SG11201506001VA - Polishing composition, method for producing polishing composition and method for producing polished article - Google Patents
Polishing composition, method for producing polishing composition and method for producing polished articleInfo
- Publication number
- SG11201506001VA SG11201506001VA SG11201506001VA SG11201506001VA SG11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- producing
- polished article
- article
- producing polished
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013026020 | 2013-02-13 | ||
| PCT/JP2014/053065 WO2014126051A1 (ja) | 2013-02-13 | 2014-02-10 | 研磨用組成物、研磨用組成物製造方法および研磨物製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201506001VA true SG11201506001VA (en) | 2015-09-29 |
Family
ID=51354053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201506001VA SG11201506001VA (en) | 2013-02-13 | 2014-02-10 | Polishing composition, method for producing polishing composition and method for producing polished article |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150376464A1 (ja) |
| EP (1) | EP2957613B1 (ja) |
| JP (2) | JP5897200B2 (ja) |
| KR (1) | KR102226441B1 (ja) |
| CN (1) | CN104995277B (ja) |
| SG (1) | SG11201506001VA (ja) |
| TW (1) | TWI624536B (ja) |
| WO (1) | WO2014126051A1 (ja) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102330030B1 (ko) | 2013-03-19 | 2021-11-24 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물, 연마용 조성물 제조 방법 및 연마용 조성물 조제용 키트 |
| US10717899B2 (en) | 2013-03-19 | 2020-07-21 | Fujimi Incorporated | Polishing composition, method for producing polishing composition and polishing composition preparation kit |
| JP6314019B2 (ja) * | 2014-03-31 | 2018-04-18 | ニッタ・ハース株式会社 | 半導体基板の研磨方法 |
| JP6185432B2 (ja) * | 2014-06-24 | 2017-08-23 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| EP3227098B1 (en) * | 2014-12-05 | 2022-06-15 | 3M Innovative Properties Company | Abrasive composition |
| JP6829191B2 (ja) * | 2015-05-08 | 2021-02-10 | 株式会社フジミインコーポレーテッド | 研磨方法 |
| JP6582601B2 (ja) * | 2015-06-22 | 2019-10-02 | 日立化成株式会社 | 研磨液、貯蔵液及び研磨方法 |
| WO2017002433A1 (ja) * | 2015-07-01 | 2017-01-05 | 東亞合成株式会社 | 研磨用濡れ剤及び研磨液組成物 |
| WO2017189453A1 (en) | 2016-04-28 | 2017-11-02 | Natureworks Llc | Polymer foam insulation structure having a facing of a multi-layer sheet that contains a heat resistant polymer layer and a polylactide resin layer |
| KR102442003B1 (ko) * | 2016-10-28 | 2022-09-07 | 가부시키가이샤 도쿠야마 | 흄드 실리카 및 그 제조 방법 |
| JP6792413B2 (ja) * | 2016-10-31 | 2020-11-25 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| CN109996853A (zh) * | 2016-11-22 | 2019-07-09 | 福吉米株式会社 | 研磨用组合物 |
| US20200010727A1 (en) * | 2017-02-20 | 2020-01-09 | Fujimi Incorporated | Intermediate polishing composition for silicon substrate and polishing composition set for silicon substrate |
| JP6879798B2 (ja) * | 2017-03-30 | 2021-06-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP7074525B2 (ja) | 2017-03-30 | 2022-05-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| WO2018216733A1 (ja) * | 2017-05-26 | 2018-11-29 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびこれを用いた研磨方法 |
| CH713822A2 (fr) * | 2017-05-29 | 2018-11-30 | Swatch Group Res & Dev Ltd | Dispositif et procédé d'ajustement de marche et correction d'état d'une montre. |
| CN110914958B (zh) * | 2017-07-21 | 2023-08-11 | 福吉米株式会社 | 基板的研磨方法及研磨用组合物套组 |
| US11649377B2 (en) * | 2017-08-14 | 2023-05-16 | Resonac Corporation | Polishing liquid, polishing liquid set and polishing method |
| JP6929239B2 (ja) * | 2018-03-30 | 2021-09-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JPWO2020009055A1 (ja) * | 2018-07-04 | 2021-08-05 | 住友精化株式会社 | 研磨用組成物 |
| JP7424768B2 (ja) * | 2019-08-08 | 2024-01-30 | 株式会社フジミインコーポレーテッド | 研磨用添加剤含有液の濾過方法、研磨用添加剤含有液、研磨用組成物、研磨用組成物の製造方法およびフィルタ |
| EP3792327A1 (en) * | 2019-09-11 | 2021-03-17 | Fujimi Incorporated | Polishing composition, polishing method and method for manufacturing semiconductor substrate |
| CN112175524B (zh) * | 2020-09-21 | 2022-02-15 | 万华化学集团电子材料有限公司 | 一种蓝宝石抛光组合物及其应用 |
| KR102492236B1 (ko) * | 2020-12-17 | 2023-01-26 | 에스케이실트론 주식회사 | 연마장치 및 웨이퍼의 연마방법 |
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| JP2001185516A (ja) * | 1999-12-24 | 2001-07-06 | Kao Corp | 研磨助剤 |
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| JP4212861B2 (ja) * | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法 |
| JP4668528B2 (ja) | 2003-09-05 | 2011-04-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
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| EP1747849A1 (en) * | 2004-05-19 | 2007-01-31 | Nissan Chemical Industries, Ltd. | Composition for polishing |
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| JP5026665B2 (ja) * | 2004-10-15 | 2012-09-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP4027929B2 (ja) * | 2004-11-30 | 2007-12-26 | 花王株式会社 | 半導体基板用研磨液組成物 |
| JP2006352043A (ja) * | 2005-06-20 | 2006-12-28 | Nitta Haas Inc | 半導体研磨用組成物 |
| JP2007073548A (ja) * | 2005-09-02 | 2007-03-22 | Fujimi Inc | 研磨方法 |
| JP2007095946A (ja) * | 2005-09-28 | 2007-04-12 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| TW200734436A (en) * | 2006-01-30 | 2007-09-16 | Fujifilm Corp | Metal-polishing liquid and chemical mechanical polishing method using the same |
| JP2007214205A (ja) * | 2006-02-07 | 2007-08-23 | Fujimi Inc | 研磨用組成物 |
| JP5335183B2 (ja) * | 2006-08-24 | 2013-11-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP5204960B2 (ja) * | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP2008091524A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
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| EP2237311A4 (en) * | 2008-02-01 | 2011-11-30 | Fujimi Inc | POLISHING COMPOSITION AND POLISHING METHOD THEREFOR |
| US9202709B2 (en) * | 2008-03-19 | 2015-12-01 | Fujifilm Corporation | Polishing liquid for metal and polishing method using the same |
| JP2009231486A (ja) * | 2008-03-21 | 2009-10-08 | Kao Corp | シリコンウエハ用研磨液組成物 |
| WO2009154164A1 (ja) * | 2008-06-18 | 2009-12-23 | 株式会社 フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP5474400B2 (ja) | 2008-07-03 | 2014-04-16 | 株式会社フジミインコーポレーテッド | 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法 |
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| US20100164106A1 (en) * | 2008-12-31 | 2010-07-01 | Cheil Industries Inc. | CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method |
| JP2011171689A (ja) * | 2009-07-07 | 2011-09-01 | Kao Corp | シリコンウエハ用研磨液組成物 |
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| JP5441578B2 (ja) * | 2009-09-11 | 2014-03-12 | 花王株式会社 | 研磨液組成物 |
| JP5321430B2 (ja) * | 2009-12-02 | 2013-10-23 | 信越半導体株式会社 | シリコンウェーハ研磨用研磨剤およびシリコンウェーハの研磨方法 |
| JP5492603B2 (ja) * | 2010-03-02 | 2014-05-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP5544244B2 (ja) * | 2010-08-09 | 2014-07-09 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP2012079964A (ja) * | 2010-10-04 | 2012-04-19 | Nissan Chem Ind Ltd | 半導体ウェーハ用研磨液組成物 |
| US20130302984A1 (en) * | 2011-01-26 | 2013-11-14 | Fujimi Incorporated | Polishing composition, polishing method using same, and substrate production method |
| US20140154884A1 (en) * | 2011-05-24 | 2014-06-05 | Kuraray Co., Ltd. | Erosion inhibitor for chemical mechanical polishing, slurry for chemical mechanical polishing, and chemical mechanical polishing method |
| JP2014041978A (ja) * | 2012-08-23 | 2014-03-06 | Fujimi Inc | 研磨用組成物、研磨用組成物の製造方法、及び研磨用組成物原液の製造方法 |
-
2014
- 2014-02-10 EP EP14751996.1A patent/EP2957613B1/en active Active
- 2014-02-10 WO PCT/JP2014/053065 patent/WO2014126051A1/ja active Application Filing
- 2014-02-10 KR KR1020157024572A patent/KR102226441B1/ko active IP Right Grant
- 2014-02-10 SG SG11201506001VA patent/SG11201506001VA/en unknown
- 2014-02-10 JP JP2015500230A patent/JP5897200B2/ja active Active
- 2014-02-10 US US14/767,494 patent/US20150376464A1/en not_active Abandoned
- 2014-02-10 CN CN201480008802.5A patent/CN104995277B/zh active Active
- 2014-02-12 TW TW103104570A patent/TWI624536B/zh active
-
2016
- 2016-03-01 JP JP2016038583A patent/JP6387032B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2014126051A1 (ja) | 2017-02-02 |
| EP2957613A1 (en) | 2015-12-23 |
| EP2957613B1 (en) | 2020-11-18 |
| EP2957613A4 (en) | 2016-11-09 |
| JP6387032B2 (ja) | 2018-09-05 |
| WO2014126051A1 (ja) | 2014-08-21 |
| TW201443212A (zh) | 2014-11-16 |
| CN104995277A (zh) | 2015-10-21 |
| CN104995277B (zh) | 2018-05-08 |
| KR102226441B1 (ko) | 2021-03-12 |
| JP5897200B2 (ja) | 2016-03-30 |
| TWI624536B (zh) | 2018-05-21 |
| US20150376464A1 (en) | 2015-12-31 |
| KR20150119062A (ko) | 2015-10-23 |
| JP2016138278A (ja) | 2016-08-04 |
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