CN201180032654.7A patent/CN103069177B/zh active Active
- 2011-05-03 JP JP2013508574A patent/JP5908893B2/ja not_active Expired - Fee Related
- 2011-05-03 WO PCT/IB2011/001423 patent/WO2011138684A2/en not_active Ceased
-
2015
- 2015-10-07 JP JP2015199474A patent/JP6130461B2/ja not_active Expired - Fee Related
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