SG11201608514UA - Alignment fixtures for integrated circuit packages - Google Patents

Alignment fixtures for integrated circuit packages

Info

Publication number
SG11201608514UA
SG11201608514UA SG11201608514UA SG11201608514UA SG11201608514UA SG 11201608514U A SG11201608514U A SG 11201608514UA SG 11201608514U A SG11201608514U A SG 11201608514UA SG 11201608514U A SG11201608514U A SG 11201608514UA SG 11201608514U A SG11201608514U A SG 11201608514UA
Authority
SG
Singapore
Prior art keywords
integrated circuit
circuit packages
alignment fixtures
fixtures
alignment
Prior art date
Application number
SG11201608514UA
Inventor
Sruti Chigullapalli
Rene J Sanchez
Nader N Abazarnia
Todd R Coons
Tuan Hoong Goh
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG11201608514UA publication Critical patent/SG11201608514UA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
SG11201608514UA 2014-04-21 2014-04-21 Alignment fixtures for integrated circuit packages SG11201608514UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2014/034827 WO2015163845A1 (en) 2014-04-21 2014-04-21 Alignment fixtures for integrated circuit packages

Publications (1)

Publication Number Publication Date
SG11201608514UA true SG11201608514UA (en) 2016-11-29

Family

ID=54332878

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201608514UA SG11201608514UA (en) 2014-04-21 2014-04-21 Alignment fixtures for integrated circuit packages

Country Status (8)

Country Link
US (1) US10228418B2 (en)
JP (1) JP6382343B2 (en)
KR (1) KR101882120B1 (en)
CN (1) CN106461702B (en)
DE (1) DE112014006609T5 (en)
MY (1) MY192643A (en)
SG (1) SG11201608514UA (en)
WO (1) WO2015163845A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9341671B2 (en) * 2013-03-14 2016-05-17 Taiwan Semiconductor Manufacturing Company, Ltd. Testing holders for chip unit and die package
EP3135142B1 (en) * 2015-08-31 2019-06-05 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Magnetic closure element and closure device
US10714988B2 (en) * 2017-08-24 2020-07-14 Uchicago Argonne, Llc Permanent magnet design to enable higher magnetic flux density
US10388579B2 (en) * 2017-09-21 2019-08-20 Texas Instruments Incorporated Multi-plate semiconductor wafer testing systems
CN108000389B (en) * 2017-11-28 2019-09-24 中国电子科技集团公司第五十八研究所 Integrated circuit Constant Acceleration Test fixture
KR102200527B1 (en) * 2019-04-19 2021-01-11 주식회사 아이에스시 Socket board assembly
KR102192764B1 (en) * 2019-11-19 2020-12-18 (주)티에스이 Test socket device
KR20220037124A (en) * 2020-09-17 2022-03-24 주식회사 엘지에너지솔루션 Jig for evaluating buffer pad and method for evaluating buffer pad using same
KR20220061545A (en) 2020-11-06 2022-05-13 삼성전자주식회사 Test apparatus for semiconductor device
TWI750984B (en) * 2020-12-30 2021-12-21 致茂電子股份有限公司 An automated test system using bridge connection

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4329642A (en) * 1979-03-09 1982-05-11 Siliconix, Incorporated Carrier and test socket for leadless integrated circuit
US4661886A (en) * 1985-10-03 1987-04-28 Burroughs Corporation Magnetically sealed multichip integrated circuit package
US5204616A (en) 1990-04-26 1993-04-20 The United States Of America As Represented By The Secretary Of The Air Force In-circuit test fixture for leaded packages
US5828224A (en) * 1994-03-18 1998-10-27 Fujitsu, Limited Test carrier for semiconductor integrated circuit and method of testing semiconductor integrated circuit
US5986459A (en) 1994-03-18 1999-11-16 Fujitsu Limited Semiconductor device testing carrier and method of fixing semiconductor device to testing carrier
JP4162058B2 (en) * 1996-06-21 2008-10-08 富士通株式会社 Semiconductor device support device, semiconductor device fixing method, and semiconductor device removal method from support device
JP2983163B2 (en) * 1995-12-27 1999-11-29 株式会社しなのエレクトロニクス IC handler
JP3932000B2 (en) 1997-05-29 2007-06-20 株式会社いうら Elevating drive mechanism in stretcher
JP3516860B2 (en) 1998-03-18 2004-04-05 株式会社アスペクト Shape design support apparatus and modeling method
US7355427B2 (en) 2005-08-18 2008-04-08 Research In Motion Limited Clamping top plate using magnetic force
CN1978352B (en) 2005-12-02 2012-01-25 鸿富锦精密工业（深圳）有限公司 Floating precision positioning mould
US20080164267A1 (en) * 2007-01-09 2008-07-10 Alissa Huber Apparatuses, systems and methods for holding portable devices or instruments
EP2317330B1 (en) 2009-09-11 2013-12-11 Giga-Byte Technology Co., Ltd. Pin connector and chip test fixture having the same
JP5342526B2 (en) 2010-09-03 2013-11-13 三菱電機株式会社 TDR type inspection device
JP2013164304A (en) 2012-02-09 2013-08-22 Nidec-Read Corp Tool for substrate inspection
CN103587007A (en) 2013-10-15 2014-02-19 苏州益群模具有限公司 Guide auxiliary device
KR101357020B1 (en) 2013-11-27 2014-02-05 주식회사 티씨에스 Socket for testing electronics

Also Published As

Publication number Publication date
KR101882120B1 (en) 2018-07-25
DE112014006609T5 (en) 2017-01-26
JP6382343B2 (en) 2018-08-29
CN106461702B (en) 2019-08-27
CN106461702A (en) 2017-02-22
KR20160124199A (en) 2016-10-26
WO2015163845A1 (en) 2015-10-29
JP2017514134A (en) 2017-06-01
US20170123001A1 (en) 2017-05-04
US10228418B2 (en) 2019-03-12
MY192643A (en) 2022-08-29

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