SG144688A1 - Polishing composition and polishing method employing it - Google Patents

Polishing composition and polishing method employing it

Info

Publication number
SG144688A1
SG144688A1 SG200204377-6A SG2002043776A SG144688A1 SG 144688 A1 SG144688 A1 SG 144688A1 SG 2002043776 A SG2002043776 A SG 2002043776A SG 144688 A1 SG144688 A1 SG 144688A1
Authority
SG
Singapore
Prior art keywords
group
polishing
alkyl ether
polishing composition
method employing
Prior art date
Application number
SG200204377-6A
Other languages
English (en)
Inventor
Kenji Sakai
Kazusei Tamai
Tadahiro Kitamura
Tsuyoshi Matsuda
Katsuyoshi Ina
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG144688A1 publication Critical patent/SG144688A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Disintegrating Or Milling (AREA)
SG200204377-6A 2001-07-23 2002-07-18 Polishing composition and polishing method employing it SG144688A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001220803 2001-07-23
JP2002128372 2002-04-30

Publications (1)

Publication Number Publication Date
SG144688A1 true SG144688A1 (en) 2008-08-28

Family

ID=26619069

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200204377-6A SG144688A1 (en) 2001-07-23 2002-07-18 Polishing composition and polishing method employing it

Country Status (9)

Country Link
US (1) US6773476B2 (ko)
EP (1) EP1279708B1 (ko)
JP (1) JP4075985B2 (ko)
KR (1) KR100924251B1 (ko)
CN (1) CN1245466C (ko)
AT (1) ATE341595T1 (ko)
DE (1) DE60215084T2 (ko)
SG (1) SG144688A1 (ko)
TW (1) TWI280273B (ko)

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Also Published As

Publication number Publication date
JP4075985B2 (ja) 2008-04-16
EP1279708B1 (en) 2006-10-04
EP1279708A1 (en) 2003-01-29
JP2004027165A (ja) 2004-01-29
CN1245466C (zh) 2006-03-15
KR100924251B1 (ko) 2009-10-30
US20030051413A1 (en) 2003-03-20
US6773476B2 (en) 2004-08-10
CN1398939A (zh) 2003-02-26
ATE341595T1 (de) 2006-10-15
DE60215084D1 (de) 2006-11-16
TWI280273B (en) 2007-05-01
KR20030011611A (ko) 2003-02-11
DE60215084T2 (de) 2007-03-29

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