SG11201706733UA - Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device - Google Patents

Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device

Info

Publication number
SG11201706733UA
SG11201706733UA SG11201706733UA SG11201706733UA SG11201706733UA SG 11201706733U A SG11201706733U A SG 11201706733UA SG 11201706733U A SG11201706733U A SG 11201706733UA SG 11201706733U A SG11201706733U A SG 11201706733UA SG 11201706733U A SG11201706733U A SG 11201706733UA
Authority
SG
Singapore
Prior art keywords
semiconductor device
resin composition
resin film
photosensitive resin
manufacturing cured
Prior art date
Application number
SG11201706733UA
Other languages
English (en)
Inventor
Yukari Arimoto
Yuki Masuda
Ryoji Okuda
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201706733UA publication Critical patent/SG11201706733UA/en

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    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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TW201641537A (zh) 2016-12-01
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US10365559B2 (en) 2019-07-30
JPWO2016140024A1 (ja) 2017-12-14
US20180031970A1 (en) 2018-02-01
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CN107407869B (zh) 2020-09-22
CN107407869A (zh) 2017-11-28

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