SG10201608517VA - Method for producing polished object and polishing composition kit - Google Patents
Method for producing polished object and polishing composition kitInfo
- Publication number
- SG10201608517VA SG10201608517VA SG10201608517VA SG10201608517VA SG10201608517VA SG 10201608517V A SG10201608517V A SG 10201608517VA SG 10201608517V A SG10201608517V A SG 10201608517VA SG 10201608517V A SG10201608517V A SG 10201608517VA SG 10201608517V A SG10201608517V A SG 10201608517VA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- polished object
- composition kit
- producing polished
- producing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013166142 | 2013-08-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201608517VA true SG10201608517VA (en) | 2016-12-29 |
Family
ID=52461049
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600863RA SG11201600863RA (en) | 2013-08-09 | 2014-06-12 | Method for producing polished object and polishing composition kit |
SG10201608517VA SG10201608517VA (en) | 2013-08-09 | 2014-06-12 | Method for producing polished object and polishing composition kit |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600863RA SG11201600863RA (en) | 2013-08-09 | 2014-06-12 | Method for producing polished object and polishing composition kit |
Country Status (8)
Country | Link |
---|---|
US (1) | US9685343B2 (en) |
JP (1) | JP6068647B2 (en) |
KR (1) | KR102144758B1 (en) |
CN (1) | CN105451940B (en) |
DE (1) | DE112014003673T5 (en) |
SG (2) | SG11201600863RA (en) |
TW (1) | TWI599648B (en) |
WO (1) | WO2015019706A1 (en) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015220924B4 (en) | 2015-10-27 | 2018-09-27 | Siltronic Ag | Susceptor for holding a semiconductor wafer with orientation notch, method for depositing a layer on a semiconductor wafer and semiconductor wafer |
WO2017150158A1 (en) * | 2016-03-01 | 2017-09-08 | 株式会社フジミインコーポレーテッド | Method for polishing silicon substrate and polishing composition set |
JP6602720B2 (en) * | 2016-04-04 | 2019-11-06 | グローバルウェーハズ・ジャパン株式会社 | Method for forming protective film on semiconductor substrate |
JPWO2018088370A1 (en) * | 2016-11-09 | 2019-10-03 | 株式会社フジミインコーポレーテッド | Polishing composition and silicon wafer polishing method |
JP6846193B2 (en) * | 2016-12-26 | 2021-03-24 | ニッタ・デュポン株式会社 | Polishing slurry |
US10377014B2 (en) * | 2017-02-28 | 2019-08-13 | Ecolab Usa Inc. | Increased wetting of colloidal silica as a polishing slurry |
JP6879798B2 (en) * | 2017-03-30 | 2021-06-02 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
CN110462797B (en) * | 2017-03-31 | 2023-09-22 | 福吉米株式会社 | Polishing composition |
JP6690606B2 (en) * | 2017-07-14 | 2020-04-28 | 信越半導体株式会社 | Polishing method |
US20200317955A1 (en) * | 2017-12-22 | 2020-10-08 | Nissan Chemical Corporation | Composition for polishing for use in eliminating protrusion in periphery of laser mark |
JP6929239B2 (en) * | 2018-03-30 | 2021-09-01 | 株式会社フジミインコーポレーテッド | Polishing composition and polishing method |
JP7455066B2 (en) * | 2018-09-28 | 2024-03-25 | 株式会社フジミインコーポレーテッド | Composition for polishing gallium oxide substrates |
WO2020162144A1 (en) * | 2019-02-05 | 2020-08-13 | 株式会社フジミインコーポレーテッド | Polishing composition |
JP2020203980A (en) * | 2019-06-17 | 2020-12-24 | 日本キャボット・マイクロエレクトロニクス株式会社 | Chemical mechanical polishing composition, rinse composition, chemical mechanical polishing method, and rinsing method |
MY191198A (en) | 2019-10-03 | 2022-06-07 | Nissan Chemical Corp | Cation-containing polishing composition for eliminating protrusions at periphery of laser mark |
CN111534235A (en) * | 2020-05-25 | 2020-08-14 | 深圳市佳欣纳米科技有限公司 | Polishing solution for stainless steel precision polishing |
WO2022209758A1 (en) * | 2021-03-30 | 2022-10-06 | 株式会社フジミインコーポレーテッド | Polishing method, and polishing composition set |
JP2022155989A (en) * | 2021-03-31 | 2022-10-14 | 株式会社フジミインコーポレーテッド | Substrate manufacturing method and surface treatment method |
CN113561051B (en) * | 2021-07-28 | 2022-04-19 | 上海申和投资有限公司 | Wafer regeneration processing device and control system |
TW202334338A (en) | 2021-10-14 | 2023-09-01 | 日商日產化學股份有限公司 | Composition for post-polishing to be used after primary polishing of silicon wafers |
CN117116740A (en) * | 2023-08-02 | 2023-11-24 | 山东有研半导体材料有限公司 | Processing technology of large-size wafer edge |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100481651B1 (en) | 2000-08-21 | 2005-04-08 | 가부시끼가이샤 도시바 | Slurry for chemical mechanical polishing and method for manufacturing semiconductor device |
JP4719204B2 (en) * | 2000-08-21 | 2011-07-06 | 株式会社東芝 | Chemical mechanical polishing slurry and semiconductor device manufacturing method |
JP4212861B2 (en) * | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | Polishing composition and silicon wafer polishing method using the same, and rinsing composition and silicon wafer rinsing method using the same |
JP2004349426A (en) | 2003-05-21 | 2004-12-09 | Jsr Corp | Chemical mechanical polishing method for sti |
US8592314B2 (en) | 2005-01-24 | 2013-11-26 | Showa Denko K.K. | Polishing composition and polishing method |
CN101491885B (en) * | 2008-01-24 | 2011-11-30 | 中芯国际集成电路制造(上海)有限公司 | Grinding method of wafer control slice |
JP5288097B2 (en) | 2008-02-27 | 2013-09-11 | Jsr株式会社 | Chemical mechanical polishing aqueous dispersion, method for producing chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method |
US8480920B2 (en) | 2009-04-02 | 2013-07-09 | Jsr Corporation | Chemical mechanical polishing aqueous dispersion, method of preparing the same, chemical mechanical polishing aqueous dispersion preparation kit, and chemical mechanical polishing method |
JP2010258418A (en) * | 2009-04-02 | 2010-11-11 | Jsr Corp | Chemical mechanical polishing aqueous dispersion preparation kit, and method for preparing the chemical mechanical polishing aqueous dispersion |
JP5321430B2 (en) * | 2009-12-02 | 2013-10-23 | 信越半導体株式会社 | Polishing agent for polishing silicon wafer and polishing method for silicon wafer |
JP5493956B2 (en) | 2010-02-10 | 2014-05-14 | 株式会社Sumco | Manufacturing method of semiconductor wafer |
JP2013110253A (en) * | 2011-11-21 | 2013-06-06 | Hitachi Chemical Co Ltd | Semiconductor substrate polishing solution and semiconductor substrate polishing method |
JP2013140647A (en) * | 2011-12-28 | 2013-07-18 | Kao Corp | Method of manufacturing magnetic disk substrate |
JP6357296B2 (en) * | 2012-02-10 | 2018-07-11 | 株式会社フジミインコーポレーテッド | Polishing composition and method for manufacturing semiconductor substrate |
-
2014
- 2014-06-12 CN CN201480044741.8A patent/CN105451940B/en active Active
- 2014-06-12 KR KR1020167003055A patent/KR102144758B1/en active IP Right Grant
- 2014-06-12 SG SG11201600863RA patent/SG11201600863RA/en unknown
- 2014-06-12 WO PCT/JP2014/065650 patent/WO2015019706A1/en active Application Filing
- 2014-06-12 US US14/910,803 patent/US9685343B2/en active Active
- 2014-06-12 SG SG10201608517VA patent/SG10201608517VA/en unknown
- 2014-06-12 JP JP2015530734A patent/JP6068647B2/en active Active
- 2014-06-12 DE DE112014003673.0T patent/DE112014003673T5/en active Pending
- 2014-06-27 TW TW103122261A patent/TWI599648B/en active
Also Published As
Publication number | Publication date |
---|---|
WO2015019706A1 (en) | 2015-02-12 |
US9685343B2 (en) | 2017-06-20 |
US20160189973A1 (en) | 2016-06-30 |
JP6068647B2 (en) | 2017-01-25 |
SG11201600863RA (en) | 2016-03-30 |
TW201512381A (en) | 2015-04-01 |
TWI599648B (en) | 2017-09-21 |
CN105451940B (en) | 2018-12-11 |
DE112014003673T5 (en) | 2016-05-12 |
CN105451940A (en) | 2016-03-30 |
KR102144758B1 (en) | 2020-08-14 |
JPWO2015019706A1 (en) | 2017-03-02 |
KR20160041911A (en) | 2016-04-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG11201600863RA (en) | Method for producing polished object and polishing composition kit | |
SG11201507438YA (en) | Polishing composition, method for producing polishing composition and polishing composition preparation kit | |
SG11201506296VA (en) | Polishing composition and method for producing polished article | |
SG11201506001VA (en) | Polishing composition, method for producing polishing composition and method for producing polished article | |
SG10201405189QA (en) | Polishing method and polishing apparatus | |
SG10201407062PA (en) | Polishing apparatus and polishing method | |
ZA201604565B (en) | Abrasive cleaning composition | |
SG10201406355RA (en) | Polishing method | |
SI2976184T2 (en) | Honing method and honing tool | |
SG11201600812PA (en) | Polishing device and polishing method | |
SG11201507532PA (en) | Methods of polishing sapphire surfaces | |
SG11201500924PA (en) | Polishing composition and method for producing substrate | |
SG11201405708VA (en) | Polishing method | |
SG11201601292RA (en) | Polishing composition and method for producing same | |
EP2974829A4 (en) | Polishing pad and polishing method | |
SG11201406031YA (en) | Polishing pad and method for producing polishing pad | |
SG11201601847WA (en) | Polishing composition | |
EP3024015A4 (en) | Metallic polishing pad and production method therefor | |
SG10201407984XA (en) | Polishing apparatus | |
SG11201601265YA (en) | Polishing Composition and Method for Producing Same | |
SG11201601941SA (en) | Polishing composition | |
EP2693459A4 (en) | Polishing composition and polishing method | |
SG11201608128UA (en) | Polishing composition and polishing method | |
SG10201407798XA (en) | Polishing apparatus | |
SG10201406812YA (en) | Polishing method and polishing apparatus |