ATE421769T1 - Cmp-zusammensetzung mit einem tensid - Google Patents

Cmp-zusammensetzung mit einem tensid

Info

Publication number
ATE421769T1
ATE421769T1 AT05817425T AT05817425T ATE421769T1 AT E421769 T1 ATE421769 T1 AT E421769T1 AT 05817425 T AT05817425 T AT 05817425T AT 05817425 T AT05817425 T AT 05817425T AT E421769 T1 ATE421769 T1 AT E421769T1
Authority
AT
Austria
Prior art keywords
substrate
surfactant
cmp composition
polishing
polishing composition
Prior art date
Application number
AT05817425T
Other languages
English (en)
Inventor
Tao Sun
Robert Medsker
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE421769T1 publication Critical patent/ATE421769T1/de

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Organic Insulating Materials (AREA)
  • Dental Preparations (AREA)
  • Glass Compositions (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
AT05817425T 2004-10-28 2005-10-21 Cmp-zusammensetzung mit einem tensid ATE421769T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/975,585 US7524347B2 (en) 2004-10-28 2004-10-28 CMP composition comprising surfactant

Publications (1)

Publication Number Publication Date
ATE421769T1 true ATE421769T1 (de) 2009-02-15

Family

ID=35840204

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05817425T ATE421769T1 (de) 2004-10-28 2005-10-21 Cmp-zusammensetzung mit einem tensid

Country Status (11)

Country Link
US (1) US7524347B2 (de)
EP (1) EP1829093B1 (de)
JP (1) JP4965451B2 (de)
KR (1) KR101109300B1 (de)
CN (2) CN101044600A (de)
AT (1) ATE421769T1 (de)
DE (1) DE602005012546D1 (de)
IL (1) IL182536A (de)
MY (1) MY143941A (de)
TW (1) TWI313703B (de)
WO (1) WO2006049912A2 (de)

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Also Published As

Publication number Publication date
EP1829093A2 (de) 2007-09-05
JP2008517791A (ja) 2008-05-29
KR101109300B1 (ko) 2012-01-31
KR20070072617A (ko) 2007-07-04
CN101044600A (zh) 2007-09-26
WO2006049912A2 (en) 2006-05-11
TWI313703B (en) 2009-08-21
CN102337080B (zh) 2016-01-20
WO2006049912A3 (en) 2006-10-26
JP4965451B2 (ja) 2012-07-04
DE602005012546D1 (de) 2009-03-12
IL182536A (en) 2014-06-30
US20060096496A1 (en) 2006-05-11
US7524347B2 (en) 2009-04-28
TW200621961A (en) 2006-07-01
CN102337080A (zh) 2012-02-01
MY143941A (en) 2011-07-29
EP1829093B1 (de) 2009-01-21
IL182536A0 (en) 2007-09-20

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