SG10201406812YA - Polishing method and polishing apparatus - Google Patents

Polishing method and polishing apparatus

Info

Publication number
SG10201406812YA
SG10201406812YA SG10201406812YA SG10201406812YA SG10201406812YA SG 10201406812Y A SG10201406812Y A SG 10201406812YA SG 10201406812Y A SG10201406812Y A SG 10201406812YA SG 10201406812Y A SG10201406812Y A SG 10201406812YA SG 10201406812Y A SG10201406812Y A SG 10201406812YA
Authority
SG
Singapore
Prior art keywords
polishing
polishing apparatus
polishing method
Prior art date
Application number
SG10201406812YA
Inventor
Hiromitsu Watanabe
Kuniaki Yamaguchi
Itsuki Kobata
Yutaka Wada
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10201406812YA publication Critical patent/SG10201406812YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG10201406812YA 2013-10-23 2014-10-21 Polishing method and polishing apparatus SG10201406812YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013220327A JP6140051B2 (en) 2013-10-23 2013-10-23 Polishing method and polishing apparatus

Publications (1)

Publication Number Publication Date
SG10201406812YA true SG10201406812YA (en) 2015-05-28

Family

ID=53013043

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201707376TA SG10201707376TA (en) 2013-10-23 2014-10-21 Polishing method and polishing apparatus
SG10201406812YA SG10201406812YA (en) 2013-10-23 2014-10-21 Polishing method and polishing apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG10201707376TA SG10201707376TA (en) 2013-10-23 2014-10-21 Polishing method and polishing apparatus

Country Status (6)

Country Link
US (2) US20150140907A1 (en)
JP (2) JP6140051B2 (en)
KR (2) KR102189477B1 (en)
CN (1) CN104552008B (en)
SG (2) SG10201707376TA (en)
TW (1) TWI645938B (en)

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* Cited by examiner, † Cited by third party
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JP6279276B2 (en) * 2013-10-03 2018-02-14 株式会社荏原製作所 Substrate cleaning apparatus and substrate processing apparatus
KR102379162B1 (en) * 2017-08-23 2022-03-25 에스케이실트론 주식회사 Wafer Lapping Apparatus And And Recycling Method Using Thereof
JP7152279B2 (en) * 2018-11-30 2022-10-12 株式会社荏原製作所 Polishing equipment
JP7341022B2 (en) * 2019-10-03 2023-09-08 株式会社荏原製作所 Substrate polishing equipment and film thickness map creation method
US20210114170A1 (en) * 2019-10-22 2021-04-22 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Container for storing slurry having fumed silica particles and cmp apparatus having the same

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US5635074A (en) * 1995-02-23 1997-06-03 Motorola, Inc. Methods and systems for controlling a continuous medium filtration system
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus
US5945346A (en) * 1997-11-03 1999-08-31 Motorola, Inc. Chemical mechanical planarization system and method therefor
JP2000158331A (en) * 1997-12-10 2000-06-13 Canon Inc Precise polishing method and device for substrate
US6024829A (en) 1998-05-21 2000-02-15 Lucent Technologies Inc. Method of reducing agglomerate particles in a polishing slurry
JPH11347939A (en) * 1998-06-05 1999-12-21 Sumitomo Metal Ind Ltd Control method for abrasion system and abrasion system
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US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
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JP2004063846A (en) * 2002-07-30 2004-02-26 Renesas Technology Corp Method of manufacturing semiconductor device
US20040049301A1 (en) 2002-09-10 2004-03-11 M Fsi Ltd. Apparatus and method for preparing and supplying slurry for CMP machine
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Also Published As

Publication number Publication date
CN104552008A (en) 2015-04-29
CN104552008B (en) 2018-04-06
JP2015082602A (en) 2015-04-27
US20150140907A1 (en) 2015-05-21
US20180169831A1 (en) 2018-06-21
KR20150047096A (en) 2015-05-04
SG10201707376TA (en) 2017-10-30
TW201529233A (en) 2015-08-01
JP2017132035A (en) 2017-08-03
US11192216B2 (en) 2021-12-07
KR102189477B1 (en) 2020-12-11
KR20200139655A (en) 2020-12-14
KR102274731B1 (en) 2021-07-08
JP6140051B2 (en) 2017-05-31
TWI645938B (en) 2019-01-01
JP6367419B2 (en) 2018-08-01

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