SG139699A1 - Polishing composition and polishing process - Google Patents

Polishing composition and polishing process

Info

Publication number
SG139699A1
SG139699A1 SG200705542-9A SG2007055429A SG139699A1 SG 139699 A1 SG139699 A1 SG 139699A1 SG 2007055429 A SG2007055429 A SG 2007055429A SG 139699 A1 SG139699 A1 SG 139699A1
Authority
SG
Singapore
Prior art keywords
group
polishing
composition
polishing composition
anionic surfactant
Prior art date
Application number
SG200705542-9A
Other languages
English (en)
Inventor
Atsunori Kawamura
Masayuki Hattori
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006211454A external-priority patent/JP5314839B2/ja
Priority claimed from JP2006211453A external-priority patent/JP2008041781A/ja
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of SG139699A1 publication Critical patent/SG139699A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1472—Non-aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Disintegrating Or Milling (AREA)
SG200705542-9A 2006-08-02 2007-07-30 Polishing composition and polishing process SG139699A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006211454A JP5314839B2 (ja) 2006-08-02 2006-08-02 研磨用組成物及び研磨方法
JP2006211453A JP2008041781A (ja) 2006-08-02 2006-08-02 研磨用組成物及び研磨方法

Publications (1)

Publication Number Publication Date
SG139699A1 true SG139699A1 (en) 2008-02-29

Family

ID=38961937

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705542-9A SG139699A1 (en) 2006-08-02 2007-07-30 Polishing composition and polishing process

Country Status (7)

Country Link
US (1) US8080476B2 (de)
EP (1) EP1894978B1 (de)
KR (1) KR101477796B1 (de)
AT (1) ATE496103T1 (de)
DE (1) DE602007012026D1 (de)
SG (1) SG139699A1 (de)
TW (1) TWI417371B (de)

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JP2009187984A (ja) * 2008-02-01 2009-08-20 Fujimi Inc 研磨用組成物及びそれを用いた研磨方法
US8506661B2 (en) * 2008-10-24 2013-08-13 Air Products & Chemicals, Inc. Polishing slurry for copper films
US8551887B2 (en) 2009-12-22 2013-10-08 Air Products And Chemicals, Inc. Method for chemical mechanical planarization of a copper-containing substrate
JP5587620B2 (ja) * 2010-01-25 2014-09-10 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
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JP5838083B2 (ja) * 2011-12-09 2015-12-24 株式会社フジミインコーポレーテッド 研磨用組成物並びにそれを用いた研磨方法及び基板の製造方法
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US10759969B2 (en) * 2016-03-25 2020-09-01 Fujimi Incorporated Polishing composition, polishing method, and method for manufacturing semiconductor substrate
KR20200038014A (ko) * 2018-10-02 2020-04-10 주식회사 케이씨텍 표면처리 조성물 및 그것을 이용한 표면처리 방법

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Also Published As

Publication number Publication date
KR20080012229A (ko) 2008-02-11
DE602007012026D1 (de) 2011-03-03
TWI417371B (zh) 2013-12-01
US20080032505A1 (en) 2008-02-07
TW200831652A (en) 2008-08-01
ATE496103T1 (de) 2011-02-15
EP1894978B1 (de) 2011-01-19
US8080476B2 (en) 2011-12-20
EP1894978A3 (de) 2009-10-21
KR101477796B1 (ko) 2014-12-30
EP1894978A2 (de) 2008-03-05

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