ATE529489T1 - Polierzusammensetzung und polierverfahren - Google Patents
Polierzusammensetzung und polierverfahrenInfo
- Publication number
- ATE529489T1 ATE529489T1 AT05822456T AT05822456T ATE529489T1 AT E529489 T1 ATE529489 T1 AT E529489T1 AT 05822456 T AT05822456 T AT 05822456T AT 05822456 T AT05822456 T AT 05822456T AT E529489 T1 ATE529489 T1 AT E529489T1
- Authority
- AT
- Austria
- Prior art keywords
- polishing
- polishing composition
- chemical
- mechanical polishing
- present
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004372101 | 2004-12-22 | ||
PCT/JP2005/024190 WO2006068328A1 (en) | 2004-12-22 | 2005-12-22 | Polishing composition and polishing method |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE529489T1 true ATE529489T1 (de) | 2011-11-15 |
Family
ID=38325749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05822456T ATE529489T1 (de) | 2004-12-22 | 2005-12-22 | Polierzusammensetzung und polierverfahren |
Country Status (5)
Country | Link |
---|---|
US (1) | US7901474B2 (de) |
EP (1) | EP1828333B1 (de) |
JP (1) | JP2006203188A (de) |
AT (1) | ATE529489T1 (de) |
WO (1) | WO2006068328A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8592314B2 (en) | 2005-01-24 | 2013-11-26 | Showa Denko K.K. | Polishing composition and polishing method |
JP2008053371A (ja) * | 2006-08-23 | 2008-03-06 | Fujifilm Corp | 半導体デバイスの研磨方法 |
CN101143996A (zh) * | 2006-09-15 | 2008-03-19 | 安集微电子(上海)有限公司 | 用于抛光多晶硅的化学机械抛光液 |
TWI408216B (zh) * | 2007-03-07 | 2013-09-11 | Anji Microelectronics Co Ltd | Application of Polishing Solution in Adjusting Polysilicon / Silica Selectivity Ratio |
US8047899B2 (en) * | 2007-07-26 | 2011-11-01 | Macronix International Co., Ltd. | Pad and method for chemical mechanical polishing |
JP5877940B2 (ja) * | 2010-04-08 | 2016-03-08 | 株式会社フジミインコーポレーテッド | 銅及びシリコンが表面に露出したウェーハの研磨方法 |
TWI605112B (zh) * | 2011-02-21 | 2017-11-11 | Fujimi Inc | 研磨用組成物 |
JP5833435B2 (ja) * | 2011-12-28 | 2015-12-16 | 花王株式会社 | シリコンウエハ用研磨液組成物 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5391258A (en) | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
JP3397501B2 (ja) | 1994-07-12 | 2003-04-14 | 株式会社東芝 | 研磨剤および研磨方法 |
US5920500A (en) | 1996-08-23 | 1999-07-06 | Motorola, Inc. | Magnetic random access memory having stacked memory cells and fabrication method therefor |
JP4092021B2 (ja) | 1998-10-02 | 2008-05-28 | 花王株式会社 | 研磨液組成物 |
JP2000252244A (ja) * | 1998-12-28 | 2000-09-14 | Hitachi Chem Co Ltd | 金属用研磨液及びそれを用いた研磨方法 |
JP4657408B2 (ja) * | 1999-10-13 | 2011-03-23 | 株式会社トクヤマ | 金属膜用研磨剤 |
JP2001115146A (ja) | 1999-10-18 | 2001-04-24 | Tokuyama Corp | バリア膜用研磨剤 |
JP4231950B2 (ja) * | 1999-10-18 | 2009-03-04 | 株式会社トクヤマ | 金属膜用研磨剤 |
JP3450247B2 (ja) | 1999-12-28 | 2003-09-22 | Necエレクトロニクス株式会社 | 金属配線形成方法 |
JP3736249B2 (ja) | 2000-01-12 | 2006-01-18 | Jsr株式会社 | 半導体装置の製造に用いる化学機械研磨用水系分散体 |
TW572980B (en) | 2000-01-12 | 2004-01-21 | Jsr Corp | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
US6569215B2 (en) * | 2000-04-17 | 2003-05-27 | Showa Denko Kabushiki Kaisha | Composition for polishing magnetic disk substrate |
JP2002170790A (ja) * | 2000-11-30 | 2002-06-14 | Showa Denko Kk | 半導体基板研磨用組成物、半導体配線基板およびその製造方法 |
JP2002249762A (ja) * | 2001-02-27 | 2002-09-06 | Sanyo Chem Ind Ltd | 研磨材用添加剤 |
SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
JP2002176015A (ja) * | 2001-10-15 | 2002-06-21 | Hitachi Chem Co Ltd | 金属用研磨液及び研磨方法 |
US7097541B2 (en) * | 2002-01-22 | 2006-08-29 | Cabot Microelectronics Corporation | CMP method for noble metals |
JP2004128475A (ja) * | 2002-08-02 | 2004-04-22 | Jsr Corp | 化学機械研磨用水系分散体および半導体装置の製造方法 |
JP4202157B2 (ja) | 2003-02-28 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
US8592314B2 (en) | 2005-01-24 | 2013-11-26 | Showa Denko K.K. | Polishing composition and polishing method |
-
2005
- 2005-12-22 JP JP2005370599A patent/JP2006203188A/ja active Pending
- 2005-12-22 US US11/793,347 patent/US7901474B2/en not_active Expired - Fee Related
- 2005-12-22 AT AT05822456T patent/ATE529489T1/de not_active IP Right Cessation
- 2005-12-22 WO PCT/JP2005/024190 patent/WO2006068328A1/en active Search and Examination
- 2005-12-22 EP EP05822456A patent/EP1828333B1/de not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
JP2006203188A (ja) | 2006-08-03 |
US7901474B2 (en) | 2011-03-08 |
WO2006068328A1 (en) | 2006-06-29 |
EP1828333A1 (de) | 2007-09-05 |
EP1828333B1 (de) | 2011-10-19 |
US20080138990A1 (en) | 2008-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |