SG11201600863RA - Method for producing polished object and polishing composition kit - Google Patents
Method for producing polished object and polishing composition kitInfo
- Publication number
- SG11201600863RA SG11201600863RA SG11201600863RA SG11201600863RA SG11201600863RA SG 11201600863R A SG11201600863R A SG 11201600863RA SG 11201600863R A SG11201600863R A SG 11201600863RA SG 11201600863R A SG11201600863R A SG 11201600863RA SG 11201600863R A SG11201600863R A SG 11201600863RA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polished object
- composition kit
- producing polished
- producing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013166142 | 2013-08-09 | ||
| PCT/JP2014/065650 WO2015019706A1 (en) | 2013-08-09 | 2014-06-12 | Method for producing polished object and composition kit for polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201600863RA true SG11201600863RA (en) | 2016-03-30 |
Family
ID=52461049
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201608517VA SG10201608517VA (en) | 2013-08-09 | 2014-06-12 | Method for producing polished object and polishing composition kit |
| SG11201600863RA SG11201600863RA (en) | 2013-08-09 | 2014-06-12 | Method for producing polished object and polishing composition kit |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201608517VA SG10201608517VA (en) | 2013-08-09 | 2014-06-12 | Method for producing polished object and polishing composition kit |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9685343B2 (en) |
| JP (1) | JP6068647B2 (en) |
| KR (1) | KR102144758B1 (en) |
| CN (1) | CN105451940B (en) |
| DE (1) | DE112014003673T5 (en) |
| SG (2) | SG10201608517VA (en) |
| TW (1) | TWI599648B (en) |
| WO (1) | WO2015019706A1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015220924B4 (en) * | 2015-10-27 | 2018-09-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer with orientation notch, method for depositing a layer on a semiconductor wafer and semiconductor wafer |
| US11897081B2 (en) | 2016-03-01 | 2024-02-13 | Fujimi Incorporated | Method for polishing silicon substrate and polishing composition set |
| JP6602720B2 (en) * | 2016-04-04 | 2019-11-06 | グローバルウェーハズ・ジャパン株式会社 | Method for forming protective film on semiconductor substrate |
| WO2018088370A1 (en) * | 2016-11-09 | 2018-05-17 | 株式会社フジミインコーポレーテッド | Polishing composition and silicon wafer polishing method |
| JP6846193B2 (en) * | 2016-12-26 | 2021-03-24 | ニッタ・デュポン株式会社 | Polishing slurry |
| US10377014B2 (en) * | 2017-02-28 | 2019-08-13 | Ecolab Usa Inc. | Increased wetting of colloidal silica as a polishing slurry |
| JP6879798B2 (en) * | 2017-03-30 | 2021-06-02 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
| KR20190134692A (en) * | 2017-03-31 | 2019-12-04 | 가부시키가이샤 후지미인코퍼레이티드 | Polishing composition |
| JP6690606B2 (en) * | 2017-07-14 | 2020-04-28 | 信越半導体株式会社 | Polishing method |
| EP3731261A4 (en) * | 2017-12-22 | 2021-08-25 | Nissan Chemical Corporation | Composition for polishing for use in eliminating protrusion in periphery of laser mark |
| JP6929239B2 (en) * | 2018-03-30 | 2021-09-01 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
| EP3859768A4 (en) * | 2018-09-28 | 2022-06-22 | Fujimi Incorporated | Composition for polishing gallium oxide substrate |
| WO2020162144A1 (en) * | 2019-02-05 | 2020-08-13 | 株式会社フジミインコーポレーテッド | Polishing composition |
| JP2020203980A (en) * | 2019-06-17 | 2020-12-24 | 日本キャボット・マイクロエレクトロニクス株式会社 | Chemical mechanical polishing composition, rinse composition, chemical mechanical polishing method, and rinsing method |
| TW202129737A (en) | 2019-10-03 | 2021-08-01 | 日商日產化學股份有限公司 | Cation-containing polishing composition for eliminating protrusions at periphery of laser mark |
| CN111534235A (en) * | 2020-05-25 | 2020-08-14 | 深圳市佳欣纳米科技有限公司 | Polishing solution for stainless steel precision polishing |
| WO2022209758A1 (en) * | 2021-03-30 | 2022-10-06 | 株式会社フジミインコーポレーテッド | Polishing method, and polishing composition set |
| JP2022155989A (en) * | 2021-03-31 | 2022-10-14 | 株式会社フジミインコーポレーテッド | Substrate manufacturing method and surface treatment method |
| CN113561051B (en) * | 2021-07-28 | 2022-04-19 | 上海申和投资有限公司 | Wafer regeneration processing device and control system |
| JP7268808B1 (en) | 2021-10-14 | 2023-05-08 | 日産化学株式会社 | Post-polishing composition used after primary polishing of silicon wafer |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4719204B2 (en) * | 2000-08-21 | 2011-07-06 | 株式会社東芝 | Chemical mechanical polishing slurry and semiconductor device manufacturing method |
| KR100481651B1 (en) | 2000-08-21 | 2005-04-08 | 가부시끼가이샤 도시바 | Slurry for chemical mechanical polishing and method for manufacturing semiconductor device |
| JP4212861B2 (en) * | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | Polishing composition and silicon wafer polishing method using the same, and rinsing composition and silicon wafer rinsing method using the same |
| JP2004349426A (en) * | 2003-05-21 | 2004-12-09 | Jsr Corp | Chemical mechanical polishing method for sti |
| EP1841831B1 (en) * | 2005-01-24 | 2014-04-02 | Showa Denko K.K. | Polishing composition and polishing method |
| CN101491885B (en) * | 2008-01-24 | 2011-11-30 | 中芯国际集成电路制造(上海)有限公司 | Grinding method of wafer control slice |
| JP5288097B2 (en) * | 2008-02-27 | 2013-09-11 | Ｊｓｒ株式会社 | Chemical mechanical polishing aqueous dispersion, method for producing chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method |
| US8480920B2 (en) | 2009-04-02 | 2013-07-09 | Jsr Corporation | Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method |
| JP2010258418A (en) * | 2009-04-02 | 2010-11-11 | Jsr Corp | Chemical mechanical polishing aqueous dispersion preparation kit, and method for preparing the chemical mechanical polishing aqueous dispersion |
| JP5321430B2 (en) * | 2009-12-02 | 2013-10-23 | 信越半導体株式会社 | Polishing agent for polishing silicon wafer and polishing method for silicon wafer |
| JP5493956B2 (en) | 2010-02-10 | 2014-05-14 | 株式会社Ｓｕｍｃｏ | Manufacturing method of semiconductor wafer |
| JP2013110253A (en) * | 2011-11-21 | 2013-06-06 | Hitachi Chemical Co Ltd | Semiconductor substrate polishing solution and semiconductor substrate polishing method |
| JP2013140647A (en) * | 2011-12-28 | 2013-07-18 | Kao Corp | Method of manufacturing magnetic disk substrate |
| JP6357296B2 (en) * | 2012-02-10 | 2018-07-11 | 株式会社フジミインコーポレーテッド | Polishing composition and method for manufacturing semiconductor substrate |
-
2014
- 2014-06-12 KR KR1020167003055A patent/KR102144758B1/en active IP Right Grant
- 2014-06-12 JP JP2015530734A patent/JP6068647B2/en active Active
- 2014-06-12 SG SG10201608517VA patent/SG10201608517VA/en unknown
- 2014-06-12 WO PCT/JP2014/065650 patent/WO2015019706A1/en active Application Filing
- 2014-06-12 DE DE112014003673.0T patent/DE112014003673T5/en active Pending
- 2014-06-12 SG SG11201600863RA patent/SG11201600863RA/en unknown
- 2014-06-12 US US14/910,803 patent/US9685343B2/en active Active
- 2014-06-12 CN CN201480044741.8A patent/CN105451940B/en active Active
- 2014-06-27 TW TW103122261A patent/TWI599648B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| DE112014003673T5 (en) | 2016-05-12 |
| US9685343B2 (en) | 2017-06-20 |
| KR20160041911A (en) | 2016-04-18 |
| JPWO2015019706A1 (en) | 2017-03-02 |
| KR102144758B1 (en) | 2020-08-14 |
| TWI599648B (en) | 2017-09-21 |
| JP6068647B2 (en) | 2017-01-25 |
| TW201512381A (en) | 2015-04-01 |
| SG10201608517VA (en) | 2016-12-29 |
| CN105451940B (en) | 2018-12-11 |
| US20160189973A1 (en) | 2016-06-30 |
| CN105451940A (en) | 2016-03-30 |
| WO2015019706A1 (en) | 2015-02-12 |
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