JP2013164304A - Tool for substrate inspection - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for performing an operation for aligning a contact piece with an electrode part of a tool for substrate inspection in a quick and accurate manner.SOLUTION: A tool for substrate inspection has a tool head having an upper plate part and a lower plate part, and an electrode part including an electrode. The upper plate part and the lower plate part are each provided with a hole through which a contact piece is inserted. A positioning spacer is inserted between the lower plate part and the electrode part. The positioning spacer is provided with a hole through which a contact piece is inserted. The hole has a tapered surface.

Description

  The present invention relates to a substrate inspection jig for inspecting defects such as disconnection and short circuit of a wiring pattern formed on a substrate, and in particular, for a four-terminal measurement method having a structure in which two terminals are coaxially arranged. This relates to a substrate inspection jig.

  The substrate on which the wiring pattern is formed is inspected for defects such as disconnection and short circuit of the wiring pattern before mounting the electric / electronic component. The quality is determined by measuring the resistance value of the wiring pattern to be inspected. For example, a measurement contact is brought into contact with each of two inspection points on a wiring pattern provided on the substrate, and a predetermined level of measurement current is passed between the contacts. The voltage value between the terminals is measured, and the quality of the wiring pattern is determined by comparing this voltage value with a predetermined threshold value.

  As a method for measuring the resistance value, a two-terminal measurement method and a four-terminal measurement method (Kelvin method) are known. In the two-terminal measurement method, one contact is brought into contact with each inspection point, and current supply and voltage measurement are performed. In the four-terminal measurement method (Kelvin method), two contactors, a current supply contactor and a voltage measurement contactor, are simultaneously brought into contact with each inspection point.

  Patent Document 1 discloses an inspection jig for a four-terminal measurement method. Patent Document 2 describes an example of the structure of a jig head of an inspection jig.

JP 2008-76268 A JP 2009-08516 A

  A substrate inspection jig for a four-terminal measurement method typically includes a jig head that holds a contact and a connection electrode body that includes a coaxial electrode. When assembling the board inspection jig, it is necessary to accurately contact the end of the contact with the coaxial electrode of the connection electrode body. However, the contact is inserted from a hole provided in the plate-like member of the jig head on the side in contact with the connection electrode body, and then has a structure for fixing the jig head and the connection electrode body. For this reason, the hole provided in this plate-shaped member is formed to have an outer diameter sufficiently larger than the outer diameter of the contact so that the contact can be easily penetrated. For this reason, since the position where the end of the contact exists varies in the hole, it is difficult to accurately align the contact with the coaxial electrode.

  The objective of this invention is providing the technique which can perform the operation | work which aligns a contact with the coaxial electrode of a connection electrode body quickly and correctly.

  According to the present invention, a substrate inspection jig includes a jig head having an upper plate portion and a lower plate portion each provided with a contact and a hole through which the contact is inserted, and a connection including a coaxial electrode. And an electrode body.

  The contact has a core and a cylindrical member outside the core, and the coaxial electrode has a center electrode and a cylindrical electrode outside the center electrode, and the contact core and cylindrical One end of the member is in contact with the inspection point of the substrate to be inspected, and the coaxial electrode is in contact with the center electrode and the cylindrical electrode, respectively, in the core of the contact and the other end of the cylindrical member. It is configured as follows.

  A positioning spacer is inserted between the lower plate portion and the electrode portion, and the positioning spacer is provided with a hole through which the contact is inserted.

  The hole of the positioning spacer is formed to have a diameter slightly larger than the coaxial electrode or a diameter slightly larger than the outer diameter of the cylindrical member of the contact.

  According to the embodiment of the present invention, a tapered surface may be formed on a side surface of the hole of the positioning spacer.

  According to an embodiment of the present invention, the positioning spacer may have a thickness of 40-60 μm.

  According to the embodiment of the present invention, the inner diameter of the upper end of the hole of the positioning spacer is d1 = 80 to 100 μm, and the inner diameter d2 of the lower end of the hole may be 16 to 20 μm smaller than the inner diameter d1 of the upper end of the hole. .

  According to an embodiment of the present invention, an inclination angle of the tapered surface of the hole of the positioning spacer with respect to a plane perpendicular to the central axis of the coaxial electrode may be larger than 60 degrees.

  According to an embodiment of the present invention, the positioning spacer may be formed of a polymer resin.

  According to an embodiment of the present invention, the hole of the positioning spacer may be formed by laser processing.

  According to an embodiment of the present invention, a spiral spring portion is formed on a portion of the cylindrical member, and the spring portion may be formed by removing a portion of the cylindrical member spirally with a laser. .

  ADVANTAGE OF THE INVENTION According to this invention, the technique which can perform the operation | work which matches a contact with the coaxial electrode of a connection electrode body quickly and correctly can be provided.

It is explanatory drawing for demonstrating schematic structure of the jig | tool for board | substrate inspection which concerns on this embodiment. It is a perspective view for demonstrating schematic structure of the jig | tool head of the board | substrate inspection jig | tool which concerns on this embodiment. It is explanatory drawing for demonstrating the cross-sectional structure of the jig | tool head of the jig | tool for board | substrate inspection which concerns on this embodiment. It is explanatory drawing for demonstrating schematic structure of the principal part of the jig | tool for board | substrate inspection which concerns on this embodiment. It is explanatory drawing for demonstrating the position shift of the connection terminal in the conventional board | substrate inspection jig | tool. It is explanatory drawing for demonstrating the planar structure of the spacer of the jig | tool for board | substrate inspection which concerns on this embodiment. It is explanatory drawing for demonstrating the cross-sectional structure of the guide hole of the spacer of the jig | tool for board | substrate inspection which concerns on this embodiment.

  Embodiments of a substrate inspection jig according to the present invention will be described below with reference to the drawings. First, an outline of a substrate inspection jig according to the present embodiment will be described with reference to FIG. In this example, a jig head 11, a connection electrode body 4, and an inspection signal processing unit 7 are shown. The jig head 11 is a part for connecting to the substrate to be inspected, and the connection electrode body 4 holds the jig head 11 and transmits and receives electrical signals between the contact and the inspection signal processing unit 7 described later. The inspection signal processing unit 7 is a part that transmits and receives electrical signals to a substrate inspection apparatus (not shown).

  The jig head 11 includes a plurality of contacts 2 and a holding body 3 that holds the contacts 2 in a multi-needle shape. The holding body 3 has an upper plate portion 31 and a lower plate portion 32. The connection electrode body 4 is provided with a plurality of coaxial electrodes 41. The lower end of the contact 2 is in electrical contact with the coaxial electrode 41. The coaxial electrode 41 and the inspection signal processing unit 7 are connected by a wire cable 71. The substrate to be inspected is disposed on the upper plate portion 31 of the holder 3. Here, an assembly including the jig head 11 that holds the contact 2 and the connection electrode body 4 is referred to as a board inspection jig.

  In the present application documents, the “substrate” is not limited to a printed wiring board, but includes various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. Further, it refers to an object for measuring a resistance value between inspection points, such as a semiconductor wafer including a substrate and having a wiring pattern formed thereon.

  The structure of the jig head 11 will be described in detail with reference to FIGS. 2A and 2B. The holding body 3 has an upper plate portion 31 and a lower plate portion 32. The upper plate portion 31 and the lower plate portion 32 are arranged in parallel with a predetermined interval through a support 33. A substrate 6 to be inspected is disposed on the upper plate portion 31. The lower plate portion 32 is provided with four positioning holes 341. The inner diameter of the positioning hole 341 is, for example, D = 2 mm. By inserting a positioning pin provided in the lower connection electrode body 4 (FIG. 1) into the positioning hole 341, the lower plate portion 32 and the connection electrode body 4 are fixed to each other.

  FIG. 2B shows a side configuration of the jig head 11. When the holding body 3 is assembled, the jig head 11 is assembled as shown in the figure by inserting the contact 2 through the hole of the lower plate portion 32 and further through the hole of the upper plate portion 31. The upper end portion 2 a of the contact 2 protrudes slightly from the upper surface of the upper plate portion 31, and the lower end portion 2 b of the contact 2 protrudes slightly from the lower surface of the lower plate portion 32. For this reason, during the inspection of the substrate 6, the upper end 2 a of the contact 2 can press the inspection point of the wiring pattern of the substrate 6, and the lower end 2 b of the contact 2 can press the coaxial electrode 41. Therefore, the inspection point of the substrate 6 to be inspected and the coaxial electrode 41 can be conducted through the contact 2. The detailed structure of the contact 2 will be described later with reference to FIG.

  The upper plate portion 31 and the lower plate portion 32 of the holding body 3 of the jig head 11 shown in FIGS. 2A and 2B are each composed of two plate members. As shown in the example of FIG. 3, it may be composed of two or three plate members.

  An example of the structure of the jig head of the board inspection jig according to the present embodiment will be described in detail with reference to FIG. The jig head 11 has an upper plate portion 31 and a lower plate portion 32. In the embodiment of FIG. 3, the upper plate portion 31 is formed by three plate-like members, and the lower plate portion 32 is formed by two plate-like members. The number is not limited to these numbers.

  The upper plate portion 31 includes a first upper plate portion 31a, a second upper plate portion 31b, and a third upper plate portion 31c. The first upper plate portion 31a is connected to the small hole portion 311 having an inner diameter slightly larger than the outer diameter of the insulating coating 24 of the contact 2 (the maximum outer diameter of the contact 2) and the small hole portion 311. In addition, a large hole portion 312 having an inner diameter larger than the inner diameter of the small hole portion 311 is provided. The inner diameter of the small hole portion 311 is slightly larger than the outer diameter of the insulating coating 24 of the contact 2, for example, 1 to 5 μm larger than the outer diameter of the insulating coating 24.

  The second upper plate portion 31 b is connected to and communicated with the large hole portion 312 of the first upper plate portion 31 a, and has a large hole portion 313 having the same inner diameter as that of the large hole portion 312, and communicated with the large hole portion 313. The small hole part 314 which has an inner diameter larger than the outer diameter of the cylindrical member 23 of the contactor 2 and smaller than the outer diameter of the insulating coating 24 of the contactor 2 is connected. Since the small hole portion 314 is provided, the contact 2 does not come out of the upper plate portion 31.

  The third upper plate portion 31c is connected to the small hole portion 314 of the second upper plate portion 31b, and has a small hole portion 315 having the same inner diameter as the small hole portion 314, and is connected to the small hole portion 315. In addition, a large hole portion 316 having an inner diameter larger than the inner diameter of the small hole portion 315 is provided. In addition, the size of the inner diameter of the large hole portion 316 is not particularly limited, and can be formed according to the wiring pattern 61 formed on the substrate 6.

  The lower plate portion 32 is formed of two plate-like members, a first lower plate portion 32a and a second lower plate portion 32b. The first lower plate portion 32 a is formed with a guide hole 321 for inserting the contact 2 and guiding it to the coaxial electrode 41. The guide hole 321 has an inner diameter larger than the outer diameter of the insulating coating 24 of the contact 2 and larger than the inner diameter of the small hole portion 311 of the first upper plate portion 31a. By forming the guide hole 321 in this manner, the contact 2 is inserted into the guide hole 321 and held by the jig head 11.

  The second lower plate portion 32b is connected to the guide hole 321 of the first lower plate portion 32a, is connected to the small hole portion 322 having the same diameter as the guide hole 321, and is connected to the small hole portion 322. A large hole portion 323 having an inner diameter larger than the inner diameter of the small hole portion 322 is provided.

  The contact 2 has a rod-shaped core member 21 and a cylindrical member 23 outside thereof. The periphery of the core material 21 is covered with an insulating coating 22. The core material 21 is formed in a thin rod shape having flexibility and can be bent (buckle).

  The tips of both end portions 21a and 21b of the core material 21 may be formed in a curved surface such as a hemispherical surface. By forming in this way, it is possible to make contact with the inspection point or the contact surface of the coaxial electrode 41 with high positional accuracy. Thus, it becomes possible to contact the coaxial electrode 41 reliably and stably by setting it as a curved surface (spherical surface) shape.

  The length in the major axis direction of the core material 21 may be 3 to 5 cm, and the outer diameter of the core material 21 may be 30 to 70 μm. The core material 21 is formed of a conductive material such as tungsten (W) or beryllium copper (CuBe).

  The cylindrical member 23 includes an upper end portion 23a, a spiral spring portion 23b, a cylindrical portion 23c, a spiral spring portion 23d, and a lower end portion 23e in order from the substrate 6. A part of the cylindrical member 23, for example, the periphery of the cylindrical portion 23c and the lower end portion 23e is covered with an insulating coating 24. Since the cylindrical member 23 has the spring parts 23b and 23d, the dimension between the both ends can shrink. The cylindrical member 23 is connected to the core member 21 at the lower end 23e. Therefore, the lower end portion 23 e of the cylindrical member 23 forms an integral structure with the core material 21. On the other hand, the upper end portion 23a and the cylindrical portion 23c of the cylindrical member 23 move relative to the core member 21 as the spring portions 23b and 23d expand and contract.

  The length (natural length) of the cylindrical member 23 in the major axis direction is slightly larger than the length of the core member 21 in the major axis direction. The inner diameter of the cylindrical member 23 is slightly larger than the outer diameter of the core member 21. The cylindrical member 23 is formed of a conductive material such as nickel (Ni) or a nickel alloy. The formation method of the spring parts 23b and 23d of the cylindrical member 23 is not particularly limited. For example, the spring portions 23b and 23d may be formed by removing the cylindrical member 23 spirally with a laser or the like at a predetermined portion of the cylindrical member 23. In this method, since the spring portions 23b and 23d are formed integrally with a part of the cylindrical member 23, it is not necessary to assemble a plurality of parts unlike the outer member of the conventional probe.

  The thickness of the insulating coatings 22 and 24 may be, for example, 5 to 10 μm. The insulating coatings 22 and 24 are formed of a resin material such as Teflon (registered trademark) or polyurethane.

  The connection electrode body 4 is provided with a coaxial electrode 41. The coaxial electrode 41 includes a rod-shaped center electrode 41a and an outer cylindrical electrode 41b. An insulating material is loaded between the center electrode 41a and the cylindrical electrode 41b. The coaxial electrode 41 is exposed on the upper surface of the connection electrode body 4. In addition, this exposure can also be formed using plating.

  According to the present embodiment, the positioning spacer 5 is provided between the lower plate portion 32 of the jig head 11 and the connection electrode body 4. The positioning spacer 5 is attached to the surface of the connection electrode body 4 when the substrate inspection jig is assembled, and then the jig head 11 is attached. The positioning spacer 5 is provided with the same number of guide holes 51 as the coaxial electrode 41. The guide hole 51 is formed in a circular shape, and is arranged along the central axis of the coaxial electrode 41 (concentrically). Therefore, the positioning spacer 5 is formed with a plurality of guide holes 51 having a pattern similar to the pattern in which the coaxial electrode 41 is disposed. The guide hole 51 has a diameter (or substantially the same diameter) slightly larger than the outer diameter of the coaxial electrode 41 or a diameter (or substantially the same diameter) slightly larger than the outer diameter of the cylindrical member 23 of the contact 2. ).

  The positioning spacer 5 is formed to have a thickness that is at least longer than the protruding length of the coaxial electrode 41 from the surface of the connection electrode body 4.

  As illustrated, it is preferable that a taper is formed on the inner surface of the guide hole 51. The taper surface 51A of the guide hole 51 has a function of aligning the center axis direction of the contact 2 and the coaxial electrode 41 when assembling the substrate inspection jig, which will be described later.

  The structure of the positioning spacer 5 will be described with reference to FIG. A plurality of guide holes 51 are provided in the center of the positioning spacer 5. The distance (pitch) between the adjacent guide holes 51 corresponds to the inspection pitch of the substrate, and is, for example, p = 100 to 150 μm.

  Positioning holes 52 are provided at the four corners of the positioning spacer 5. The positioning hole 52 is formed corresponding to the positioning hole 341 of the lower plate portion 32 shown in FIG. 2A. The inner diameter of the positioning hole 52 is, for example, D = 2 mm.

  The structure of the guide hole 51 of the positioning spacer 5 will be described with reference to FIG. The positioning spacer 5 may be formed of a film such as polymer resin, and the guide hole 51 may be formed by laser processing. The thickness of the positioning spacer 5 is, for example, h = 40 to 60 μm, and preferably about 50 μm. The inclination angle of the tapered surface of the guide hole 51 is at least greater than 45 degrees, preferably greater than 60 degrees. The inclination angle of the tapered surface of the guide hole 51 corresponds to the divergence angle of the laser beam.

  The inner diameter of the upper end 51a of the guide hole 51 is, for example, d1 = 80 to 100 μm, preferably about 90 ± 1 μm, and the inner diameter of the lower end 51b is 16 to 20 μm smaller than the inner diameter of the upper end 51a. D2 = 72 ± 1 μm.

  Next, a method for assembling the board inspection jig will be described. The upper plate portion 31 and the lower plate portion 32 are integrally assembled to form the holding body 3 (FIG. 1). However, the connection electrode body 4 is not yet assembled to the holding body 3. First, the contact 2 is inserted through the hole 321 in the lower lower plate portion 32, and then inserted into the hole 311 in the upper upper plate portion 31 (state shown in FIG. 2B). Next, the positioning spacer 5 is disposed on the surface of the connection electrode body 4. Then, the connection electrode body 4 is mounted so that the surface of the positioning spacer 5 and the surface of the lower plate portion 32 come into contact with each other. At this time, positioning is performed by using the positioning pins 34 to be inserted through the positioning holes 341 of the connection electrode body 4 and the positioning holes of the lower plate portion 32. As a result, the lower plate portion 32 and the connection electrode body 4 are held at predetermined positions. Thus, a substrate inspection jig comprising the jig head 11 and the connection electrode body 4 is assembled. At this time, at the lower end portion of the contact 2, the lower end portion 21 b of the core member 21 contacts the center electrode 41 a of the coaxial electrode 41, and the lower end portion 23 e of the cylindrical member 23 contacts the cylindrical electrode 41 b of the coaxial electrode 41. Thus, the conductive connection is established.

  When actual inspection is performed, the substrate inspection jig is disposed above or below the substrate 6 to be inspected (arranged below the substrate in the embodiment of FIG. 3). Solder bumps or wiring patterns 61 are formed on the substrate 6. A substrate inspection jig composed of the jig head 11 and the connection electrode body 4 is moved toward the surface of the substrate 6 on which the wiring pattern 61 is formed. Thus, at the upper end portion of the contact 2, the upper end portion 21 a of the core member 21 and the upper end portion 23 a of the cylindrical member 23 are simultaneously in contact with the wiring pattern 61 of the substrate 6.

  When the substrate inspection jig is further moved toward the surface of the substrate 6, the cylindrical member 23 contracts and the core member 21 bends. Therefore, the contact 2 is sandwiched between the coaxial electrode 41 and the inspection point of the substrate 6 to be inspected.

  At the upper end portion of the contact 2, the upper end portion 21 a of the core member 21 and the upper end portion 23 a of the cylindrical member 23 are pressed against the inspection point of the substrate 6 by a predetermined elastic force. At the lower end of the contact 2, the lower end 21 b of the core member 21 and the lower end 23 e of the cylindrical member 23 are pressed against the center electrode 41 a and the cylindrical electrode 41 b of the coaxial electrode 41 by a predetermined elastic force, respectively. . With such a pressing force, both ends of the contact 2 are stably in contact with the inspection point of the substrate 6 to be inspected and the coaxial electrode 41, respectively.

  In order to explain the effect of the prayer inspection jig of the present embodiment shown in FIG. 3, here, with reference to FIG. 4, between the contact 2 and the coaxial electrode 41 in the conventional board inspection jig. Explain the deviation. Since the inner diameter of the hole 321 of the lower plate portion 32 is set sufficiently larger than the outer diameter of the contact 2, the contact 2 can swing in the lateral direction within the hole 321 of the lower plate portion 32. In such a case, the center axis of the contact 2 is shifted from the center axis of the coaxial electrode 41. In the illustrated example, it is shifted by δ. Further, in such a fine jig, a positional shift due to a manufacturing error or an assembly error occurs. For example, when the center axis of the jig head 11 and the center axis of the coaxial electrode 41 are slightly shifted, the center axis of the contact 2 may be misaligned with respect to the center axis of the coaxial electrode 41. In such a case, since the inner diameter of the guide hole 321 of the lower plate portion 32 is set sufficiently larger than the outer diameter of the contact 2, the contact 2 extends in the lateral direction within the hole 321 of the lower plate 32. Oscillation occurs, and the central axis of the contact 2 is shifted from the central axis of the coaxial electrode 41.

  When the center axis is deviated in this way, as shown in the drawing, a contact error or a contact failure occurs at the lower end portion of the contact, and the lower end portion 21b of the core member 21 is connected to the center electrode 41a of the coaxial electrode 41. In some cases, such as contact with the center electrode 41a and the cylindrical electrode 41b of the coaxial electrode 41 may occur. Furthermore, a poor contact between the lower end portion 23e of the cylindrical member 23 and the coaxial electrode 41 may occur.

  However, according to the present embodiment, the positioning spacer 5 is provided between the lower plate portion 32 of the jig head 11 and the connection electrode body 4. A guide hole 51 is provided in the positioning spacer 5. When the connection electrode body 4 is attached to the jig head 11 to which the contact 2 is mounted, even if the lower end of the contact 2 is displaced from the central axis of the coaxial electrode 41, the guide hole 51 of the positioning spacer 5 is The diameter is slightly larger than the coaxial electrode 41 (or substantially the same diameter), or a diameter slightly larger than the outer diameter of the cylindrical member 23 of the contactor 2 (or substantially the same diameter). For this reason, the contact 2 is guided by the guide hole 51 and guided to the coaxial electrode 41, and the above-described deviation does not occur.

  Furthermore, when the side surface of the guide hole 51 of the positioning spacer 5 is formed as a taper surface, the contact 2 is guided to the coaxial electrode 41 while abutting against the taper surface. It can be prevented from occurring. That is, the taper surface restricts the path of the contact 2 and guides the lower end of the contact 2 in the direction of the central axis of the coaxial electrode.

  According to the present embodiment, the tip of the contact 2 is guided by the tapered surface of the guide hole 51 of the positioning spacer 5, so that the contact 2 can be easily aligned with the central axis of the coaxial electrode 41.

  Although the embodiment of the substrate inspection jig according to the present invention has been described above, the present invention is not limited to the above-described example, and various modifications are possible within the scope of the invention described in the claims. It will be readily understood by those skilled in the art.

  DESCRIPTION OF SYMBOLS 2 ... Contact, 2a ... Upper end part of a contactor, 2b ... Lower end part of a contactor, 3 ... Holding body, 4 ... Connection electrode body, 5 ... Positioning spacer, 6 ... Substrate, 7 ... Inspection signal processing part, 11 DESCRIPTION OF SYMBOLS ... Jig head, 21 ... Core material, 21a ... Upper end part of core material, 21b ... Lower end part of core material, 22 ... Insulating coating, 23 ... Cylindrical member, 23a ... Upper end part of cylindrical member, 23b ... Spring part 23c ... cylindrical part, 23d ... spring part of cylindrical member, 23e ... lower end part of cylindrical member, 24 ... insulating coating, 31 ... upper plate part, 32 ... lower plate part, 33 ... post, 34 ... positioning pin, DESCRIPTION OF SYMBOLS 41 ... Coaxial electrode, 41a ... Center electrode, 41b ... Cylindrical electrode, 51 ... Guide hole, 51a ... Upper end part of a guide hole, 51b ... Lower end part of a guide hole, 52 ... Positioning hole, 61 ... Wiring pattern, 71 ... Wire cable 311 ... hole, 321 ... hole, 341 ... positioning hole

Claims (8)

Substrate inspection for 4-terminal measurement having a jig head having a contact and an upper plate portion and a lower plate portion each provided with a hole through which the contact is inserted, and a connection electrode body having a coaxial electrode For jigs,
The contact has a core and a cylindrical member outside the core, and the coaxial electrode has a center electrode and a cylindrical electrode outside the center electrode, and the contact core and cylindrical One end of the member is in contact with the inspection point of the substrate to be inspected, and the core of the contact and the other end of the cylindrical member are in contact with the center electrode and the cylindrical electrode of the coaxial electrode, respectively. Is configured to
A positioning spacer is inserted between the lower plate portion and the electrode portion. The positioning spacer is provided with a hole through which the contact is inserted, and the coaxial electrode is disposed in the hole. Being
The substrate inspection jig, wherein the hole is formed to have a diameter slightly larger than the coaxial electrode or a diameter slightly larger than an outer diameter of a cylindrical member of the contact.   The substrate inspection jig according to claim 1, wherein a tapered surface is formed on a side surface of the hole. The substrate inspection jig according to claim 1 or 2,
A substrate inspection jig, wherein the positioning spacer has a thickness of 40 to 60 μm. In the board inspection jig according to any one of claims 1 to 3,
The inner diameter of the upper end of the hole of the positioning spacer is d1 = 80 to 100 μm, and the inner diameter d2 of the lower end of the hole is 16 to 20 μm smaller than the inner diameter d1 of the upper end of the hole. . In the board inspection jig according to any one of claims 1 to 4,
The substrate inspection jig, wherein an inclination angle of a taper surface of the hole of the positioning spacer with respect to a surface perpendicular to a central axis of the coaxial electrode is larger than 60 degrees. In the substrate inspection jig according to any one of claims 1 to 5,
A substrate inspection jig, wherein the positioning spacer is formed of a polymer resin. In the board inspection jig according to any one of claims 1 to 6,
A substrate inspection jig, wherein the positioning spacer hole is formed by laser processing. In the board inspection jig according to any one of claims 1 to 7,
A spiral spring portion is formed on a portion of the cylindrical member, and the spring portion is formed by removing a portion of the cylindrical member spirally with a laser. Ingredients.

Images