WO2011138674A2 - Method and apparatus for placing adhesive element on a matrix - Google Patents

Method and apparatus for placing adhesive element on a matrix Download PDF

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Publication number
WO2011138674A2
WO2011138674A2 PCT/IB2011/001349 IB2011001349W WO2011138674A2 WO 2011138674 A2 WO2011138674 A2 WO 2011138674A2 IB 2011001349 W IB2011001349 W IB 2011001349W WO 2011138674 A2 WO2011138674 A2 WO 2011138674A2
Authority
WO
WIPO (PCT)
Prior art keywords
ejector
formed adhesive
hopper
matrix plate
bonding part
Prior art date
Application number
PCT/IB2011/001349
Other languages
French (fr)
Other versions
WO2011138674A3 (en
Inventor
Mathias Hansel
Herbert Le Pabic
Emilien Koelbert
Original Assignee
A. Raymond Et Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A. Raymond Et Cie filed Critical A. Raymond Et Cie
Priority to EP11738478.4A priority Critical patent/EP2567103B1/en
Priority to ES11738478.4T priority patent/ES2617302T3/en
Priority to JP2013508574A priority patent/JP5908893B2/en
Priority to CN201180032452.2A priority patent/CN103069176B/en
Priority to US13/695,905 priority patent/US9284134B2/en
Priority to BR112012028236A priority patent/BR112012028236A2/en
Priority to SI201131117A priority patent/SI2567103T1/en
Publication of WO2011138674A2 publication Critical patent/WO2011138674A2/en
Publication of WO2011138674A3 publication Critical patent/WO2011138674A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • B65G65/30—Methods or devices for filling or emptying bunkers, hoppers, tanks, or like containers, of interest apart from their use in particular chemical or physical processes or their application in particular machines, e.g. not covered by a single other subclass
    • B65G65/34—Emptying devices
    • B65G65/40—Devices for emptying otherwise than from the top
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Definitions

  • the disclosed invention relates to a bonding part attachable to a glass surface or other substrate through the use of adhesives.
  • the disclosed invention relates a method and apparatus for attaching a prepared adhesive, such as a structural polyurethane, epoxy or other basic for an adhesive, pressed from a powder to an adhesive tablet, to a bonding part made of any one of several materials including, metal, glass, ceramics, plastics, wood and composites for attachment to another component such as a glass surface or to another substrate made of materials such metal, ceramics, plastics, wood and composites.
  • a prepared adhesive such as a structural polyurethane, epoxy or other basic for an adhesive, pressed from a powder to an adhesive tablet
  • a bonding part made of any one of several materials including, metal, glass, ceramics, plastics, wood and composites for attachment to another component such as a glass surface or to another substrate made of materials such metal, ceramics, plastics, wood and composites.
  • Attachment of a first component to a second component for any of a variety of applications may be made by any of several known methods of fastening, including mechanical or chemical fastening.
  • Mechanical fastening while often practical and reliable, is not always usable for every application.
  • chemical fastening is the only other alternative. This is the case where, for example, a component is to be attached to a glass surface or other substrate (the second component).
  • An example of a component-to-glass arrangement may be seen in the automotive industry where a rear view mirror or a metal hinge needs to be attached to a glass surface.
  • a solution to the bonding challenge was introduced in the form of an adhesive applied between the part to be attached (the bonding part) and the substrate to which the bonding part was attached.
  • the adhesives have been applied in several ways.
  • the adhesive is applied to the bonding part by dosing with nozzles and spraying the adhesive onto the bonding part. While this process can be easy and often inexpensive, it suffers from the need to frequently clean the nozzles in order to maintain a desired level of consistency in the actual spraying from part to part. In addition, the sprayed adhesive tends to be sticky, thus resulting in the possibility that the bonding part will come into contact with another object between the time of the spraying of the adhesive and the actual attachment of the bonding part to the substrate.
  • the adhesive does not require an adhesion promoter.
  • the release layer protects against the adhesive from being inadvertently attached to a surface, it also adds an inconvenient step in the process of attachment of the bonding part to the substrate in that the layer must be removed prior to attachment.
  • the release layer may also tear resulting in a portion of the layer being left behind on the adhesive surface and creating the potential for imperfect adhesion of the bonding part to the substrate.
  • the step of attaching the double-sided tape to the bonding part is also complicated by the fact that this arrangement of structural adhesives can only be used for in-line assembly in which the bonding part, the double-sided tape and the substrate pass through a heater such as an autoclave to achieve full bonding performance.
  • a third and more attractive method is to provide the bonding part with a formed adhesive element such as a tablet already in position prior to shipment of the bonding part to the end-user.
  • This arrangement is attractive as it results in a bonding part that is ready to bond with no requirement that the end user attach the adhesive tablet to the bonding part.
  • the end user wishes to apply the tablet at its facility and according to its own schedule and arrangement. In such a case the concept of a pre-applied adhesive such as the bonding tablet already fitted to the bonding part may not be the optimal choice.
  • the disclosed invention provides a method and apparatus for attaching formed adhesive elements to a heated bonding part.
  • the apparatus includes a formed adhesive element-holding hopper movably positioned over a matrix plate.
  • the matrix plate includes a nesting matrix defined by a plurality of formed adhesive element- receiving apertures.
  • An ejector system is fitted beneath the matrix plate and includes a body having a vacuum chamber that is fluidly continuous with the apertures formed in the matrix plate.
  • the vacuum chamber includes an air inlet and an air exhaust.
  • the ejector system additionally includes a lifting body to which a plurality of ejector stamps and an inlet shut off shaft are attached. Channels for the ejector stamps are formed in the body of the ejector system.
  • the ejector stamps are movably fitted in the apertures and the channels.
  • the hopper slides over the matrix and deposits formed adhesive elements into the apertures.
  • the hopper slides away. Movement of the formed adhesive elements into position into the apertures is assisted by a vacuum created in the vacuum chamber.
  • a heated bonding part is positioned over then lowered onto the formed adhesive elements in the apertures of the nesting matrix.
  • the bonding part with its attached formed adhesive elements is lifted away from the apparatus.
  • the lifting body is then lowered to its fully retracted position, withdrawing the inlet shut off shaft from the air inlet and allowing air to flow into the vacuum chamber and the apertures and out of the air exhaust.
  • the apparatus is then ready for another cycle.
  • FIG. 1 is a perspective view of an embodiment of a tool for placing the formed adhesive element onto a matrix
  • FIG. 2 is a sectional view of the tool shown in Figure 2 in a pre-loaded condition
  • FIG. 3 is a view similar to that of Figure 2 but showing the hopper of the tool of Figure 1 in position over the apertures of the ejector stamps;
  • FIG. 4 is a view similar to that of Figure 3 but showing the hopper moved out of its loading position to its resting position with the formed adhesive elements in position on the apertures of the ejector stamps;
  • FIG. 5 is a view similar to that of Figure 4 but showing a bonding part in position above the formed adhesive elements
  • FIG. 6 is a view similar to that of Figure 5 but showing a close up view to provide additional detail of the formed adhesive elements in contact with the bonding part;
  • FIG. 7 is a view similar to that of Figure 6 but showing the bonding part having been moved away from the matrix and the ejector assembly in its fully retracted position;
  • FIG. 8 is illustrates the bonding part and its attached formed adhesive elements fitted thereto and positioned over a substrate
  • the method and the apparatus for undertaking the positioning, holding and movement of formed adhesive elements for attachment to a bonding part according to the disclosed invention are set forth in Figures 1 through 7.
  • an applicator apparatus generally illustrated as 1 0 is shown.
  • the applicator apparatus 10 includes a movable hopper 1 2 movably positioned over a matrix plate 14.
  • the matrix plate 14 is mounted to a table 1 6.
  • Formed in the matrix plate 14 is a nesting matrix 1 8.
  • An ejector system 20 is fitted beneath the matrix plate 14.
  • the nesting matrix 18 includes a plurality of apertures 22 for the movable ejector stamps, discussed below. While five apertures 22 are illustrated the number of apertures 22 may be greater or lesser. Two such apertures, 22 and 22', are shown in Figures 2 through 7.
  • the ejector system 20 includes a body 24 attached, preferably but not absolutely, to the underside of the matrix plate 14.
  • the body 24 has centrally formed therein a vacuum chamber 26 into which the apertures 22 and 22' open.
  • An air inlet 28 and an air exhaust 30 are formed in the body 24 and are continuous with the vacuum chamber 26.
  • Also defined in the body 24 is a pair of ejector stamp channels 32 and 32'.
  • the ejector system 20 also includes at least one ejector stamp. Two such ejector stamps are illustrated as ejector stamps and 34 and 34' although the actual number of stamps could be more or less than the two illustrated.
  • a movable lifting body 36 forms provides a base for the stamps 34 and 34' to which they are attached.
  • An inlet shut off shaft 38 is also attached to the movable lifting body 36.
  • the ejector stamps 34 and 34' are movably fitted in apertures 22 and 22' respectively.
  • the ejector stamps 34 and 34' are also movably fitted in ejector stamp channels 32 and 32', also respectively. While the fit between the ejector stamps 34 and 34' and the interior surface of the ejector stamp channels 32 and 32' is relatively tight, the fit between the ejector stamps 34 and 34' and the walls of the apertures 22 and 22' is loose enough so that air can pass there between as will be discussed below.
  • the movable hopper 12 Prior to operation of the applicator apparatus 10 the movable hopper 12 is at its idle position as shown in Figure 2. Once formed adhesive elements 40 are placed within the movable hopper 12 operation of the apparatus 1 0 can be initiated. (It is to be understood that while the disclosed invention as illustrated and discussed refers to the hopper 12 as moving over the matrix plate 14 it may well be that the hopper 12 is fixed and the matrix plate 14 is moved into position beneath the hopper 1 2.)
  • the movable hopper 12 moves from its idle position shown in Figure 2 to its loading position as shown in Figure 3.
  • the lower (open) end of the hopper 12 is positioned generally above the nesting matrix 18.
  • certain ones of the formed adhesive elements, in the illustrated example elements 40' and 40" fall into the apertures 22 and 22' respectively.
  • the movable hopper 12 returns to its idle position as illustrated in Figure 4.
  • the nesting matrix 18, the vacuum chamber 26, and the ejector system 20 may be provided as a unit in the matrix plate 14.
  • the unit may be interchangeable with other units, such a change being required according to different part references.
  • the next step of the attachment procedure involves the formed adhesive elements 40' and 40" being attached to the underside of a heated bonding part, such as the heated bonding part 42.
  • the heated bonding part 42 includes an adhesive-contacting surface 44.
  • the heated bonding part 42 is moved into position above the formed adhesive elements 40 and 40' as shown in Figure 5.
  • the heated bonding part 42 is then positioned a small distance above the matrix plate 14 and the formed adhesive elements 40' and 40".
  • the movable lifting body 36 of the ejector system 20 then moves upward toward the matrix plate 14 such that the ejector stamps 34 and 34' and the supported adhesive elements 40' and 40" are pushed upward out of the apertures 22 and 22' in a direction toward the adhesive-contacting surface 44 until the elements are sufficiently warmed so as to cause a partial melt of the formed adhesive elements 40' and 40" adequate to create adhesion onto the bonding part 42, as illustrated in Figure 6.
  • the pressure and position of the ejector stamps can be regulated.
  • the movable lifting body 36 of the ejector system 20 is moved away from the matrix plate 14 and is lowered to its fully retracted position as illustrated in Figure 7. In this position the uppermost ends of the ejector stamps 34 and 34' are substantially flush with the adjacent surface of the lower wall of the vacuum chamber 26. Simultaneously the inlet shut off shaft 38 is moved out of its air flow shut off position within the air inlet 28.
  • the bonding part 42 is then positioned above a substrate 46 as shown in Figure 8 and is thereafter attached to the substrate 46 as illustrated in Figure 9.
  • Figure 10 illustrates an alternate embodiment of the disclosed invention that allows for easy tool changes as is often required in production to accommodate bonding parts having different shapes and sizes.
  • an applicator apparatus generally illustrated as 10'
  • the applicator apparatus 1 0' includes the movable hopper 12 of the embodiment set forth above and shown in Figures 2 through 7.
  • the movable hopper 1 2 is movably positioned over a matrix plate 14'.
  • the applicator apparatus 10' includes an insert assembly 50.
  • An ejector system 20' is attached to the underside of the insert assembly 50.
  • the components of the ejector system 20' are preferably the same as those discussed above with respect to the ejector system 20.
  • the insert assembly 50 has formed therein apertures as set forth above with respect to the matrix 14. The number and
  • the arrangement of the apertures may be varied from insert assembly to insert assembly.
  • the insert assembly 50 may be easily changed with another insert assembly in which the insert has a different number and/or a different arrangement of apertures.
  • the disclosed method and apparatus provides a robust, easy and cost effective method of positioning a formed adhesive element on a matrix plate for attachment to the bonding part.

Abstract

A method and apparatus for attaching formed adhesive elements to a heated bonding part are disclosed. The apparatus includes a hopper movably positioned over a matrix plate. The matrix plate includes a nesting matrix defined by formed adhesive element-receiving apertures. An ejector system is fitted beneath the matrix plate and includes a body having a vacuum chamber with an air inlet and an air exhaust. The chamber is fluidly continuous with the apertures formed in the matrix plate. The ejector system includes a lifting body to which ejector stamps and an inlet shut off shaft are attached. Channels for the ejector stamps are formed in the body of the ejector system. The ejector stamps are movably fitted in the apertures and the channels. In operation, the hopper slides over the matrix and deposits formed adhesive elements into the apertures then slides away. Movement of the formed adhesive elements into position into the apertures is assisted by a vacuum created in the vacuum chamber. A heated bonding part is positioned over then lowered onto the formed adhesive elements in the apertures of the nesting matrix. Assisted by the upward movement of the lifting body and its associated ejector stamps the bonding part with its attached formed adhesive elements is lifted away from the apparatus. The lifting body is then lowered and withdraws the inlet shut off shaft from the air inlet and allowing air to flow into the vacuum chamber and the apertures and out of the air exhaust.

Description

METHOD AND APPARATUS FOR PLACING
ADHESIVE ELEMENT ON A MATRIX
TECHNICAL FIELD
[0001] The disclosed invention relates to a bonding part attachable to a glass surface or other substrate through the use of adhesives.
More particularly, the disclosed invention relates a method and apparatus for attaching a prepared adhesive, such as a structural polyurethane, epoxy or other basic for an adhesive, pressed from a powder to an adhesive tablet, to a bonding part made of any one of several materials including, metal, glass, ceramics, plastics, wood and composites for attachment to another component such as a glass surface or to another substrate made of materials such metal, ceramics, plastics, wood and composites.
BACKGROUND OF THE INVENTION
[0002] Attachment of a first component to a second component for any of a variety of applications may be made by any of several known methods of fastening, including mechanical or chemical fastening. Mechanical fastening, while often practical and reliable, is not always usable for every application. For example, where a first component is being attached to a second component and it is not desirable or practical to drill into or otherwise modify the second component for mechanical attachment, chemical fastening is the only other alternative. This is the case where, for example, a component is to be attached to a glass surface or other substrate (the second component). An example of a component-to-glass arrangement may be seen in the automotive industry where a rear view mirror or a metal hinge needs to be attached to a glass surface. Other examples of component-to-glass attachment needs exist such as in home and office construction.
[0003] A solution to the bonding challenge was introduced in the form of an adhesive applied between the part to be attached (the bonding part) and the substrate to which the bonding part was attached. The adhesives have been applied in several ways.
[0004] According to one known approach the adhesive is applied to the bonding part by dosing with nozzles and spraying the adhesive onto the bonding part. While this process can be easy and often inexpensive, it suffers from the need to frequently clean the nozzles in order to maintain a desired level of consistency in the actual spraying from part to part. In addition, the sprayed adhesive tends to be sticky, thus resulting in the possibility that the bonding part will come into contact with another object between the time of the spraying of the adhesive and the actual attachment of the bonding part to the substrate.
[0005] According to another known approach a double-sided tape is applied to the bonding part. According to this approach a release layer is removed from one side of the tape and the tape is applied to the bonding part. The release layer on the other side of the tape is left in place until the bonding part is ready for attachment to the substrate. This approach offers advantages in that it is usable at room
temperature and the adhesive for contact with the substrate is not exposed until needed. Furthermore, the adhesive does not require an adhesion promoter. However, while the release layer protects against the adhesive from being inadvertently attached to a surface, it also adds an inconvenient step in the process of attachment of the bonding part to the substrate in that the layer must be removed prior to attachment. The release layer may also tear resulting in a portion of the layer being left behind on the adhesive surface and creating the potential for imperfect adhesion of the bonding part to the substrate. The step of attaching the double-sided tape to the bonding part is also complicated by the fact that this arrangement of structural adhesives can only be used for in-line assembly in which the bonding part, the double-sided tape and the substrate pass through a heater such as an autoclave to achieve full bonding performance.
[0006] A third and more attractive method is to provide the bonding part with a formed adhesive element such as a tablet already in position prior to shipment of the bonding part to the end-user. This arrangement is attractive as it results in a bonding part that is ready to bond with no requirement that the end user attach the adhesive tablet to the bonding part. However, it may be that the end user wishes to apply the tablet at its facility and according to its own schedule and arrangement. In such a case the concept of a pre-applied adhesive such as the bonding tablet already fitted to the bonding part may not be the optimal choice.
[0007] Accordingly, as in so many areas of fastener technology, there is room in the art of bonding parts for an alternate approach to the manufacture of bonding parts.
SUMMARY OF THE INVENTION
[0008] The disclosed invention provides a method and apparatus for attaching formed adhesive elements to a heated bonding part. The apparatus includes a formed adhesive element-holding hopper movably positioned over a matrix plate. The matrix plate includes a nesting matrix defined by a plurality of formed adhesive element- receiving apertures. An ejector system is fitted beneath the matrix plate and includes a body having a vacuum chamber that is fluidly continuous with the apertures formed in the matrix plate. The vacuum chamber includes an air inlet and an air exhaust. The ejector system additionally includes a lifting body to which a plurality of ejector stamps and an inlet shut off shaft are attached. Channels for the ejector stamps are formed in the body of the ejector system. The ejector stamps are movably fitted in the apertures and the channels. [0009] In operation, the hopper slides over the matrix and deposits formed adhesive elements into the apertures. The hopper slides away. Movement of the formed adhesive elements into position into the apertures is assisted by a vacuum created in the vacuum chamber. A heated bonding part is positioned over then lowered onto the formed adhesive elements in the apertures of the nesting matrix. Assisted by the upward movement of the lifting body and its associated ejector stamps the bonding part with its attached formed adhesive elements is lifted away from the apparatus. The lifting body is then lowered to its fully retracted position, withdrawing the inlet shut off shaft from the air inlet and allowing air to flow into the vacuum chamber and the apertures and out of the air exhaust. The apparatus is then ready for another cycle.
[0010] Other advantages and features of the invention will become apparent when viewed in light of the detailed description of the preferred embodiment when taken in conjunction with the attached drawings and the appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] For a more complete understanding of this invention, reference should now be made to the embodiments illustrated in greater detail in the accompanying drawings and described below by way of examples of the invention wherein: [0012] FIG. 1 is a perspective view of an embodiment of a tool for placing the formed adhesive element onto a matrix;
[0013] FIG. 2 is a sectional view of the tool shown in Figure 2 in a pre-loaded condition;
[0014] FIG. 3 is a view similar to that of Figure 2 but showing the hopper of the tool of Figure 1 in position over the apertures of the ejector stamps;
[0015] FIG. 4 is a view similar to that of Figure 3 but showing the hopper moved out of its loading position to its resting position with the formed adhesive elements in position on the apertures of the ejector stamps;
[0016] FIG. 5 is a view similar to that of Figure 4 but showing a bonding part in position above the formed adhesive elements;
[0017] FIG. 6 is a view similar to that of Figure 5 but showing a close up view to provide additional detail of the formed adhesive elements in contact with the bonding part;
[0018] FIG. 7 is a view similar to that of Figure 6 but showing the bonding part having been moved away from the matrix and the ejector assembly in its fully retracted position;
[0019] FIG. 8 is illustrates the bonding part and its attached formed adhesive elements fitted thereto and positioned over a substrate;
[0020] FIG. 9 is a view similar to that of Figure 8 but illustrating the bonding part adhered to the substrate; and [0021] FIG. 10 is a view similar to that of the sectional view of Figure 2 but illustrating an alternate embodiment of the disclosed invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
[0022] In the following figures, the same reference numerals will be used to refer to the same components. In the following description, various operating parameters and components are described for different constructed embodiments. These specific parameters and components are included as examples and are not meant to be limiting.
[0023] The formed adhesive elements referenced in the present application and their attachment to a bonding part are generally discussed in co-pending United States Serial No. , incorporated by reference herein. A method and apparatus for transferring the formed adhesive elements from a holding reservoir to the stamp apertures is disclosed in co-pending United States Serial No.
, incorporated by reference herein.
[0024] The method and the apparatus for undertaking the positioning, holding and movement of formed adhesive elements for attachment to a bonding part according to the disclosed invention are set forth in Figures 1 through 7. With reference to these figures, an applicator apparatus, generally illustrated as 1 0, is shown. The applicator apparatus 10 includes a movable hopper 1 2 movably positioned over a matrix plate 14. The matrix plate 14 is mounted to a table 1 6. Formed in the matrix plate 14 is a nesting matrix 1 8. An ejector system 20 is fitted beneath the matrix plate 14.
[0025] The nesting matrix 18 includes a plurality of apertures 22 for the movable ejector stamps, discussed below. While five apertures 22 are illustrated the number of apertures 22 may be greater or lesser. Two such apertures, 22 and 22', are shown in Figures 2 through 7.
[0026] The ejector system 20 includes a body 24 attached, preferably but not absolutely, to the underside of the matrix plate 14. The body 24 has centrally formed therein a vacuum chamber 26 into which the apertures 22 and 22' open. An air inlet 28 and an air exhaust 30 are formed in the body 24 and are continuous with the vacuum chamber 26. Also defined in the body 24 is a pair of ejector stamp channels 32 and 32'.
[0027] The ejector system 20 also includes at least one ejector stamp. Two such ejector stamps are illustrated as ejector stamps and 34 and 34' although the actual number of stamps could be more or less than the two illustrated. A movable lifting body 36 forms provides a base for the stamps 34 and 34' to which they are attached. An inlet shut off shaft 38 is also attached to the movable lifting body 36.
[0028] The ejector stamps 34 and 34' are movably fitted in apertures 22 and 22' respectively. The ejector stamps 34 and 34' are also movably fitted in ejector stamp channels 32 and 32', also respectively. While the fit between the ejector stamps 34 and 34' and the interior surface of the ejector stamp channels 32 and 32' is relatively tight, the fit between the ejector stamps 34 and 34' and the walls of the apertures 22 and 22' is loose enough so that air can pass there between as will be discussed below.
[0029] Prior to operation of the applicator apparatus 10 the movable hopper 12 is at its idle position as shown in Figure 2. Once formed adhesive elements 40 are placed within the movable hopper 12 operation of the apparatus 1 0 can be initiated. (It is to be understood that while the disclosed invention as illustrated and discussed refers to the hopper 12 as moving over the matrix plate 14 it may well be that the hopper 12 is fixed and the matrix plate 14 is moved into position beneath the hopper 1 2.)
[0030] In operation, the movable hopper 12 moves from its idle position shown in Figure 2 to its loading position as shown in Figure 3. When in its loading position the lower (open) end of the hopper 12 is positioned generally above the nesting matrix 18. Thus positioned certain ones of the formed adhesive elements, in the illustrated example elements 40' and 40" fall into the apertures 22 and 22' respectively.
[0031] To assist in drawing the formed adhesive elements 40' and 40" into the apertures 22 and 22' and to hold them snugly therein a vacuum created within the vacuum chamber 26 by the withdrawal of air from the vacuum chamber 26 by way of the air exhaust 30. As illustrated in Figures 3 through 5, the formed adhesive elements 40 and 40' fit snugly within the apertures 22 and 22' such that little or no air is allowed to pass between the formed adhesive elements 40' and 40" and the walls of the apertures 22 and 22'. In such case the formed adhesive elements 40 and 40' are drawn into the apertures 22 and 22' and against the upper ends of the ejector stamps 34 and 34' respectively.
[0032] Once the formed adhesive elements 40' and 40" are loaded, the movable hopper 12 returns to its idle position as illustrated in Figure 4. The nesting matrix 18, the vacuum chamber 26, and the ejector system 20 may be provided as a unit in the matrix plate 14. The unit may be interchangeable with other units, such a change being required according to different part references.
[0033] The next step of the attachment procedure involves the formed adhesive elements 40' and 40" being attached to the underside of a heated bonding part, such as the heated bonding part 42. The heated bonding part 42 includes an adhesive-contacting surface 44.
[0034] Particularly, the heated bonding part 42 is moved into position above the formed adhesive elements 40 and 40' as shown in Figure 5. The heated bonding part 42 is then positioned a small distance above the matrix plate 14 and the formed adhesive elements 40' and 40".
[0035] The movable lifting body 36 of the ejector system 20 then moves upward toward the matrix plate 14 such that the ejector stamps 34 and 34' and the supported adhesive elements 40' and 40" are pushed upward out of the apertures 22 and 22' in a direction toward the adhesive-contacting surface 44 until the elements are sufficiently warmed so as to cause a partial melt of the formed adhesive elements 40' and 40" adequate to create adhesion onto the bonding part 42, as illustrated in Figure 6. The pressure and position of the ejector stamps can be regulated.
[0036] Once the formed adhesive elements 40' and 40" are adhered to the adhesive-contacting surface 44 of the bonding part 42, the movable lifting body 36 of the ejector system 20 is moved away from the matrix plate 14 and is lowered to its fully retracted position as illustrated in Figure 7. In this position the uppermost ends of the ejector stamps 34 and 34' are substantially flush with the adjacent surface of the lower wall of the vacuum chamber 26. Simultaneously the inlet shut off shaft 38 is moved out of its air flow shut off position within the air inlet 28. As air continues to be drawn out of the air exhaust 30 air is drawn into the air inlet 28 and the apertures 22 and 22', thereby allowing air circulation to clean the internal elements of the ejector system 20 thus preparing it for the next operation. With the ejector stamps 34 and 34' substantially withdrawn from the vacuum chamber 26 little or no interference of passing air is created within the vacuum chamber 26 as it is drawn out through the air exhaust 30.
[0037] The bonding part 42 is then positioned above a substrate 46 as shown in Figure 8 and is thereafter attached to the substrate 46 as illustrated in Figure 9.
[0038] It should be noted that the method and apparatus of the disclosed invention may be used with bonding parts of a great variety of shapes and sizes. In addition, it should also be noted that while formed adhesive elements having spherical shapes are illustrated, other shapes, such as discs or tablets, may be used as well.
[0039] Figure 10 illustrates an alternate embodiment of the disclosed invention that allows for easy tool changes as is often required in production to accommodate bonding parts having different shapes and sizes. With respect to Figure 10, an applicator apparatus, generally illustrated as 10', is shown. The applicator apparatus 1 0' includes the movable hopper 12 of the embodiment set forth above and shown in Figures 2 through 7. The movable hopper 1 2 is movably positioned over a matrix plate 14'. The applicator apparatus 10' includes an insert assembly 50. An ejector system 20' is attached to the underside of the insert assembly 50. The components of the ejector system 20' are preferably the same as those discussed above with respect to the ejector system 20. [0040] The insert assembly 50 has formed therein apertures as set forth above with respect to the matrix 14. The number and
arrangement of the apertures may be varied from insert assembly to insert assembly. The insert assembly 50 may be easily changed with another insert assembly in which the insert has a different number and/or a different arrangement of apertures.
[0041] Accordingly, the disclosed method and apparatus provides a robust, easy and cost effective method of positioning a formed adhesive element on a matrix plate for attachment to the bonding part.
[0042] The foregoing discussion discloses and describes exemplary embodiments of the present invention. One skilled in the art will readily recognize from such discussion, and from the accompanying drawings and claims that various changes, modifications and variations can be made therein without departing from the true spirit and fair scope of the invention as defined by the following claims.

Claims

CLAIMS What is claimed is:
Claim 1 . An apparatus for positioning, holding and moving a formed adhesive
element for attachment to a bonding part, the apparatus comprising:
a support table;
a matrix plate operatively associated with said support table, said matrix
plate having at least one aperture for receiving the formed adhesive element;
a formed adhesive element hopper operatively associated with said matrix
plate, one of said matrix plate and said hopper being movable with respect to
the other; and
an ejector system for ejecting the formed adhesive element from said at least
one aperture.
Claim 2. The apparatus of Claim 1 wherein said hopper is reversibly movable
between an idle position and a loading position above said at least one aperture.
Claim 3. The apparatus of Claim 1 wherein said ejector system includes an
ejector body and a movable lifting body associated with said ejector body.
Claim 4. The apparatus of Claim 3 wherein said ejector body has a vacuum chamber formed therein.
Claim 5. The apparatus of Claim 4 wherein said ejector body includes an air
inlet and an air exhaust fluidly associated with said vacuum chamber.
Claim 6. The apparatus of Claim 5 wherein said lifting body has attached thereto at least one ejector stamp movably positionable through said ejector body and
into said at least one aperture formed in said matrix plate.
Claim 7. The apparatus of Claim 6 wherein said lifting body has attached thereto an air inlet shut off shaft positionable substantially within said air inlet of
said ejector body.
Claim 8. The apparatus of Claim 1 wherein the apparatus includes an interchangeable insert assembly having an insert positionable substantially within said matrix plate and wherein said ejector system is attached to said insert.
Claim 9. An apparatus for positioning, holding and moving formed adhesive
elements for attachment to a bonding part, the apparatus comprising:
a matrix plate having at least one aperture;
a formed adhesive element holding hopper operatively associated with said
matrix plate, one of said matrix plate and said hopper being movable with
respect to the other; and
an ejector system having at least one ejector stamp partially positionable
within said at least one aperture of said matrix plate.
Claim 1 0. The apparatus of Claim 9 further including a table to which said
matrix plate and said ejector system are operatively associated.
Claim 1 1 . The apparatus of Claim 9 wherein said hopper is reversibly movable between an idle position and a loading position in which said hopper is positioned above said at least one aperture.
Claim 1 2. The apparatus of Claim 9 wherein said ejector system includes an ejector body and a movable lifting body operatively associated with said ejector body.
Claim 1 3. The apparatus of Claim 12 wherein said ejector body has a vacuum chamber formed therein.
Claim 14. The apparatus of Claim 13 wherein said ejector body includes an air inlet and an air exhaust fluidly associated with said vacuum chamber.
Claim 1 5. The apparatus of Claim 14 wherein said at least one ejector stamp is attached to said lifting body.
Claim 1 6. The apparatus of Claim 15 wherein said lifting body has attached thereto an air inlet shut off shaft at least partially positionable within said air inlet of said ejector body.
Claim 1 7. A method of positioning, holding and moving formed adhesive elements for attachment to a bonding part comprising the steps of:
forming a positioning, holding, and moving apparatus including a matrix plate
having at least one aperture for receiving a formed adhesive element, a formed adhesive element holding hopper, and an ejector system having at least one ejector stamp partially positionable within said at least one aperture;
moving one of said matrix plate or said hopper to a position in which said hopper is above said at least one aperture;
allowing a formed adhesive element to exit said hopper and locate in said at least one aperture;
moving one of said matrix plate or said hopper to a position in which said hopper is not above said at least one aperture;
positioning a bonding part above said formed adhesive element; and
causing said ejector system to move said at least one ejector stamp to move said formed adhesive element into contact with said bonding part.
Claim 1 8. The method of Claim 17 including the step of heating said bonding part prior to the formed adhesive element being moved into contact with said bonding part.
Claim 1 9. The method of Claim 17 wherein said ejector system includes an ejector body and a lifting body, said at least one ejector stamp being attached to said lifting body.
Claim 20. The method of Claim 19 wherein said ejector body includes a vacuum chamber formed therein to which said at least one aperture is fluidly connected, said ejector body further including an air inlet and an air exhaust fluidly connected with said vacuum chamber.
Claim 21 . The method of Claim 20 including the step of creating a vacuum within said vacuum chamber such that the formed adhesive element is drawn against said at least one ejector stamp when positioned thereon.
PCT/IB2011/001349 2010-05-03 2011-05-03 Method and apparatus for placing adhesive element on a matrix WO2011138674A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP11738478.4A EP2567103B1 (en) 2010-05-03 2011-05-03 Method and apparatus for placing adhesive element on a matrix
ES11738478.4T ES2617302T3 (en) 2010-05-03 2011-05-03 Method and apparatus for placing an adhesive element on a matrix
JP2013508574A JP5908893B2 (en) 2010-05-03 2011-05-03 Method and apparatus for placing adhesive elements on a matrix
CN201180032452.2A CN103069176B (en) 2010-05-03 2011-05-03 For placing method and the device thereof of adhesive element on matrix
US13/695,905 US9284134B2 (en) 2010-05-03 2011-05-03 Method and apparatus for placing adhesive element on a matrix
BR112012028236A BR112012028236A2 (en) 2010-05-03 2011-05-03 method and device for placing adhesive element in an array
SI201131117A SI2567103T1 (en) 2010-05-03 2011-05-03 Method and apparatus for placing adhesive element on a matrix

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33057710P 2010-05-03 2010-05-03
US61/330,577 2010-05-03

Publications (2)

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WO2011138674A3 WO2011138674A3 (en) 2012-03-22

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PCT/IB2011/001423 WO2011138684A2 (en) 2010-05-03 2011-05-03 Pick and bond method and apparatus for transferring adhesive element to substrate
PCT/IB2011/001384 WO2011161514A2 (en) 2010-05-03 2011-05-03 Pick and bond method for attachment of adhesive element to substrate

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PCT/IB2011/001384 WO2011161514A2 (en) 2010-05-03 2011-05-03 Pick and bond method for attachment of adhesive element to substrate

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US (3) US9266689B2 (en)
EP (3) EP2567103B1 (en)
JP (3) JP5908893B2 (en)
CN (3) CN103069177B (en)
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ES (3) ES2617302T3 (en)
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103863837A (en) * 2013-11-29 2014-06-18 山东汉菱电气有限公司 Staggered reciprocating discharge device and gasifier with staggered reciprocating discharge device
EP3217024A1 (en) * 2016-03-08 2017-09-13 Profil Verbindungstechnik GmbH & Co. KG Function element

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10446728B2 (en) * 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
KR102126901B1 (en) * 2019-08-21 2020-06-25 문영진 System for controlling optimized combustion on separating boiler
CN110694860B (en) * 2019-11-08 2021-08-24 中车青岛四方机车车辆股份有限公司 Glue-bonding process method

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5564362A (en) * 1978-11-10 1980-05-15 Tokyo Shibaura Electric Co Base adhesive for bulb
JPS60257873A (en) * 1984-06-04 1985-12-19 Kyoritsu Kikai Shoji Kk Apparatus for automatically supplying adhesive
DE4105949A1 (en) * 1991-02-26 1992-08-27 Uwe Dr Skurnia Bonded composite suitable for recycling - has insol. surface sheets bonded together with glue-line contg. pattern of spaces through which solvent can pass to dissolve it
JP3092215B2 (en) * 1991-06-14 2000-09-25 トヨタ自動車株式会社 Bonding equipment
JPH05314700A (en) * 1992-05-06 1993-11-26 Hitachi Ltd Production of structural body for supporting magnetic head slider
JPH06130895A (en) * 1992-10-21 1994-05-13 Nippon Telegr & Teleph Corp <Ntt> Production of three-dimensional stereoscopic
JPH07212023A (en) * 1994-01-26 1995-08-11 Matsushita Electric Works Ltd Solder ball feeding method and solder ball feeding jig used for the method
US5531942A (en) * 1994-06-16 1996-07-02 Fry's Metals, Inc. Method of making electroconductive adhesive particles for Z-axis application
JP3419554B2 (en) 1994-07-19 2003-06-23 株式会社日立製作所 Semiconductor device manufacturing method and manufacturing apparatus
JP3528264B2 (en) * 1994-08-19 2004-05-17 ソニー株式会社 Solder ball mounting device
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
JP3360435B2 (en) * 1994-10-14 2002-12-24 株式会社日立製作所 Manufacturing method of electronic circuit device
JP2926308B2 (en) * 1995-03-24 1999-07-28 澁谷工業株式会社 Solder ball supply method
JPH08288291A (en) * 1995-04-18 1996-11-01 Citizen Watch Co Ltd Semiconductor device
US5685477A (en) * 1995-06-28 1997-11-11 Intel Corporation Method for attaching and handling conductive spheres to a substrate
JP3214316B2 (en) * 1995-09-29 2001-10-02 松下電器産業株式会社 Apparatus and method for mounting conductive ball and method for forming bump
JPH09213742A (en) * 1996-01-31 1997-08-15 Toshiba Corp Manufacture of semiconductor device and manufacturing equipment
KR100268632B1 (en) * 1996-03-08 2000-10-16 야마구치 다케시 Method and apparatus for forming bump
US5761048A (en) * 1996-04-16 1998-06-02 Lsi Logic Corp. Conductive polymer ball attachment for grid array semiconductor packages
JP3315871B2 (en) * 1996-09-03 2002-08-19 日本特殊陶業株式会社 Wiring board having solder bumps and method of manufacturing the same
DE19645000B4 (en) * 1996-10-30 2005-04-07 A. Raymond & Cie Method for coating the adhesive surfaces of fastening elements with hotmelt adhesives
JP3252748B2 (en) * 1997-04-25 2002-02-04 松下電器産業株式会社 Transfer method of conductive ball
JP2850901B2 (en) * 1997-06-02 1999-01-27 日本電気株式会社 Ball arrangement jig and manufacturing method thereof
JP3376875B2 (en) * 1997-09-08 2003-02-10 松下電器産業株式会社 Apparatus and method for transferring conductive balls
JP2925534B1 (en) * 1998-04-28 1999-07-28 株式会社日鉄マイクロメタル Metal ball arrangement method and arrangement device
JPH11219975A (en) * 1998-01-30 1999-08-10 Kyocera Corp Alignment method of solder ball
US6072233A (en) * 1998-05-04 2000-06-06 Micron Technology, Inc. Stackable ball grid array package
US6595408B1 (en) * 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
FR2785140B1 (en) * 1998-10-27 2007-04-20 Novatec Sa Soc DEVICE FOR PROVIDING BALLS OR PREFORMS FOR THE MANUFACTURE OF BALL CONNECTIONS
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
JP4080635B2 (en) * 1999-05-24 2008-04-23 日立ビアメカニクス株式会社 Method for adsorbing conductive ball in conductive ball mounting device
JP3346345B2 (en) * 1999-07-27 2002-11-18 日本電気株式会社 Fine ball feeder
US6371174B1 (en) * 2001-01-25 2002-04-16 Illinois Tool Works, Inc. Adhesive application system and method of use
JP2003110234A (en) * 2001-09-28 2003-04-11 Hitachi Via Mechanics Ltd Conductive ball mounting apparatus
DE10333152B3 (en) * 2003-07-22 2005-01-20 A. Raymond & Cie Coating adhesion surfaces with a melt adhesive, comprises applying a mixed adhesive in powder form and then pressing to generate heat
JP2005048042A (en) * 2003-07-28 2005-02-24 Nec Corp Section mounting method by adhesion, and structure
US7483114B2 (en) * 2003-10-20 2009-01-27 Lg Display Co., Ltd. Liquid crystal display device, substrate bonding apparatus, and method for fabricating liquid crystal display device using the same
JP4749791B2 (en) * 2005-07-29 2011-08-17 新日鉄マテリアルズ株式会社 Solder ball manufacturing method
DE102006001885B4 (en) * 2006-01-13 2010-03-04 Siemens Ag Detector module of a detector and use of a hot melt adhesive for the production of a detector module
JP4854481B2 (en) * 2006-11-22 2012-01-18 ニスカ株式会社 Adhesive coating method in bookbinding apparatus and bookbinding apparatus
CN101276759B (en) * 2007-03-26 2012-10-10 矽品精密工业股份有限公司 Equipment for soldering and planting ball as well as acquisition apparatus
CN101604641B (en) * 2008-06-13 2013-02-27 涩谷工业株式会社 Carrying method and carrying device of conductive ball
SG157985A1 (en) * 2008-06-24 2010-01-29 Rokko Ventures Pte Ltd Method and apparatus for solder ball placement
JP2010021445A (en) * 2008-07-11 2010-01-28 Nippon Steel Materials Co Ltd Micro-ball removal method and removal device, and micro-ball batch mounting method and batch mounting device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103863837A (en) * 2013-11-29 2014-06-18 山东汉菱电气有限公司 Staggered reciprocating discharge device and gasifier with staggered reciprocating discharge device
EP3217024A1 (en) * 2016-03-08 2017-09-13 Profil Verbindungstechnik GmbH & Co. KG Function element

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BR112012028237A2 (en) 2017-08-01
SI2567104T1 (en) 2017-06-30
US20130112351A1 (en) 2013-05-09
ES2614462T3 (en) 2017-05-31
WO2011161514A3 (en) 2012-03-15
WO2011138674A3 (en) 2012-03-22
JP2013537488A (en) 2013-10-03
JP2016026120A (en) 2016-02-12
WO2011138684A3 (en) 2012-03-22
CN103080568B (en) 2015-05-20
US20130133817A1 (en) 2013-05-30
US20130200096A1 (en) 2013-08-08
CN103069177A (en) 2013-04-24
EP2567103A2 (en) 2013-03-13
ES2617302T3 (en) 2017-06-16
EP2567103B1 (en) 2016-11-30
EP2567105A2 (en) 2013-03-13
US9284134B2 (en) 2016-03-15
WO2011138684A2 (en) 2011-11-10
EP2567105B1 (en) 2016-11-30
PL2567105T3 (en) 2017-07-31
WO2011161514A2 (en) 2011-12-29
SI2567105T1 (en) 2017-06-30
JP5908893B2 (en) 2016-04-26
CN103080568A (en) 2013-05-01
US9592971B2 (en) 2017-03-14
PL2567104T3 (en) 2017-08-31
SI2567103T1 (en) 2017-07-31
BR112012028236A2 (en) 2017-03-14
WO2011138684A4 (en) 2012-07-12
US9266689B2 (en) 2016-02-23
EP2567104A2 (en) 2013-03-13
JP6130461B2 (en) 2017-05-17
PL2567103T3 (en) 2017-07-31
EP2567104B1 (en) 2016-11-09
CN103069177B (en) 2015-09-16
CN103069176A (en) 2013-04-24
JP5997136B2 (en) 2016-09-28
ES2616919T3 (en) 2017-06-14
CN103069176B (en) 2015-09-30
JP2013535092A (en) 2013-09-09

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