SG126044A1 - Coating and developing system - Google Patents

Coating and developing system

Info

Publication number
SG126044A1
SG126044A1 SG200601316A SG200601316A SG126044A1 SG 126044 A1 SG126044 A1 SG 126044A1 SG 200601316 A SG200601316 A SG 200601316A SG 200601316 A SG200601316 A SG 200601316A SG 126044 A1 SG126044 A1 SG 126044A1
Authority
SG
Singapore
Prior art keywords
block
substrate
coating
developing
exposure system
Prior art date
Application number
SG200601316A
Other languages
English (en)
Inventor
Nobuaki Matsuoka
Shinichi Hayashi
Yasushi Hayashida
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG126044A1 publication Critical patent/SG126044A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
SG200601316A 2005-03-11 2006-03-03 Coating and developing system SG126044A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005069682 2005-03-11
JP2005297989A JP4685584B2 (ja) 2005-03-11 2005-10-12 塗布、現像装置

Publications (1)

Publication Number Publication Date
SG126044A1 true SG126044A1 (en) 2006-10-30

Family

ID=36582048

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200601316A SG126044A1 (en) 2005-03-11 2006-03-03 Coating and developing system

Country Status (6)

Country Link
US (1) US7474377B2 (ja)
EP (1) EP1701215A3 (ja)
JP (1) JP4685584B2 (ja)
KR (1) KR101100503B1 (ja)
SG (1) SG126044A1 (ja)
TW (1) TWI296824B (ja)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080015778A (ko) * 2005-06-29 2008-02-20 가부시키가이샤 니콘 노광 장치, 기판 처리 방법, 및 디바이스 제조 방법
US7766565B2 (en) * 2005-07-01 2010-08-03 Sokudo Co., Ltd. Substrate drying apparatus, substrate cleaning apparatus and substrate processing system
JP4519037B2 (ja) * 2005-08-31 2010-08-04 東京エレクトロン株式会社 加熱装置及び塗布、現像装置
JP4687682B2 (ja) 2007-03-30 2011-05-25 東京エレクトロン株式会社 塗布、現像装置及びその方法並びに記憶媒体
JP2008258208A (ja) * 2007-03-30 2008-10-23 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
JP4908304B2 (ja) 2007-04-27 2012-04-04 東京エレクトロン株式会社 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体
US8636458B2 (en) * 2007-06-06 2014-01-28 Asml Netherlands B.V. Integrated post-exposure bake track
KR100904392B1 (ko) * 2007-06-18 2009-06-26 세메스 주식회사 기판 처리 장치
KR100897850B1 (ko) * 2007-06-18 2009-05-15 세메스 주식회사 기판 처리 장치
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4957426B2 (ja) * 2007-07-19 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体
KR100914004B1 (ko) 2007-07-27 2009-08-26 삼성기전주식회사 인쇄회로기판 노광 자동화 시스템 및 그 작동방법
JP2009135169A (ja) * 2007-11-29 2009-06-18 Tokyo Electron Ltd 基板処理システムおよび基板処理方法
JP5128918B2 (ja) 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
DE102008047234B4 (de) 2008-09-12 2018-12-06 Henkel Ag & Co. Kgaa Reparaturdüse und Reparatursystem
JP4751460B2 (ja) 2009-02-18 2011-08-17 東京エレクトロン株式会社 基板搬送装置及び基板処理システム
JP5223778B2 (ja) * 2009-05-28 2013-06-26 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP4887404B2 (ja) * 2009-06-16 2012-02-29 東京エレクトロン株式会社 基板処理システム用加熱装置の昇温制御方法、プログラム、コンピュータ記録媒体及び基板処理システム
JP5736687B2 (ja) * 2009-10-06 2015-06-17 東京エレクトロン株式会社 基板処理装置
JP4941570B2 (ja) * 2010-03-04 2012-05-30 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
JP5102861B2 (ja) 2010-05-28 2012-12-19 東京エレクトロン株式会社 基板処理システム用加熱装置の昇温制御方法、プログラム、コンピュータ記録媒体及び基板処理システム
JP5408059B2 (ja) 2010-07-09 2014-02-05 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5338757B2 (ja) 2010-07-09 2013-11-13 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及び記憶媒体
JP5490741B2 (ja) * 2011-03-02 2014-05-14 東京エレクトロン株式会社 基板搬送装置の位置調整方法、及び基板処理装置
JP5964654B2 (ja) * 2012-05-24 2016-08-03 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法
TWI584351B (zh) * 2013-10-08 2017-05-21 Tokyo Electron Ltd Liquid container exchange device, container-mounted module and exchange solution of chemical liquid container, substrate processing device
JP5758509B2 (ja) * 2014-01-17 2015-08-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
US10095114B2 (en) 2014-11-14 2018-10-09 Applied Materials, Inc. Process chamber for field guided exposure and method for implementing the process chamber
JP5852219B2 (ja) * 2014-12-24 2016-02-03 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法および基板処理装置
JP6292155B2 (ja) * 2015-03-19 2018-03-14 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6209554B2 (ja) * 2015-04-15 2017-10-04 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法
JP6552931B2 (ja) * 2015-09-18 2019-07-31 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP6049929B2 (ja) * 2016-03-11 2016-12-21 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理方法
US9964863B1 (en) 2016-12-20 2018-05-08 Applied Materials, Inc. Post exposure processing apparatus
JP6656305B2 (ja) * 2018-06-05 2020-03-04 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理装置
US11650506B2 (en) 2019-01-18 2023-05-16 Applied Materials Inc. Film structure for electric field guided photoresist patterning process
JP6994489B2 (ja) * 2019-10-02 2022-01-14 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
US11429026B2 (en) 2020-03-20 2022-08-30 Applied Materials, Inc. Lithography process window enhancement for photoresist patterning

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6168667B1 (en) 1997-05-30 2001-01-02 Tokyo Electron Limited Resist-processing apparatus
JP4021118B2 (ja) * 1999-04-28 2007-12-12 東京エレクトロン株式会社 基板処理装置
JP3445757B2 (ja) 1999-05-06 2003-09-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP3462426B2 (ja) 1999-05-24 2003-11-05 東京エレクトロン株式会社 基板処理装置
KR100348938B1 (ko) 1999-12-06 2002-08-14 한국디엔에스 주식회사 포토리소그라피 공정을 위한 반도체 제조장치
JP2002246434A (ja) * 2001-02-15 2002-08-30 Tokyo Electron Ltd 基板受け渡しシステム
JP2001274221A (ja) * 2001-03-21 2001-10-05 Tokyo Electron Ltd 板状体の搬送装置および搬送方法、ならびに処理装置
JP3887549B2 (ja) * 2001-07-16 2007-02-28 東京エレクトロン株式会社 基板搬送装置
JP4087328B2 (ja) 2002-11-28 2008-05-21 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法
JP2004221488A (ja) * 2003-01-17 2004-08-05 Dainippon Screen Mfg Co Ltd 基板処理装置
WO2006069341A2 (en) 2004-12-22 2006-06-29 Applied Materials, Inc. Cluster tool architecture for processing a substrate
US7267497B2 (en) 2005-01-21 2007-09-11 Tokyo Electron Limited Coating and developing system and coating and developing method
JP4955976B2 (ja) 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4955977B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法

Also Published As

Publication number Publication date
EP1701215A3 (en) 2012-04-04
JP4685584B2 (ja) 2011-05-18
US20060201616A1 (en) 2006-09-14
JP2006287178A (ja) 2006-10-19
TW200731330A (en) 2007-08-16
KR20060098339A (ko) 2006-09-18
EP1701215A2 (en) 2006-09-13
KR101100503B1 (ko) 2011-12-29
TWI296824B (en) 2008-05-11
US7474377B2 (en) 2009-01-06

Similar Documents

Publication Publication Date Title
SG126044A1 (en) Coating and developing system
TW200745769A (en) Photo apparatus and method
WO2011065589A3 (en) Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method
GB2465528A (en) Method and apparatus for surface processing of a substrate using an energetic particle beam
TW200629008A (en) Liquid removing apparatus, exposure apparatus and device manufacturing method
TW200710253A (en) Integrated metrology tools for monitoring and controlling large area substrate processing chambers
NO20083285L (no) Fremgangsmate og anordning for presisjonsbearbeiding av substrater ved hjelp av laser anordnet i en vaeskestromning, og anvendelse derav
TW200518191A (en) Anti-corrosion layer on objective lens for liquid immersion lithographic application
TW200741173A (en) Method and apparatus for measuring dimensional changes in transparent substrates
TW200627575A (en) Substrate processing apparatus and substrate processing method
MY131229A (en) Wafer planarization apparatus
TW200741823A (en) Semiconductor device manufacturing method and substrate processing apparatus
WO2009102502A3 (en) Apparatus and method for batch non-contact material characterization
WO2007109448A3 (en) Apparatus and method for carrying substrates
TW200611082A (en) Exposure system and device production method
TW200710583A (en) Peripheral exposure device, coating and developing apparatus and peripheral exposure method
TW200737301A (en) Substrate processing method, substrate processing system, program, and recording medium
WO2009074154A3 (en) A tissue processing apparatus
TW200627519A (en) Substrate processing system
TW200703548A (en) Exposing apparatus having substrate chuck of good flatness
MY163723A (en) System and method for depositing a material on a substrate
TW200705117A (en) Measuring apparatus, exposure apparatus, and device manufacturing method
MY142868A (en) Apparatus and method for smoothly coating substrates
SG162801A1 (en) Exposure apparatus, substrate processing method, and device producing method
WO2008129982A1 (ja) 基板処理方法及びシステム、並びにデバイス製造方法