ATE496103T1 - Polierzusammensetzung und polierverfahren - Google Patents
Polierzusammensetzung und polierverfahrenInfo
- Publication number
- ATE496103T1 ATE496103T1 AT07253000T AT07253000T ATE496103T1 AT E496103 T1 ATE496103 T1 AT E496103T1 AT 07253000 T AT07253000 T AT 07253000T AT 07253000 T AT07253000 T AT 07253000T AT E496103 T1 ATE496103 T1 AT E496103T1
- Authority
- AT
- Austria
- Prior art keywords
- group
- composition
- polishing
- anionic surfactant
- polishing composition
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- -1 polyoxyethylene group Polymers 0.000 abstract 6
- 239000003945 anionic surfactant Substances 0.000 abstract 3
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- 239000002736 nonionic surfactant Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 125000003342 alkenyl group Chemical group 0.000 abstract 1
- 125000005037 alkyl phenyl group Chemical group 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1472—Non-aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Disintegrating Or Milling (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006211453A JP2008041781A (ja) | 2006-08-02 | 2006-08-02 | 研磨用組成物及び研磨方法 |
JP2006211454A JP5314839B2 (ja) | 2006-08-02 | 2006-08-02 | 研磨用組成物及び研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE496103T1 true ATE496103T1 (de) | 2011-02-15 |
Family
ID=38961937
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07253000T ATE496103T1 (de) | 2006-08-02 | 2007-07-31 | Polierzusammensetzung und polierverfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US8080476B2 (de) |
EP (1) | EP1894978B1 (de) |
KR (1) | KR101477796B1 (de) |
AT (1) | ATE496103T1 (de) |
DE (1) | DE602007012026D1 (de) |
SG (1) | SG139699A1 (de) |
TW (1) | TWI417371B (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009164188A (ja) * | 2007-12-28 | 2009-07-23 | Fujimi Inc | 研磨用組成物 |
JP2009164186A (ja) * | 2007-12-28 | 2009-07-23 | Fujimi Inc | 研磨用組成物 |
JP2009187984A (ja) * | 2008-02-01 | 2009-08-20 | Fujimi Inc | 研磨用組成物及びそれを用いた研磨方法 |
US8506661B2 (en) * | 2008-10-24 | 2013-08-13 | Air Products & Chemicals, Inc. | Polishing slurry for copper films |
US8551887B2 (en) | 2009-12-22 | 2013-10-08 | Air Products And Chemicals, Inc. | Method for chemical mechanical planarization of a copper-containing substrate |
JP5587620B2 (ja) * | 2010-01-25 | 2014-09-10 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
JP6077209B2 (ja) | 2011-11-25 | 2017-02-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP5838083B2 (ja) * | 2011-12-09 | 2015-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物並びにそれを用いた研磨方法及び基板の製造方法 |
SG11201502768UA (en) | 2012-11-02 | 2015-05-28 | Fujimi Inc | Polishing composition |
CN103817603A (zh) * | 2014-02-28 | 2014-05-28 | 张家港市互惠光电有限公司 | 一种板材角部加工用护套 |
WO2017163847A1 (ja) * | 2016-03-25 | 2017-09-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物ならびに研磨方法および半導体基板の製造方法 |
KR20200038014A (ko) * | 2018-10-02 | 2020-04-10 | 주식회사 케이씨텍 | 표면처리 조성물 및 그것을 이용한 표면처리 방법 |
Family Cites Families (42)
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US5428721A (en) | 1990-02-07 | 1995-06-27 | Kabushiki Kaisha Toshiba | Data processing apparatus for editing image by using image conversion |
JP3024823B2 (ja) * | 1991-06-24 | 2000-03-27 | 花王株式会社 | 洗浄剤組成物 |
US5391721A (en) * | 1993-02-04 | 1995-02-21 | Wormald U.S., Inc. | Aqueous film forming foam concentrates for hydrophilic combustible liquids and method for modifying viscosity of same |
US5391258A (en) | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
US5575885A (en) | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
JP3397501B2 (ja) | 1994-07-12 | 2003-04-14 | 株式会社東芝 | 研磨剤および研磨方法 |
US5858813A (en) | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
US6025611A (en) * | 1996-09-20 | 2000-02-15 | The Board Of Regents Of The University Of Nebraska | Boron-carbide and boron rich rhobohedral based transistors and tunnel diodes |
US6309560B1 (en) | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6126853A (en) | 1996-12-09 | 2000-10-03 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US5954997A (en) | 1996-12-09 | 1999-09-21 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US5759917A (en) | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
US6432828B2 (en) | 1998-03-18 | 2002-08-13 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6423678B1 (en) * | 1998-05-05 | 2002-07-23 | Amway Corporation | Alcohol ethoxylate-peg ether of glycerin |
WO2000013217A1 (fr) | 1998-08-31 | 2000-03-09 | Hitachi Chemical Company, Ltd. | Liquide abrasif pour le polissage de metaux et procede correspondant |
JP4053165B2 (ja) | 1998-12-01 | 2008-02-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
US7250369B1 (en) | 1998-12-28 | 2007-07-31 | Hitachi, Ltd. | Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
US7208049B2 (en) * | 2003-10-20 | 2007-04-24 | Air Products And Chemicals, Inc. | Process solutions containing surfactants used as post-chemical mechanical planarization treatment |
US6479442B1 (en) * | 1999-05-05 | 2002-11-12 | Access Business Group International Llc | Hydrotrope and skin conditioning agents for use in liquid detergent compositions |
WO2001012739A1 (en) | 1999-08-13 | 2001-02-22 | Cabot Microelectronics Corporation | Chemical mechanical polishing systems and methods for their use |
TW501197B (en) | 1999-08-17 | 2002-09-01 | Hitachi Chemical Co Ltd | Polishing compound for chemical mechanical polishing and method for polishing substrate |
EP1223609A4 (de) | 1999-08-26 | 2006-03-15 | Hitachi Chemical Co Ltd | Polirmittel für cmp und poliermethode |
JP2001269859A (ja) * | 2000-03-27 | 2001-10-02 | Jsr Corp | 化学機械研磨用水系分散体 |
JP2002075927A (ja) | 2000-08-24 | 2002-03-15 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
JP2002110596A (ja) | 2000-10-02 | 2002-04-12 | Mitsubishi Electric Corp | 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法 |
JP2002164307A (ja) | 2000-11-24 | 2002-06-07 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
JP2002231666A (ja) | 2001-01-31 | 2002-08-16 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
JP3849091B2 (ja) * | 2001-02-28 | 2006-11-22 | Jsr株式会社 | 化学機械研磨用水系分散体 |
SG144688A1 (en) | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
AU2002334406A1 (en) | 2001-09-03 | 2003-03-18 | Showa Denko K.K. | Polishing composition |
US20030219982A1 (en) | 2002-05-23 | 2003-11-27 | Hitachi Chemical Co., Ltd | CMP (chemical mechanical polishing) polishing liquid for metal and polishing method |
CN1665902A (zh) | 2002-06-07 | 2005-09-07 | 昭和电工株式会社 | 金属抛光组合物,使用组合物进行抛光的方法以及使用抛光方法来生产晶片的方法 |
US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
JP4083502B2 (ja) | 2002-08-19 | 2008-04-30 | 株式会社フジミインコーポレーテッド | 研磨方法及びそれに用いられる研磨用組成物 |
JP3981616B2 (ja) | 2002-10-02 | 2007-09-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2004172606A (ja) * | 2002-11-08 | 2004-06-17 | Sumitomo Chem Co Ltd | 金属研磨材組成物及び研磨方法 |
JP4350364B2 (ja) * | 2002-12-12 | 2009-10-21 | 昭和電工株式会社 | 洗浄剤組成物、半導体ウェーハの洗浄方法および製造方法 |
JP2004349426A (ja) * | 2003-05-21 | 2004-12-09 | Jsr Corp | Sti用化学機械研磨方法 |
JP2004134751A (ja) * | 2003-07-28 | 2004-04-30 | Hitachi Chem Co Ltd | 研磨剤及び基板の研磨方法 |
US7485162B2 (en) | 2003-09-30 | 2009-02-03 | Fujimi Incorporated | Polishing composition |
JP2005294798A (ja) * | 2004-03-08 | 2005-10-20 | Asahi Glass Co Ltd | 研磨剤および研磨方法 |
JP2006086462A (ja) | 2004-09-17 | 2006-03-30 | Fujimi Inc | 研磨用組成物およびそれを用いた配線構造体の製造法 |
-
2007
- 2007-07-30 SG SG200705542-9A patent/SG139699A1/en unknown
- 2007-07-31 TW TW096128012A patent/TWI417371B/zh active
- 2007-07-31 AT AT07253000T patent/ATE496103T1/de not_active IP Right Cessation
- 2007-07-31 EP EP07253000A patent/EP1894978B1/de not_active Not-in-force
- 2007-07-31 DE DE602007012026T patent/DE602007012026D1/de active Active
- 2007-08-01 US US11/832,403 patent/US8080476B2/en active Active
- 2007-08-01 KR KR1020070077363A patent/KR101477796B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI417371B (zh) | 2013-12-01 |
KR101477796B1 (ko) | 2014-12-30 |
US20080032505A1 (en) | 2008-02-07 |
TW200831652A (en) | 2008-08-01 |
KR20080012229A (ko) | 2008-02-11 |
DE602007012026D1 (de) | 2011-03-03 |
US8080476B2 (en) | 2011-12-20 |
EP1894978B1 (de) | 2011-01-19 |
EP1894978A2 (de) | 2008-03-05 |
EP1894978A3 (de) | 2009-10-21 |
SG139699A1 (en) | 2008-02-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |