ATE178997T1 - Behandlung eines photoresists zwecks verbesserter auflösung - Google Patents
Behandlung eines photoresists zwecks verbesserter auflösungInfo
- Publication number
- ATE178997T1 ATE178997T1 AT94308449T AT94308449T ATE178997T1 AT E178997 T1 ATE178997 T1 AT E178997T1 AT 94308449 T AT94308449 T AT 94308449T AT 94308449 T AT94308449 T AT 94308449T AT E178997 T1 ATE178997 T1 AT E178997T1
- Authority
- AT
- Austria
- Prior art keywords
- photoresist layer
- tacky
- sheet
- support sheet
- circuit board
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Silver Salt Photography Or Processing Solution Therefor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/992,934 US5391458A (en) | 1992-12-18 | 1992-12-18 | Photoresist processing for improved resolution having a bake step to remove the tackiness of the laminated photosensitive layer prior to contact imagewise exposure |
EP94308449A EP0713146B1 (de) | 1992-12-18 | 1994-11-16 | Behandlung eines Photoresists zwecks verbesserter Auflösung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE178997T1 true ATE178997T1 (de) | 1999-04-15 |
Family
ID=26137386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT94308449T ATE178997T1 (de) | 1992-12-18 | 1994-11-16 | Behandlung eines photoresists zwecks verbesserter auflösung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5391458A (de) |
EP (1) | EP0713146B1 (de) |
AT (1) | ATE178997T1 (de) |
DE (1) | DE69417901T2 (de) |
ES (1) | ES2132349T3 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5714079A (en) * | 1995-06-12 | 1998-02-03 | Eastman Kodak Company | Method for making a thin gauge metallic article with electrical insulation on one side |
JPH09171953A (ja) * | 1995-12-20 | 1997-06-30 | Sony Corp | 基板加熱装置、基板加熱方法および半導体集積回路装置、フォトマスクならびに液晶表示装置 |
US5993945A (en) * | 1996-05-30 | 1999-11-30 | International Business Machines Corporation | Process for high resolution photoimageable dielectric |
US6022670A (en) * | 1997-05-08 | 2000-02-08 | International Business Machines Corporation | Process for high resolution photoimageable dielectric |
US6027858A (en) * | 1997-06-06 | 2000-02-22 | International Business Machines Corporation | Process for tenting PTH's with PID dry film |
TWI306955B (en) * | 2006-03-09 | 2009-03-01 | Au Optronics Corp | Method for fabricating color filters |
JP2011003692A (ja) * | 2009-06-18 | 2011-01-06 | Oki Semiconductor Co Ltd | ウェハの裏面エッチング方法 |
JP5718342B2 (ja) * | 2009-10-16 | 2015-05-13 | エンパイア テクノロジー ディベロップメント エルエルシー | 半導体ウェーハにフィルムを付加する装置および方法ならびに半導体ウェーハを処理する方法 |
CN109426070A (zh) * | 2017-08-25 | 2019-03-05 | 京东方科技集团股份有限公司 | 光刻胶组合物、金属图案以及阵列基板的制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4530896A (en) * | 1970-03-03 | 1985-07-23 | Shipley Company Inc. | Photosensitive laminate |
US3703373A (en) * | 1970-06-15 | 1972-11-21 | Eastman Kodak Co | Processes and elements for preparation of photomechanical images |
US3953309A (en) * | 1972-12-14 | 1976-04-27 | Dynachem Corporation | Polymerization compositions and processes having polymeric binding agents |
US4241165A (en) * | 1978-09-05 | 1980-12-23 | Motorola, Inc. | Plasma development process for photoresist |
DE3131448A1 (de) * | 1981-08-07 | 1983-02-24 | Basf Ag, 6700 Ludwigshafen | Fuer die herstellung von photoresistschichten geeignete photopolymerisierbare aufzeichnungsmasse |
DE3236560A1 (de) * | 1982-10-02 | 1984-04-05 | Hoechst Ag, 6230 Frankfurt | Lichtempfindliches schichtuebertragungsmaterial und verfahren zur herstellung einer photoresistschablone |
US4897337A (en) * | 1983-01-19 | 1990-01-30 | Tokyo Shibaura Denki Kabushiki Kaisha | Method and apparatus for forming resist pattern |
DE3565013D1 (en) * | 1984-02-10 | 1988-10-20 | Ciba Geigy Ag | Process for the preparation of a protection layer or a relief pattern |
DE3447357A1 (de) * | 1984-12-24 | 1986-07-03 | Basf Ag, 6700 Ludwigshafen | Trockenfilmresist und verfahren zur herstellung von resistmustern |
US4780392A (en) * | 1985-08-02 | 1988-10-25 | Hoechst Celanese Corporation | Radiation-polymerizable composition and element containing a photopolymerizable acrylic monomer |
US4725254A (en) * | 1986-11-24 | 1988-02-16 | Allied Corporation | Method for manufacturing a center electrode for a spark plug |
JP2750431B2 (ja) * | 1987-12-16 | 1998-05-13 | 日本合成化学工業株式会社 | 画像形成方法 |
US4889790A (en) * | 1988-02-26 | 1989-12-26 | Morton Thiokol, Inc. | Method of forming a conformable mask on a printed circuit board |
US4945032A (en) * | 1988-03-31 | 1990-07-31 | Desoto, Inc. | Stereolithography using repeated exposures to increase strength and reduce distortion |
JPH0820733B2 (ja) * | 1988-08-11 | 1996-03-04 | 富士写真フイルム株式会社 | ドライフイルムレジスト用光重合性組成物 |
JP2901686B2 (ja) * | 1990-02-28 | 1999-06-07 | 株式会社きもと | 画像形成材料及び画像形成方法 |
-
1992
- 1992-12-18 US US07/992,934 patent/US5391458A/en not_active Expired - Fee Related
-
1994
- 1994-11-16 ES ES94308449T patent/ES2132349T3/es not_active Expired - Lifetime
- 1994-11-16 EP EP94308449A patent/EP0713146B1/de not_active Expired - Lifetime
- 1994-11-16 DE DE69417901T patent/DE69417901T2/de not_active Expired - Fee Related
- 1994-11-16 AT AT94308449T patent/ATE178997T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0713146A1 (de) | 1996-05-22 |
EP0713146B1 (de) | 1999-04-14 |
DE69417901T2 (de) | 1999-08-12 |
US5391458A (en) | 1995-02-21 |
DE69417901D1 (de) | 1999-05-20 |
ES2132349T3 (es) | 1999-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
REN | Ceased due to non-payment of the annual fee |