SG11201708564WA - Film for manufacturing semiconductor parts - Google Patents

Film for manufacturing semiconductor parts

Info

Publication number
SG11201708564WA
SG11201708564WA SG11201708564WA SG11201708564WA SG11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA SG 11201708564W A SG11201708564W A SG 11201708564WA
Authority
SG
Singapore
Prior art keywords
film
manufacturing semiconductor
semiconductor parts
parts
manufacturing
Prior art date
Application number
SG11201708564WA
Inventor
Eiji Hayashishita
Original Assignee
Mitsui Chemicals Tohcello Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Tohcello Inc
Publication of SG11201708564WA publication Critical patent/SG11201708564WA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/02—Presence of polyamine or polyimide polyamine
    • C09J2479/026—Presence of polyamine or polyimide polyamine in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG11201708564WA 2015-06-29 2016-06-14 Film for manufacturing semiconductor parts SG11201708564WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015130403 2015-06-29
PCT/JP2016/067705 WO2017002610A1 (en) 2015-06-29 2016-06-14 Film for manufacturing semiconductor parts

Publications (1)

Publication Number Publication Date
SG11201708564WA true SG11201708564WA (en) 2017-11-29

Family

ID=57608103

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201708564WA SG11201708564WA (en) 2015-06-29 2016-06-14 Film for manufacturing semiconductor parts

Country Status (8)

Country Link
US (2) US10858547B2 (en)
EP (1) EP3316280B1 (en)
JP (1) JP6129446B1 (en)
KR (1) KR102034972B1 (en)
CN (1) CN107851602B (en)
SG (1) SG11201708564WA (en)
TW (1) TWI680517B (en)
WO (1) WO2017002610A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102034972B1 (en) 2015-06-29 2019-10-21 미쓰이 가가쿠 토세로 가부시키가이샤 Film for manufacturing semiconductor parts
JP6196751B1 (en) 2016-03-31 2017-09-13 三井化学東セロ株式会社 Film for parts production and method for producing parts
WO2018139612A1 (en) * 2017-01-30 2018-08-02 三井化学東セロ株式会社 Component-manufacturing film, component-manufacturing tool, and component-manufacturing method
TW201901847A (en) * 2017-05-11 2019-01-01 日商三井化學東賽璐股份有限公司 Parts manufacturing tool and part manufacturing method
WO2019167702A1 (en) 2018-02-28 2019-09-06 三井化学東セロ株式会社 Component producing method, holding film, and holding tool forming device
JP7139048B2 (en) * 2018-07-06 2022-09-20 株式会社ディスコ Wafer processing method
US20200075386A1 (en) * 2018-08-30 2020-03-05 Texas Instruments Incorporated Subring for semiconductor dies
JP7166718B2 (en) * 2018-10-17 2022-11-08 株式会社ディスコ Wafer processing method
JP7171134B2 (en) * 2018-10-17 2022-11-15 株式会社ディスコ Wafer processing method
JP7258421B2 (en) * 2019-02-15 2023-04-17 株式会社ディスコ Wafer processing method
DE102019203438A1 (en) * 2019-03-13 2020-09-17 Tesa Se Surface protection film to protect the edges of rotor blades on wind turbines
JP7330616B2 (en) * 2019-05-10 2023-08-22 株式会社ディスコ Wafer processing method
JP2021015840A (en) * 2019-07-10 2021-02-12 株式会社ディスコ Wafer processing method
JP7546363B2 (en) * 2020-02-18 2024-09-06 リンテック株式会社 Sheet for processing workpiece and method for manufacturing processed workpiece
KR102635493B1 (en) * 2020-11-04 2024-02-07 세메스 주식회사 Apparatus for transferring die in bonding equipment and method thereof
US20240312848A1 (en) 2021-02-10 2024-09-19 Mitsui Chemicals Tohcello, Inc. Electronic component manufacturing method, manufacturing film, and manufacturing tool

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KR970001499B1 (en) * 1988-11-17 1997-02-11 니또 덴꼬 가부시기가이샤 Thermal pressure-sensitive adhesive sheet material
JP4054219B2 (en) * 2002-05-22 2008-02-27 三井化学株式会社 Semiconductor wafer surface protecting adhesive film and semiconductor wafer protecting method using the adhesive film
WO2006038438A2 (en) * 2004-09-14 2006-04-13 Oji Paper Co Reversible thermal recording material, and communication medium having display layer and recording material
US7326592B2 (en) 2005-04-04 2008-02-05 Infineon Technologies Ag Stacked die package
JP4549239B2 (en) 2005-06-22 2010-09-22 日東電工株式会社 Dicing adhesive sheet
JP5063262B2 (en) * 2006-08-30 2012-10-31 Ｄｉｃ株式会社 Re-peeling adhesive sheet
JP2011082480A (en) * 2009-03-13 2011-04-21 Sekisui Chem Co Ltd Die attach film and dicing die attach film
JP5324319B2 (en) 2009-05-26 2013-10-23 日東電工株式会社 Wafer mounting method and wafer mounting apparatus
JP5718005B2 (en) * 2010-09-14 2015-05-13 日東電工株式会社 A heat-resistant adhesive tape for manufacturing a semiconductor device and a method for manufacturing a semiconductor device using the tape.
CN102986007B (en) * 2010-09-30 2015-06-10 三井化学东赛璐株式会社 Expandable film, dicing film, and method for producing semiconductor device
JP6148430B2 (en) 2011-07-26 2017-06-14 日東電工株式会社 Adhesive sheet and its use
CN103748664B (en) * 2011-08-09 2016-04-20 三井化学东赛璐株式会社 The semiconductor wafer surface protection film used in the manufacture method of semiconductor device and the method
KR20140142273A (en) * 2012-03-08 2014-12-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Clean Release, Stretch Releasable Tape
JP5117629B1 (en) * 2012-06-28 2013-01-16 古河電気工業株式会社 Adhesive tape for wafer processing
JP6024382B2 (en) * 2012-10-23 2016-11-16 大日本印刷株式会社 Adhesive composition, adhesive sheet and image display device
JP2015053408A (en) 2013-09-09 2015-03-19 日東電工株式会社 Semiconductor device manufacturing method
KR102034972B1 (en) 2015-06-29 2019-10-21 미쓰이 가가쿠 토세로 가부시키가이샤 Film for manufacturing semiconductor parts

Also Published As

Publication number Publication date
CN107851602A (en) 2018-03-27
KR20180015229A (en) 2018-02-12
EP3316280A4 (en) 2019-03-13
CN107851602B (en) 2021-08-06
US20180142130A1 (en) 2018-05-24
EP3316280B1 (en) 2024-02-28
KR102034972B1 (en) 2019-10-21
US20210047543A1 (en) 2021-02-18
TW201701375A (en) 2017-01-01
JP6129446B1 (en) 2017-05-17
TWI680517B (en) 2019-12-21
WO2017002610A1 (en) 2017-01-05
JPWO2017002610A1 (en) 2017-07-06
EP3316280A1 (en) 2018-05-02
US11535776B2 (en) 2022-12-27
US10858547B2 (en) 2020-12-08

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