SG30191G - Process for the preparation of a protection layer or a relief pattern - Google Patents

Process for the preparation of a protection layer or a relief pattern

Info

Publication number
SG30191G
SG30191G SG301/91A SG30191A SG30191G SG 30191 G SG30191 G SG 30191G SG 301/91 A SG301/91 A SG 301/91A SG 30191 A SG30191 A SG 30191A SG 30191 G SG30191 G SG 30191G
Authority
SG
Singapore
Prior art keywords
preparation
protection layer
radiation
relief pattern
substrate
Prior art date
Application number
SG301/91A
Other languages
English (en)
Original Assignee
Ciba Geigy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=4191510&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG30191(G) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ciba Geigy filed Critical Ciba Geigy
Publication of SG30191G publication Critical patent/SG30191G/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Epoxy Resins (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Materials For Photolithography (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
SG301/91A 1984-02-10 1991-04-26 Process for the preparation of a protection layer or a relief pattern SG30191G (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH63184 1984-02-10

Publications (1)

Publication Number Publication Date
SG30191G true SG30191G (en) 1991-09-13

Family

ID=4191510

Family Applications (1)

Application Number Title Priority Date Filing Date
SG301/91A SG30191G (en) 1984-02-10 1991-04-26 Process for the preparation of a protection layer or a relief pattern

Country Status (12)

Country Link
US (1) US4624912A (ko)
EP (1) EP0153904B1 (ko)
JP (1) JPS60186838A (ko)
KR (1) KR910008710B1 (ko)
AT (1) ATE37242T1 (ko)
AU (1) AU575118B2 (ko)
BR (1) BR8500576A (ko)
CA (1) CA1287769C (ko)
DE (1) DE3565013D1 (ko)
HK (1) HK34591A (ko)
SG (1) SG30191G (ko)
ZA (1) ZA85972B (ko)

Families Citing this family (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0152377B1 (de) * 1984-02-10 1987-12-09 Ciba-Geigy Ag Härtbare Zusammensetzung und deren Verwendung
US5082952A (en) * 1985-06-06 1992-01-21 Ciba-Geigy Corporation Process for the preparation of metallocene complexes
US4786569A (en) * 1985-09-04 1988-11-22 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
US5300380A (en) * 1986-08-06 1994-04-05 Ciba-Geigy Corporation Process for the production of relief structures using a negative photoresist based on polyphenols and epoxy compounds or vinyl ethers
EP0255989B1 (de) * 1986-08-06 1990-11-22 Ciba-Geigy Ag Negativ-Photoresist auf Basis von Polyphenolen und Epoxidverbindungen oder Vinylethern
DE3888400D1 (de) * 1987-06-12 1994-04-21 Ciba Geigy Photoresistzusammensetzungen.
US4994346A (en) * 1987-07-28 1991-02-19 Ciba-Geigy Corporation Negative photoresist based on polyphenols and selected epoxy or vinyl ether compounds
US4963300A (en) * 1987-12-15 1990-10-16 Ciba-Geigy Corporation Process for the preparation of laminates
US4920182A (en) * 1987-12-18 1990-04-24 Ciba-Geigy Corporation Epoxy resin compositions containing polyester flexibilizer and metallocene complex initiator
US5215860A (en) * 1988-08-19 1993-06-01 Minnesota Mining And Manufacturing Company Energy-curable cyanate compositions
US5122440A (en) * 1988-09-06 1992-06-16 Chien Chung Ping Ultraviolet curing of photosensitive polyimides
US5070002A (en) * 1988-09-13 1991-12-03 Amp-Akzo Corporation Photoimageable permanent resist
US5178988A (en) * 1988-09-13 1993-01-12 Amp-Akzo Corporation Photoimageable permanent resist
US5747223A (en) * 1988-12-30 1998-05-05 International Business Machines Corporation Composition for photoimaging
US6180317B1 (en) 1988-12-30 2001-01-30 International Business Machines Corporation Composition for photoimaging
US5439766A (en) * 1988-12-30 1995-08-08 International Business Machines Corporation Composition for photo imaging
US5026624A (en) * 1989-03-03 1991-06-25 International Business Machines Corporation Composition for photo imaging
US5264325A (en) * 1988-12-30 1993-11-23 International Business Machines Corporation Composition for photo imaging
US5304457A (en) * 1989-03-03 1994-04-19 International Business Machines Corporation Composition for photo imaging
US5278010A (en) * 1989-03-03 1994-01-11 International Business Machines Corporation Composition for photo imaging
US5041358A (en) * 1989-04-17 1991-08-20 International Business Machines Corporation Negative photoresist and use thereof
WO1991001223A1 (en) * 1989-07-14 1991-02-07 Dai Nippon Insatsu Kabushiki Kaisha Thermal transfer cover film
US5484502A (en) * 1990-08-03 1996-01-16 Ford Motor Company UV-hard coat transfer
JPH0494937A (ja) * 1990-08-13 1992-03-27 Konica Corp 熱転写による印刷版の形成方法
US5089374A (en) * 1990-08-20 1992-02-18 Eastman Kodak Company Novel bis-onium salts and the use thereof as photoinitiators
JPH04279341A (ja) * 1990-11-30 1992-10-05 Somar Corp 紫外線硬化樹脂フィルム
JP2768390B2 (ja) * 1990-12-11 1998-06-25 インターナショナル・ビジネス・マシーンズ・コーポレイション 無電解金属付着のために基体をコンディショニングする方法
US6165697A (en) 1991-11-15 2000-12-26 Shipley Company, L.L.C. Antihalation compositions
US5384229A (en) 1992-05-07 1995-01-24 Shipley Company Inc. Photoimageable compositions for electrodeposition
US5391458A (en) * 1992-12-18 1995-02-21 Morton International, Inc. Photoresist processing for improved resolution having a bake step to remove the tackiness of the laminated photosensitive layer prior to contact imagewise exposure
US5439779A (en) * 1993-02-22 1995-08-08 International Business Machines Corporation Aqueous soldermask
ES2147777T3 (es) * 1993-09-16 2000-10-01 Ciba Sc Holding Ag Compuestos vinileter con grupos funcionales adicionales, distintos de vinileter, y su utilizacion en la formulacion de compuestos reticulables.
TW418215B (en) 1995-03-13 2001-01-11 Ciba Sc Holding Ag A process for the production of three-dimensional articles in a stereolithography bath comprising the step of sequentially irradiating a plurality of layers of a liquid radiation-curable composition
WO1996041237A1 (en) * 1995-06-07 1996-12-19 E.I. Du Pont De Nemours And Company Sensitizers and photoacid precursors
US5707780A (en) * 1995-06-07 1998-01-13 E. I. Du Pont De Nemours And Company Photohardenable epoxy composition
US5879856A (en) 1995-12-05 1999-03-09 Shipley Company, L.L.C. Chemically amplified positive photoresists
ATE191090T1 (de) * 1996-07-29 2000-04-15 Ciba Sc Holding Ag Flüssige, strahlungshärtbare zusammensetzung, insbesondere für die stereolithographie
EP0927726B1 (en) * 1996-09-19 2004-11-10 Nippon Soda Co., Ltd. Photocatalytic composition
US7147983B1 (en) 1996-10-07 2006-12-12 Shipley Company, L.L.C. Dyed photoresists and methods and articles of manufacture comprising same
ATE234674T1 (de) * 1996-11-14 2003-04-15 Affymetrix Inc Chemische amplifizierung zur synthese von musterordnungen
JPH10236483A (ja) * 1997-02-20 1998-09-08 Toyo Seikan Kaisha Ltd 包装容器
US6027858A (en) * 1997-06-06 2000-02-22 International Business Machines Corporation Process for tenting PTH's with PID dry film
US6100007A (en) 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
US6528218B1 (en) 1998-12-15 2003-03-04 International Business Machines Corporation Method of fabricating circuitized structures
US6824879B2 (en) 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
US6268457B1 (en) 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
KR100804873B1 (ko) 1999-06-10 2008-02-20 얼라이드시그날 인코퍼레이티드 포토리소그래피용 ｓｏｇ 반사방지 코팅
EP1741552A1 (en) * 2000-09-01 2007-01-10 Digiglass Pty Ltd. Image carrying laminated material
US7261992B2 (en) 2000-12-21 2007-08-28 International Business Machines Corporation Fluorinated silsesquioxane polymers and use thereof in lithographic photoresist compositions
JP4381143B2 (ja) 2001-11-15 2009-12-09 ハネウェル・インターナショナル・インコーポレーテッド フォトリソグラフィー用スピンオン反射防止膜
CN100576069C (zh) 2002-05-03 2009-12-30 Dsm;Ip财产有限公司 可辐射固化树脂组合物及利用该组合物的快速成型方法
GB0212977D0 (en) 2002-06-06 2002-07-17 Vantico Ag Actinic radiation curable compositions and their use
US6989225B2 (en) 2002-07-18 2006-01-24 3D Systems, Inc. Stereolithographic resins with high temperature and high impact resistance
TW200505966A (en) * 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
US6982022B2 (en) * 2003-05-21 2006-01-03 Xerox Corporation Formation of photopatterned ink jet nozzle plates by transfer methods
EP1646493B1 (en) 2003-07-23 2011-11-16 DSM IP Assets B.V. Viscosity reducible radiation curable resin composition
US7138550B2 (en) * 2003-08-04 2006-11-21 Air Products And Chemicals, Inc. Bridged carbocyclic compounds and methods of making and using same
JP4093938B2 (ja) * 2003-08-26 2008-06-04 松下電器産業株式会社 光情報記録媒体の原盤製造方法、パターン形成方法およびレジスト
US8053159B2 (en) 2003-11-18 2011-11-08 Honeywell International Inc. Antireflective coatings for via fill and photolithography applications and methods of preparation thereof
US20050260522A1 (en) * 2004-02-13 2005-11-24 William Weber Permanent resist composition, cured product thereof, and use thereof
JP4162619B2 (ja) * 2004-03-17 2008-10-08 株式会社リコー 熱転写記録媒体、熱転写記録方法及び記録体
EP1729175B1 (en) * 2004-03-26 2013-03-27 Tokyo Ohka Kogyo Co., Ltd. Photosensitive resin composition and method of forming pattern with the composition
US7449280B2 (en) * 2004-05-26 2008-11-11 Microchem Corp. Photoimageable coating composition and composite article thereof
TWI294258B (en) 2004-08-03 2008-03-01 Rohm & Haas Elect Mat Methods of forming devices having optical functionality
US7175944B2 (en) * 2004-08-31 2007-02-13 Micron Technology, Inc. Prevention of photoresist scumming
EP1674903B1 (en) 2004-12-22 2008-12-03 Rohm and Haas Electronic Materials, L.L.C. Optical dry-films and methods of forming optical devices with dry-films
EP1674904B1 (en) 2004-12-22 2008-12-03 Rohm and Haas Electronic Materials, L.L.C. Optical dry-films and methods of forming optical devices with dry-films
EP1674905B1 (en) 2004-12-22 2008-10-15 Rohm and Haas Electronic Materials, L.L.C. Methods of forming optical devices having polymeric layers
US20070299176A1 (en) * 2005-01-28 2007-12-27 Markley Thomas J Photodefinable low dielectric constant material and method for making and using same
US8287611B2 (en) 2005-01-28 2012-10-16 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for making same
US7591865B2 (en) 2005-01-28 2009-09-22 Saint-Gobain Abrasives, Inc. Method of forming structured abrasive article
US20060172230A1 (en) * 2005-02-02 2006-08-03 Dsm Ip Assets B.V. Method and composition for reducing waste in photo-imaging applications
US7867779B2 (en) 2005-02-03 2011-01-11 Air Products And Chemicals, Inc. System and method comprising same for measurement and/or analysis of particles in gas stream
EP1691238A3 (en) 2005-02-05 2009-01-21 Rohm and Haas Electronic Materials, L.L.C. Coating compositions for use with an overcoated photoresist
SE529306C2 (sv) 2005-03-18 2007-06-26 Perstorp Specialty Chem Ab Ultravioletthärdande hartskomposition
JP2006313834A (ja) * 2005-05-09 2006-11-16 Nitto Denko Corp 配線回路基板の製造方法
US20060257785A1 (en) * 2005-05-13 2006-11-16 Johnson Donald W Method of forming a photoresist element
US8871335B2 (en) 2005-08-31 2014-10-28 Kuraray America Inc. Solar control laminate
US20070172637A1 (en) * 2005-12-30 2007-07-26 Hayes Richard A Decorative sheets having enhanced adhesion and penetration resistant laminates prepared therefrom
US7625627B2 (en) 2005-12-30 2009-12-01 E.I. Du Pont De Nemours And Company Decorative polyvinyl butyral solar control laminates
US20070196630A1 (en) * 2005-12-30 2007-08-23 Hayes Richard A Decorative solar control laminates
US20070172636A1 (en) * 2005-12-30 2007-07-26 Smith Rebecca L Decorative sheets having enhanced adhesion and laminates prepared therefrom
US8435098B2 (en) 2006-01-27 2013-05-07 Saint-Gobain Abrasives, Inc. Abrasive article with cured backsize layer
US20070178404A1 (en) * 2006-01-30 2007-08-02 International Business Machines Corporation Methods of preventing defects in antireflective coatings
EP1829942B1 (en) 2006-02-28 2012-09-26 Rohm and Haas Electronic Materials, L.L.C. Coating compositions for use with an overcoated photoresist
US7667339B2 (en) * 2006-03-13 2010-02-23 Cheil Industries, Inc. Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
US8288266B2 (en) * 2006-08-08 2012-10-16 Endicott Interconnect Technologies, Inc. Circuitized substrate assembly
US20080103226A1 (en) 2006-10-31 2008-05-01 Dsm Ip Assets B.V. Photo-curable resin composition
DE102006057142A1 (de) * 2006-12-01 2008-06-05 Henkel Kgaa Metallverbindungen als Initiatoren
CA2672243C (en) 2006-12-21 2012-04-03 Saint-Gobain Abrasives, Inc. Low corrosion abrasive articles and methods for forming same
JP2008166798A (ja) 2006-12-31 2008-07-17 Rohm & Haas Electronic Materials Llc 光学的機能を有するプリント回路板の形成方法
US20080264672A1 (en) * 2007-04-26 2008-10-30 Air Products And Chemicals, Inc. Photoimprintable Low Dielectric Constant Material and Method for Making and Using Same
EP2071400A1 (en) 2007-11-12 2009-06-17 Rohm and Haas Electronic Materials LLC Coating compositions for use with an overcoated photoresist
US7951525B2 (en) * 2008-09-08 2011-05-31 International Business Machines Corporation Low outgassing photoresist compositions
US20100190881A1 (en) 2009-01-28 2010-07-29 3D Systems, Incorporated Radiation Curable Compositions Useful in Solid Freeform Fabrication Systems
EP2216683B1 (en) 2009-02-08 2018-11-14 Rohm and Haas Electronic Materials, L.L.C. Substrates coated with an antireflective composition and a photoresist
EP2216684B1 (en) 2009-02-08 2015-10-07 Rohm and Haas Electronic Materials LLC Method of forming a photoresist image comprising an undercoat layer
US20100203450A1 (en) 2009-02-11 2010-08-12 International Business Machines Corporation Photoresist compositions and methods of use
KR101714798B1 (ko) 2009-03-13 2017-03-09 디에스엠 아이피 어셋츠 비.브이. 방사선-경화성 수지 조성물 및 이를 이용한 쾌속 3차원 이미지화 방법
US8557877B2 (en) 2009-06-10 2013-10-15 Honeywell International Inc. Anti-reflective coatings for optically transparent substrates
WO2011075555A1 (en) 2009-12-17 2011-06-23 Dsm Ip Assets, B.V. Led curable liquid resin compositions for additive fabrication
JP5851688B2 (ja) 2009-12-31 2016-02-03 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 感光性組成物
JP5866686B2 (ja) 2010-01-22 2016-02-17 ディーエスエム アイピー アセッツ ビー．ブイ． 選択的視覚効果を有して層状に硬化可能な液状放射線硬化性樹脂およびその使用方法
JP5782283B2 (ja) 2010-03-31 2015-09-24 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 新規のポリマーおよびフォトレジスト組成物
US20110300367A1 (en) 2010-06-07 2011-12-08 Ching-Kee Chien Optical Fiber With Photoacid Coating
EP2502728B1 (en) 2011-03-23 2017-01-04 DSM IP Assets B.V. Lightweight and high strength three-dimensional articles producible by additive fabrication processes
US8864898B2 (en) 2011-05-31 2014-10-21 Honeywell International Inc. Coating formulations for optical elements
US9011591B2 (en) 2011-09-21 2015-04-21 Dow Global Technologies Llc Compositions and antireflective coatings for photolithography
US8871425B2 (en) 2012-02-09 2014-10-28 Az Electronic Materials (Luxembourg) S.A.R.L. Low dielectric photoimageable compositions and electronic devices made therefrom
US9322986B2 (en) 2013-06-24 2016-04-26 Corning Incorporated Optical fiber coating for short data network
US9063420B2 (en) 2013-07-16 2015-06-23 Rohm And Haas Electronic Materials Llc Photoresist composition, coated substrate, and method of forming electronic device
US8933239B1 (en) 2013-07-16 2015-01-13 Dow Global Technologies Llc Bis(aryl)acetal compounds
US9410016B2 (en) 2013-07-16 2016-08-09 Dow Global Technologies Llc Aromatic polyacetals and articles comprising them
US8962779B2 (en) 2013-07-16 2015-02-24 Dow Global Technologies Llc Method of forming polyaryl polymers
US9229319B2 (en) 2013-12-19 2016-01-05 Rohm And Haas Electronic Materials Llc Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device
US9581901B2 (en) 2013-12-19 2017-02-28 Rohm And Haas Electronic Materials Llc Photoacid-generating copolymer and associated photoresist composition, coated substrate, and method of forming an electronic device
US9182669B2 (en) 2013-12-19 2015-11-10 Rohm And Haas Electronic Materials Llc Copolymer with acid-labile group, photoresist composition, coated substrate, and method of forming an electronic device
US10345700B2 (en) 2014-09-08 2019-07-09 International Business Machines Corporation Negative-tone resist compositions and multifunctional polymers therein
EP3194502A4 (en) 2015-04-13 2018-05-16 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
US9957339B2 (en) 2015-08-07 2018-05-01 Rohm And Haas Electronic Materials Llc Copolymer and associated layered article, and device-forming method
US9815930B2 (en) 2015-08-07 2017-11-14 Rohm And Haas Electronic Materials Llc Block copolymer and associated photoresist composition and method of forming an electronic device
US9758610B2 (en) 2015-12-18 2017-09-12 Dow Global Technologies Llc Acid-labile hyperbranched copolymer and associated photoresist composition and method of forming an electronic device
US11613519B2 (en) 2016-02-29 2023-03-28 Rohm And Haas Electronic Materials Llc Photoacid-generating monomer, polymer derived therefrom, photoresist composition including the polymer, and method of forming a photoresist relief image using the photoresist composition
US20190153226A1 (en) 2016-04-08 2019-05-23 Solvay Specialty Polymers Usa, Llc Photocurable polymers, photocurable polymer compositions and lithographic processes including the same
WO2018119833A1 (en) * 2016-12-29 2018-07-05 Henkel Ag & Co. Kgaa Cationically curable sealant composition
ES2685280B2 (es) 2017-03-31 2019-06-21 Centro Tecnologico De Nanomateriales Avanzados S L Composición de resina curable por radiación y procedimiento para su obtención
EP4172236A1 (en) * 2020-06-10 2023-05-03 Inkbit, LLC Materials for photoinitiated cationic ring-opening polymerization and uses thereof

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3526504A (en) * 1966-07-07 1970-09-01 Du Pont Photocrosslinkable elements and processes
US4035189A (en) * 1972-02-25 1977-07-12 Hitachi Chemical Company, Ltd. Image forming curable resin compositions
US4058401A (en) * 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
GB1516352A (en) * 1974-05-02 1978-07-05 Gen Electric Halonium salts
US4026705A (en) * 1975-05-02 1977-05-31 General Electric Company Photocurable compositions and methods
AU517415B2 (en) * 1976-07-09 1981-07-30 General Electric Company Curable polymer composition
GB1587536A (en) * 1977-07-05 1981-04-08 Ciba Geigy Ag Expoxide resin-impregnated composites
US4388137A (en) * 1978-12-07 1983-06-14 Mobil Oil Corporation Process for transfer coating with radiation-curable compositions
US4250053A (en) * 1979-05-21 1981-02-10 Minnesota Mining And Manufacturing Company Sensitized aromatic iodonium or aromatic sulfonium salt photoinitiator systems
US4299938A (en) * 1979-06-19 1981-11-10 Ciba-Geigy Corporation Photopolymerizable and thermally polymerizable compositions
JPS56155789A (en) * 1980-05-06 1981-12-02 Nissha Printing Co Ltd Transferring material and transferring method
US4383025A (en) * 1980-07-10 1983-05-10 Ciba-Geigy Corporation Photopolymerization by means of sulfoxonium salts
US4398014A (en) * 1980-11-04 1983-08-09 Ciba-Geigy Corporation Sulfoxonium salts and their use as polymerization catalysts
JPS5818288A (ja) * 1981-07-28 1983-02-02 Dainippon Printing Co Ltd 繊維強化プラスチツクの化粧法
DE3134123A1 (de) * 1981-08-28 1983-03-17 Hoechst Ag, 6000 Frankfurt Durch strahlung polymerisierbares gemisch und daraushergestelltes photopolymerisierbares kopiermaterial
EP0094915B1 (de) * 1982-05-19 1987-01-21 Ciba-Geigy Ag Härtbare, Metallocenkomplexe enthaltende Zusammensetzungen, daraus erhältliche aktivierte Vorstufen und deren Verwendung
EP0094914B1 (de) * 1982-05-19 1986-09-24 Ciba-Geigy Ag Photopolymerisation mittels organometallischer Salze
DE3231145A1 (de) * 1982-08-21 1984-02-23 Basf Ag, 6700 Ludwigshafen Negativ arbeitendes verfahren zur herstellung von reliefbildern oder resistmustern
US4482679A (en) * 1982-09-18 1984-11-13 Ciba-Geigy Corporation Heat-curable epoxy compositions containing diaryliodosyl salts
GB2137626B (en) * 1983-03-31 1986-10-15 Sericol Group Ltd Water based photopolymerisable compositions and their use
GB8312879D0 (en) * 1983-05-11 1983-06-15 Ciba Geigy Ag Production of images

Also Published As

Publication number Publication date
CA1287769C (en) 1991-08-20
EP0153904A3 (en) 1987-03-25
DE3565013D1 (en) 1988-10-20
JPS60186838A (ja) 1985-09-24
ATE37242T1 (de) 1988-09-15
EP0153904B1 (de) 1988-09-14
AU3855085A (en) 1985-08-15
EP0153904A2 (de) 1985-09-04
BR8500576A (pt) 1985-09-24
HK34591A (en) 1991-05-10
AU575118B2 (en) 1988-07-21
ZA85972B (en) 1985-11-27
KR850005911A (ko) 1985-09-26
KR910008710B1 (ko) 1991-10-19
US4624912A (en) 1986-11-25

Similar Documents

Publication Publication Date Title
DE3565013D1 (en) Process for the preparation of a protection layer or a relief pattern
CA2140872A1 (en) A Flexographic Printing Element Having an IR Ablatable Layer and Process for Making a Flexographic Printing Plate
ES437454A1 (es) Un procedimiento para tratar un sustrato.
JPS6435433A (en) Radiation sensitive mixture for photosensitive layer forming material
CA1258653A (en) PYRIDINIUM YLIDE POLYMERS AND PRODUCTS DERIVED THEREOF
ES8404702A1 (es) Un procedimiento para la formacion de una imagen sobre un substrato.
KR910009126A (ko) 금속 패턴(pattern)의 제조방법
ES8503197A1 (es) Procedimiento para la creacion de imagenes
JPS6433543A (en) Pattern forming method
EP0152114A3 (en) Method for making a dry planographic printing plate
JPS5339075A (en) Step and repeat exposure method of masks
JPS5532088A (en) Photo mask forming method
US4610941A (en) Method for photographically improving the resolution of screen printed photopolymer images
ATE178997T1 (de) Behandlung eines photoresists zwecks verbesserter auflösung
JPS5492061A (en) Micropattern forming method
GB1293722A (en) Photoresist process
ES469410A2 (es) Mejoras introducidas en el objeto de la patente principal no452.982, concedida el 4 de noviembre de 1.977 por: Ÿun pro- cedimiento de preparacion de un relieve impresoŸ
JPS57183030A (en) Manufacture of semiconductor device
JPS56116625A (en) Exposure of fine pattern
SE7909024L (sv) Beleggningskomposition
ES8105201A1 (es) Procedimiento para la obtencion de una placa de impresion litografica
JPS54141573A (en) Mask for exposure
JPS55111288A (en) Pressure sensitive reprinting paper
JPS56140342A (en) Image forming composition and formation of resist image
JPS5492527A (en) Manufacture of metal foil having apertures