SG73498A1 - Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus - Google Patents

Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus

Info

Publication number
SG73498A1
SG73498A1 SG1998000242A SG1998000242A SG73498A1 SG 73498 A1 SG73498 A1 SG 73498A1 SG 1998000242 A SG1998000242 A SG 1998000242A SG 1998000242 A SG1998000242 A SG 1998000242A SG 73498 A1 SG73498 A1 SG 73498A1
Authority
SG
Singapore
Prior art keywords
wafer
fabrication
semiconductor
processing apparatus
semiconductor substrate
Prior art date
Application number
SG1998000242A
Other languages
English (en)
Inventor
Kazutaka Yanagita
Kiyofumi Sakaguchi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9021796A external-priority patent/JPH10223585A/ja
Priority claimed from JP9030887A external-priority patent/JPH10229066A/ja
Application filed by Canon Kk filed Critical Canon Kk
Publication of SG73498A1 publication Critical patent/SG73498A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG1998000242A 1997-02-04 1998-02-04 Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus SG73498A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9021796A JPH10223585A (ja) 1997-02-04 1997-02-04 ウェハ処理装置及びその方法並びにｓｏｉウェハの製造方法
JP9030887A JPH10229066A (ja) 1997-02-14 1997-02-14 ウェハ処理装置及びその方法、ウェハ搬送ロボット、半導体基体の製造方法並びに半導体製造装置

Publications (1)

Publication Number Publication Date
SG73498A1 true SG73498A1 (en) 2000-06-20

Family

ID=26358901

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1998000242A SG73498A1 (en) 1997-02-04 1998-02-04 Wafer processing apparatus and method wafer convey robot semiconductor substrate fabrication method and semiconductor fabrication apparatus

Country Status (8)

Country Link
US (2) US6391067B2 (zh)
EP (1) EP0856874A3 (zh)
KR (2) KR100382325B1 (zh)
CN (2) CN1104040C (zh)
AU (1) AU714715B2 (zh)
CA (1) CA2228552C (zh)
SG (1) SG73498A1 (zh)
TW (1) TW394984B (zh)

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US6085764A (en) 1997-07-22 2000-07-11 Tdk Corporation Cleaning apparatus and method
US7091132B2 (en) * 2003-07-24 2006-08-15 Applied Materials, Inc. Ultrasonic assisted etch using corrosive liquids
TW200714379A (en) * 2005-06-30 2007-04-16 Fico Bv Method and device for cleaning electronic components processed with a laser beam
JP4705517B2 (ja) * 2006-05-19 2011-06-22 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、プログラム、および記録媒体
JP4762822B2 (ja) * 2006-08-03 2011-08-31 東京エレクトロン株式会社 薬液混合方法および薬液混合装置
JP4934079B2 (ja) * 2008-02-28 2012-05-16 信越半導体株式会社 超音波洗浄装置及び超音波洗浄方法
TWI340677B (en) * 2008-06-06 2011-04-21 Ind Tech Res Inst Scrap removal method and apparatus
JP5728196B2 (ja) * 2010-01-21 2015-06-03 シスメックス株式会社 試料調製装置および試料調製方法
CN102487027B (zh) * 2010-12-06 2014-02-26 中芯国际集成电路制造(上海)有限公司 确定湿法刻蚀工艺窗口的方法
CN103046097B (zh) * 2012-12-31 2016-08-03 上海新阳半导体材料股份有限公司 晶圆处理装置
WO2014123287A1 (ko) * 2013-02-07 2014-08-14 주식회사 엘지실트론 웨이퍼 수납용 카세트 및 웨이퍼 세정 장치
JP2015185632A (ja) * 2014-03-24 2015-10-22 株式会社荏原製作所 基板処理装置
CN105161413B (zh) * 2015-09-21 2018-07-17 京东方科技集团股份有限公司 加工多晶硅表面的方法以及加工基板表面的方法
JP6985957B2 (ja) 2018-02-21 2021-12-22 キオクシア株式会社 半導体処理装置
CN110911302A (zh) * 2018-09-14 2020-03-24 胜高股份有限公司 晶片清洗装置及清洗方法
CN111097917B (zh) 2018-10-26 2022-11-08 松下知识产权经营株式会社 金属微粒的制作方法及金属微粒的制作装置
CN110053969B (zh) * 2019-04-23 2020-04-07 浙江金麦特自动化系统有限公司 一种机器人自动搬运清洗系统及方法
CN110739247A (zh) * 2019-09-19 2020-01-31 上海提牛机电设备有限公司 一种晶圆蚀刻槽
CN110634779A (zh) * 2019-09-19 2019-12-31 上海提牛机电设备有限公司 一种晶圆抓片机构
CN117038530B (zh) * 2023-10-07 2024-01-16 东莞市楷德精密机械有限公司 一种半导体清洗设备的智能控制方法及系统

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Also Published As

Publication number Publication date
KR19980071053A (ko) 1998-10-26
CN1420524A (zh) 2003-05-28
AU5290098A (en) 1998-08-06
CA2228552A1 (en) 1998-08-04
TW394984B (en) 2000-06-21
US20020013065A1 (en) 2002-01-31
US6391067B2 (en) 2002-05-21
US20020002767A1 (en) 2002-01-10
KR100382325B1 (ko) 2003-08-19
EP0856874A3 (en) 2001-11-28
AU714715B2 (en) 2000-01-06
KR100355919B1 (ko) 2002-10-11
CA2228552C (en) 2003-06-24
CN1104040C (zh) 2003-03-26
CN1192580A (zh) 1998-09-09
EP0856874A2 (en) 1998-08-05

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