CN104552008A - Polishing method and polishing apparatus - Google Patents
Polishing method and polishing apparatus Download PDFInfo
- Publication number
- CN104552008A CN104552008A CN201410566888.5A CN201410566888A CN104552008A CN 104552008 A CN104552008 A CN 104552008A CN 201410566888 A CN201410566888 A CN 201410566888A CN 104552008 A CN104552008 A CN 104552008A
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- China
- Prior art keywords
- lapping liquid
- grinding pad
- filter
- substrate
- supplied
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 238000005498 polishing Methods 0.000 title abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 310
- 239000000758 substrate Substances 0.000 claims abstract description 108
- 238000000227 grinding Methods 0.000 claims description 243
- 238000004140 cleaning Methods 0.000 claims description 43
- 230000007246 mechanism Effects 0.000 claims description 41
- 238000001914 filtration Methods 0.000 claims description 39
- 239000002002 slurry Substances 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 24
- 230000009471 action Effects 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 14
- 238000012546 transfer Methods 0.000 claims description 14
- 238000005406 washing Methods 0.000 claims description 10
- 239000011362 coarse particle Substances 0.000 abstract 1
- 238000007517 polishing process Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 230000008439 repair process Effects 0.000 description 12
- 239000002245 particle Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 241000628997 Flos Species 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000013138 pruning Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A polishing method of polishing a substrate while preventing coarse particles from being discharged onto a polishing pad is disclosed. In this polishing method, a substrate (W) is brought into sliding contact with a polishing pad (1) while a polishing liquid, which has passed through a filter (14), is supplied onto the polishing pad (1). The polishing method includes: passing the polishing liquid through the filter (14) while increasing a physical quantity of the polishing liquid until the physical quantity reaches a predetermined set value, the physical quantity being one of flow rate and pressure of the polishing liquid; and polishing the substrate (W) on the polishing pad (1) while supplying the polishing liquid that has passed through the filter (14) onto the polishing pad (1).
Description
Technical field
The present invention relates to a kind of while lapping liquid is supplied to grinding pad while the Ginding process that grinds the substrate of wafer etc. on grinding pad and lapping device.
Background technology
In the manufacturing process of semiconductor devices, the planarization of device surface is more and more important.In this planarization, most important technology is cmp (Chemical Mechanical Polishing and CMP).This cmp (becoming CMP below) is, uses lapping device, will containing silica (SiO
2) or ceria (CeO
2) etc. the lapping liquid (slurry) of abrasive particle be supplied to grinding pad while make the substrate of wafer etc. and abradant surface slidingly contact and grind.
For the lapping device carrying out CMP, be described with reference to Figure 18.Figure 18 is the synoptic diagram of general lapping device.As shown in figure 18, lapping device has: the grinding table 101 supported the grinding pad 100 with abradant surface; And the substrate W of wafer etc. is carried out to the apical ring 102 of maintenance.Using this lapping device occasion that substrate W is ground, apical ring 102 with the pressure of regulation by substrate W by being pressed on grinding pad 100.Further, by making grinding table 101 and apical ring 102 relative motion and making substrate W and grinding pad 100 slidingly contact, the surface of substrate W is ground into smooth and minute surface.
During grinding base plate W, the lapping liquid (slurry) containing abrasive particle is fed on grinding pad 100.Abrasive particle is particulate, and this abrasive particle condenses and becomes larger particle (hereinafter referred to oversize grain) sometimes.When this oversize grain is fed on grinding pad 100, the surface of substrate W just produces scuffing.In order to address this is that, slurry supply pipeline 103 is provided with the filter 104 for catching oversize grain.
The upstream side of filter 104 is provided with open and close valve 105, and open this open and close valve 105, slurry is just supplied on grinding pad 100 by filter 104.Because the oversize grain in slurry is caught by filter 104, therefore, oversize grain can not be discharged on grinding pad 100.
When slurry is by filter 104, the pressure that the pressure acting on filter 104 entrance side is just compared to for filter 104 outlet side is high.When the entrance side of this filter 104 and the pressure differential of outlet side large time, the oversize grain caught by filter 104 is just extruded from filter 104, is discharged on grinding pad 100.As shown in figure 19, along with the entrance side of filter 104 and the pressure differential of outlet side become greatly, the discharge rate of oversize grain also just increases.
Prior art document
Patent document
Patent document 1: Japanese Patent Laid-Open 2003-179012 publication
Summary of the invention
Invent problem to be solved
The present invention makes in view of above-mentioned problem in the past, its object is to provide a kind of and prevents oversize grain to be discharged on grinding pad and the Ginding process ground substrate and lapping device.
For solving the means of problem
1st mode is a kind of Ginding process, while the lapping liquid by filter is supplied on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this Ginding process is, while increase as the one party in the flow of the described lapping liquid of the physical quantity of lapping liquid and pressure until described physical quantity reaches the setting value of regulation, while make described lapping liquid by described filter, while the described lapping liquid by described filter is supplied on described grinding pad, described grinding pad grinds described substrate.
2nd mode is a kind of Ginding process, while the lapping liquid by filter is supplied on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this Ginding process is, when not grinding described substrate, carry out making the intermittent cleaning filtration operation by described filter of lapping liquid, while the described lapping liquid by described filter is supplied on described grinding pad, described grinding pad grinds described substrate.
3rd mode is a kind of Ginding process, while the lapping liquid by filter is supplied on grinding pad, while make substrate and grinding pad slidingly contact and grind this substrate, the feature of this Ginding process is, cleaning filtration operation is carried out when not grinding described substrate, this cleaning filtration operation is, the numerical value that described physical quantity when the one party in the flow of the described lapping liquid of the physical quantity as lapping liquid and pressure being held in the grinding than described substrate is large, and make described lapping liquid continue through the operation of described filter, while the described lapping liquid by described filter is supplied on described grinding pad, while grind described substrate on described grinding pad.
4th mode is a kind of lapping device, is supplied to by lapping liquid on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this lapping device is, has: the grinding table supported described grinding pad; Substrate is pressed into the apical ring on described grinding pad; And lapping liquid feed mechanism lapping liquid is supplied on described grinding pad, described lapping liquid feed mechanism has: described lapping liquid is supplied to the slurry nozzle for supplying on described grinding pad; The filter be connected with described slurry nozzle for supplying; And to the adjuster that the one party in the flow of the described lapping liquid of the physical quantity as the described lapping liquid by described filter and pressure adjusts, described adjuster increases described physical quantity until described physical quantity reaches the setting value of regulation.
5th mode is a kind of lapping device, is supplied to by lapping liquid on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this lapping device is, has: the grinding table supported described grinding pad; Substrate is pressed into the apical ring on described grinding pad; And lapping liquid feed mechanism lapping liquid is supplied on described grinding pad, described lapping liquid feed mechanism has: described lapping liquid is supplied to the slurry nozzle for supplying on described grinding pad; Described lapping liquid is transplanted on the transfer tube of described slurry nozzle for supplying; Described transfer tube is carried out to the open and close valve of opening and closing; And the filter to be connected with described transfer tube, when not grinding described substrate, described open and close valve carries out the on-off action of the number of times specified and makes described lapping liquid intermittent by described filter.
6th mode is a kind of lapping device, is supplied to by lapping liquid on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this lapping device is, has: described grinding pad is carried out to the grinding table supported; Substrate is pressed into the apical ring on described grinding pad; And lapping liquid feed mechanism lapping liquid is supplied on described grinding pad, described lapping liquid feed mechanism has: described lapping liquid is supplied to the slurry nozzle for supplying on described grinding pad; The filter be connected with described slurry nozzle for supplying; And to the adjuster that the one party in the flow of the described lapping liquid of the physical quantity as the described lapping liquid by described filter and pressure adjusts, described lapping liquid feed mechanism carries out cleaning filtration operation when not grinding described substrate, this cleaning filtration operation is, the numerical value that the described physical quantity when physical quantity of described lapping liquid being held in the grinding than described substrate is large, while make described lapping liquid continue through the operation of filter.
The effect of invention
Adopt the present invention, make the increase of the physical quantity of lapping liquid make lapping liquid by filter, can prevent thus by filters trap to oversize grain be discharged to phenomenon on grinding pad.Therefore, can prevent from producing the phenomenon scratched on the surface of substrate because of oversize grain.
In addition, adopt the present invention, make lapping liquid intermittent by filter, can remove thus by filters trap to oversize grain.Therefore, can prevent from producing the phenomenon scratched on the surface of substrate because of oversize grain.
In addition, adopt the present invention, make the lapping liquid of large discharge continue through filter, can remove thus by filters trap to oversize grain.Therefore, can prevent from producing the phenomenon scratched on the surface of substrate because of oversize grain.
Accompanying drawing explanation
Fig. 1 is the stereogram of lapping device.
Fig. 2 is the skeleton diagram representing lapping liquid feed mechanism.
Fig. 3 is seen from above to the diagram of the lapping device shown in Fig. 1.
Fig. 4 is the chart representing the 1st embodiment.
Fig. 5 is the chart of the discharge rate representing oversize grain, represents the experimental result implemented according to the 1st embodiment.
Fig. 6 is the chart of the variation representing the 1st embodiment.
Fig. 7 is the chart of another variation representing the 1st embodiment.
Fig. 8 is the chart representing the 2nd embodiment.
Fig. 9 is the chart of the discharge rate of oversize grain after representing the cleaning filtration operation implemented according to the 2nd embodiment.
Figure 10 is the chart of the variation representing the 2nd embodiment.
Figure 11 is the chart of another variation representing the 2nd embodiment.
Figure 12 is the chart representing the 3rd embodiment.
Figure 13 is the chart of the discharge rate of oversize grain after representing the cleaning filtration operation implemented according to the 3rd embodiment.
Figure 14 is the chart after the 1st embodiment and the 2nd embodiment being combined.
Figure 15 be by the combination of the variation of the 1st embodiment and the 2nd embodiment after chart.
Figure 16 is the chart after the 1st embodiment and the 3rd embodiment being combined.
Figure 17 represents to have pressure gauge and the diagram replacing the lapping liquid feed mechanism of flowmeter.
Figure 18 is the synoptic diagram of general lapping device.
Figure 19 is the chart of the pressure differential representing the discharge rate of oversize grain and the entrance side of filter and outlet side.
Symbol description
1 grinding pad
2 grinding tables
3 apical rings
4 lapping liquid feed mechanisms
5 axles
6 with motor
7 apical ring rotating shafts
8 apical ring arms
10 slurry nozzle for supplying
11 jet pipe rotary shafts
12 transfer tubes
14 filters
16 adjusters
18 flowmeters
20 open and close valves
22 control parts
24 trimming devices
25 pure water nozzle for supplying
26 repair components
27 finishing member arms
28 repair component rotary shafts
30 floss holes
32 pressure gauges
40 sprayers
49 bolsters
Detailed description of the invention
Below, with reference to Figure of description, embodiment is described.In Fig. 1 to Figure 17, for same or equivalent structural element, put on identical symbol and omit repeat specification.
Fig. 1 is the stereogram of lapping device.As shown in Figure 1, lapping device has: the grinding table 2 supported grinding pad 1; By the substrate W of wafer etc. by the apical ring 3 be pressed on grinding pad 1; And the lapping liquid feed mechanism 4 lapping liquid (slurry) is supplied on grinding pad 1.
Grinding table 2 is linked by platform axle 5 and configuration platform motor 6 thereunder, and grinding table 2 utilizes this to rotate to the direction shown in arrow with motor 6.Grinding pad 1 is attached on the upper surface of grinding table 2, and the upper surface of grinding pad 1 forms the abradant surface 1a ground substrate W.Apical ring 3 is fixed on the lower end of apical ring axle 7.Apical ring 3 is configured to, and its lower surface can utilize vacuum suction and keep substrate W.Apical ring axle 7 and the not shown rotating mechanism be arranged in apical ring arm 8 link, and apical ring 3 is utilized this rotating mechanism and is driven in rotation by apical ring axle 7.
Lapping device also has the trimming device 24 grinding pad 1 being carried out to finishing.Trimming device 24 has: the repair component 26 slidingly contacted with the abradant surface 1a of grinding pad 1; To the finishing member arms 27 that repair component 26 supports; And the repair component rotary shaft 28 that finishing member arms 27 is circled round.Along with the convolution of finishing member arms 27, repair component 26 just swings on abradant surface 1a.The lower surface of repair component 26 forms the finishing face be made up of many abrasive particles such as diamond particles.Repair component 26 while swing on abradant surface 1a carries out on one side rotating, pass through to prune a little grinding pad 1 and repairing abradant surface 1a.In the finishing of grinding pad 1, pure water is supplied to the abradant surface 1a of grinding pad 1 from pure water nozzle for supplying 25.
Lapping device also has sprayer 40, and the abradant surface 1a that vaporific washing fluid is ejected into grinding pad 1 by this sprayer 40 cleans abradant surface 1a.Washing fluid is the fluid at least comprising cleaning fluid (being generally pure water).More particularly, washing fluid by cleaning fluid and gas (inert gases of such as nitrogen etc.) fluid-mixing or be only made up of cleaning fluid.Sprayer 40 extends along the radial direction of grinding pad 1 (or grinding table 2), and is supported by bolster 49.This bolster 49 is positioned at the outside of grinding table 2.Sprayer 40 is positioned at the top of the abradant surface 1a of grinding pad 1.Sprayer 40 by being ejected on abradant surface 1a by the washing fluid of high pressure, thus removes the abrasive particle contained by lapping rejects and lapping liquid from the abradant surface 1a of grinding pad 1.
Then, with reference to Fig. 2 and Fig. 3, lapping liquid feed mechanism 4 is described.Fig. 2 is the skeleton diagram representing lapping liquid feed mechanism 4.Fig. 3 is seen from above to the diagram of the lapping device shown in Fig. 1.As shown in Figure 2, lapping liquid feed mechanism 4 has: lapping liquid is supplied to the slurry nozzle for supplying 10 on grinding pad 1; Lapping liquid is transplanted on the transfer tube 12 of slurry nozzle for supplying 10; And by filter 14 that oversize grain contained in lapping liquid is caught.Filter 14 catches the oversize grain of more than given size.Filter 14 is connected with transfer tube 12, flows through the lapping liquid of transfer tube 12 by filter 14.
Transfer tube 12 is connected with slurry nozzle for supplying 10, just flows into slurry nozzle for supplying 10 by the lapping liquid of filter 14.As shown in Figure 3, slurry nozzle for supplying 10 is fixed on jet pipe rotary shaft 11, can circle round centered by jet pipe rotary shaft 11.Slurry nozzle for supplying 10 can move being discharged to by lapping liquid between the position P1 to be avoided outside the grinding pad 1 and supply position P2 above grinding pad 1.The floss hole 30 be configured in outside grinding pad 1 is provided with at position P1 to be avoided.Floss hole 30 is examples, also can arrange at position P1 to be avoided the tectosome being used for being discarded by lapping liquid or reclaiming.
Lapping liquid feed mechanism 4 has: the adjuster 16 adjusted one of physical quantity of lapping liquid i.e. flow; To the flowmeter 18 that the flow of lapping liquid measures; And to the control part 22 that the action of adjuster 16 controls.Adjuster 16 is such as electropneumatic regulators, and flowmeter 18 is configured in adjuster 16.Flowmeter 18 also can be located at the outside of adjuster 16.Be provided with the open and close valve 20 transfer tube 12 being carried out to opening and closing at the upstream side of adjuster 16, be provided with filter 14 in the downstream of adjuster 16.Open and close valve 20, adjuster 16 and filter 14 be arranged in series by this order, but also can arrange filter 14 at the upstream side of adjuster 16.
Open and close valve 20 and adjuster 16 are connected with control part 22.Open and close valve 20 carries out opening and closing according to the instruction from control part 22 to transfer tube 12.The measured value of flow is sent to control part 22 by flowmeter 18.Control part 22 based on flow measured value and instruction is issued adjuster 16 to adjust the flow of lapping liquid.Adjuster 16 adjusts the flow of the lapping liquid in transfer tube 12 according to the instruction from control part 22.
The grinding of substrate W is carried out as follows.First, slurry nozzle for supplying 10 is made to move to the supply position P2 above grinding pad 1 from the position P1 to be avoided shown in Fig. 3.Then, apical ring 3 and grinding table 2 are rotated along the direction shown in the arrow of Fig. 1 respectively, from the slurry nozzle for supplying 10 of lapping liquid feed mechanism 4, lapping liquid is supplied to grinding pad 1.In this condition, substrate W is pressed on the abradant surface 1a of grinding pad 1 by apical ring 3.The surface of substrate W because of the mechanism of the abrasive particle contained by lapping liquid and the chemical composition of lapping liquid chemical action and be polished.
After grinding base plate W, under substrate W is pressed into the state on the abradant surface 1a of grinding pad 1 by apical ring 3, pure water is made to be supplied to grinding pad 1 from pure water nozzle for supplying 25, from the surface removal lapping liquid of substrate W.So, pure water being supplied on grinding pad 1 while the operation making substrate W and grinding pad 1 slidingly contact calls that water grinds.In the grinding of this water, substrate W is not polished in fact.Be applied to the pressing load on substrate W during water grinding, set less than pressing load when grinding substrate W under the existence of lapping liquid.After water grinding base plate W, make the apical ring 3 maintaining substrate W move to the outside of grinding table 2, then, repair component 26 rotates around its axle center, while swing on the abradant surface 1a of grinding pad 1.Repair component 26 is by pruning grinding pad 1 and repairing grinding pad 1 a little.In the finishing of grinding pad 1, pure water is supplied to grinding pad 1 from pure water nozzle for supplying 25.
When the entrance side of filter 14 and the pressure differential of outlet side large time, produce the upper punch of pressure.The upper punch of so-called pressure, refers to the phenomenon that the pressure of the lapping liquid when lapping liquid starts inflow filter 14 rises instantaneously.The oversize grain caught by filter 14 is extruded because of this upper punch, is discharged on grinding pad 1.Because the dependency relation between the flow of lapping liquid and pressure is set up, therefore, pressure also depends on the changes in flow rate of lapping liquid and changes.Therefore, the entrance side of filter 14 and the pressure differential of outlet side can be reduced by making the flow of lapping liquid increase gradually, can upper punch be prevented.
Fig. 4 is the chart representing the 1st embodiment.The horizontal axis representing time of Fig. 4, the longitudinal axis represents the flow of lapping liquid.As shown in Figure 4, make the flow of lapping liquid from regulation initial value IF with regulation increment rate increase and until the flow of lapping liquid reaches the setting value F of regulation.Initial value IF may also be 0.The flow of lapping liquid is after reaching the setting value F of regulation, and the flow of lapping liquid is maintained in necessarily.Under the state remaining the setting value F of regulation at the flow of lapping liquid, substrate W is polished on grinding pad 1.
The supply action of concrete lapping liquid is now described.Under the state making slurry nozzle for supplying 10 be positioned at supply position P2, open and close valve 20 is opened according to the instruction from control part 22, starts to supply lapping liquid.After starting to supply lapping liquid, instruction is just issued adjuster 16 by control part 22, increases gradually until the flow of lapping liquid reaches the setting value F of regulation to make the flow of lapping liquid.Adjuster 16 accepts the instruction from control part 22, and the flow of lapping liquid is increased gradually.Further, when the flow of lapping liquid reaches the setting value F of regulation, control part 22 with regard to controlled adjuster 16 with the setting value F making the flow of lapping liquid be maintained in regulation.So, because the flow of lapping liquid increases gradually, therefore, the sharply increase of the pressure differential between the entrance side of filter 14 and outlet side can be prevented, prevent the oversize grain caught by filter 14 to be discharged to phenomenon on grinding pad 1.As a result, can prevent the surface of substrate W from producing the phenomenon scratched.
Also slurry nozzle for supplying 10 can be made before starting to supply lapping liquid to move to position P1 to be avoided, the lapping liquid by filter 14 is discharged in the floss hole 30 be located at outside grinding pad 1, until the flow of lapping liquid reaches the setting value F of regulation.Or, also the lapping liquid by filter 14 can be reclaimed, turns back to lapping liquid feed mechanism 4 and re-use.After the flow of lapping liquid reaches the setting value F of regulation, slurry nozzle for supplying 10 is moved to the supply position P2 above grinding pad 1, and lapping liquid is fed on grinding pad 1.By so making slurry nozzle for supplying 10 move, thus the oversize grain captured by filter 14 is prevented to be discharged to phenomenon on grinding pad 1 more reliably.
Fig. 5 is the chart of the discharge rate representing oversize grain, represents the experimental result implemented according to the 1st embodiment.Comparative example shown in Fig. 5 represents the amount according to lapping liquid supply method in the past from the oversize grain of filter 14 discharge.Transverse axis represents the sheet number of the substrate after grinding, and the longitudinal axis represents the amount of the oversize grain of discharging from filter 14.In lapping liquid supply method in the past, think grinding base plate and the flow set starts to supply lapping liquid.As shown in Figure 5, by making the flow of lapping liquid increase gradually, thus the discharge rate of oversize grain can significantly be reduced.In addition, as can be seen from Figure 5, regardless of the sheet number of the substrate ground, the discharge rate of oversize grain is held low.
Fig. 6 is the chart of the variation representing the 1st embodiment.The horizontal axis representing time of Fig. 6, the longitudinal axis represents the flow of lapping liquid.As shown in Figure 6, the flow of lapping liquid increases gradually from initial value IF stage, until the flow of lapping liquid reaches the setting value F of regulation.Control part 22 pairs of adjusters 16 control to make the traffic phases of lapping liquid to increase gradually.Further, reach the setting value F of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily.
Fig. 7 is the chart of another variation representing the 1st embodiment.The horizontal axis representing time of Fig. 7, the longitudinal axis represents the flow of lapping liquid.As shown in Figure 7, the flow of lapping liquid increases as curve (conic section), until lapping liquid reaches the setting value F of regulation.Control part 22 pairs of adjusters 16 control to make the flow of lapping liquid to increase along conic section.Further, reach the setting value F of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily.
Fig. 8 is the chart representing the 2nd embodiment.The horizontal axis representing time of Fig. 8, the longitudinal axis represents the flow of lapping liquid.As shown in Figure 8, before beginning grinding base plate W, lapping liquid intermittence is by filter 14.Then, the flow of lapping liquid is maintained necessarily, and lapping liquid is supplied to grinding pad 1 continuously by filter 14.In this condition, substrate W is polished.The intermittent flow by lapping liquid during filter 14 is identical with the flow of lapping liquid during grinding base plate W.In the following description, sometimes making the intermittent intermittent entry being called lapping liquid by the situation of filter 14 of lapping liquid.
The object of the 1st above-mentioned embodiment is that the flow of lapping liquid is increased gradually, prevents the oversize grain captured by filter 14 to be discharged on grinding pad 1.On the contrary, the object of the 2nd embodiment is that lapping liquid intermittence is supplied to filter 14, removes the oversize grain captured by filter 14 from filter 14 as far as possible.That is, when intermittence supply lapping liquid, the entrance side of filter 14 and the pressure differential of outlet side become large repeatedly, produce the upper punch of pressure.Along with this upper punch, the power extruding oversize grain from filter 14 instantaneously acts on filter 14, therefore the oversize grain captured by filter 14 is removed from filter 14.
The intermittent entry of this lapping liquid is the cleaning filtration operation removed by oversize grain from filter 14.Here, the so-called lapping liquid intermittence (or intermittence) that makes, by filter 14, refers to and is carried out alternately switching by the flow of lapping liquid between the 1st numerical value and the 2nd numerical value larger than the 1st numerical value and make lapping liquid flow through the situation of filter 14.1st numerical value may also be 0.In cleaning filtration operation, also can make the 1st numerical value and the 2nd numerical value change.
Cleaning filtration operation, carries out when not grinding base plate W.As the example of " not during grinding base plate W ", before the grinding if any substrate W, in the grinding of the water of substrate W, in the finishing of grinding pad 1, in the cleaning of abradant surface 1a undertaken by sprayer 40 and in the standby operation of lapping device.The standby operation of lapping device on grinding pad 1, there is not substrate and grinding pad 1 does not carry out the running status of the lapping device repaired when abradant surface 1a does not also clean.
Control part 22 also can be configured to, and judges whether lapping device is in standby operation.When control part 22 judges that lapping device is in standby operation, open and close valve 20 is just controlled to the intermittent entry starting lapping liquid by control part 22.Further, carry out the on-off action of stipulated number by open and close valve 20 and make lapping liquid intermittence flow through filter 14, removing the oversize grain in filter 14 thus.So, owing to supplying lapping liquid in the standby operation of lapping device, therefore, the filter 14 after oversize grain can be used to be removed is to carry out new substrate grinding.
The intermittent entry of lapping liquid, also can any position in position P1 to be avoided or supply position P2 carry out.Carry out the occasion of the intermittent entry of lapping liquid at supply position P2, because oversize grain drops on grinding pad 1, therefore, after the intermittent entry of lapping liquid terminates, the abradant surface 1a of grinding pad 1 cleans by padding wiper mechanism.In this embodiment, pad wiper mechanism is made up of the combination of above-mentioned repair component 24 and pure water nozzle for supplying 25, or is made up of sprayer 40.
Carry out the occasion of the intermittent entry of lapping liquid at position P1 to be avoided, be discharged in the floss hole 30 be located at outside grinding pad 1 by the lapping liquid of filter 14.Or, be recovered by the lapping liquid of filter 14, be returned to lapping liquid feed mechanism 4 and used again.In this occasion, because oversize grain can not drop on grinding pad 1, therefore, the operation that grinding pad 1 is cleaned can be omitted.From the viewpoint of the treating capacity of raising lapping device, be preferably the intermittent entry carrying out lapping liquid at position P1 to be avoided.
The supply action of concrete lapping liquid is now described.As not grinding base plate W, carry out cleaning filtration operation.That is, the on-off action of open and close valve 20 carries out the number of times that specifies.Along with open and close valve 20 opening and closing repeatedly, and repeatedly carry out the supply of lapping liquid and stop supply.Like this, lapping liquid intermittence is by filter 14.In cleaning filtration operation, the time interval of supply lapping liquid sets longer than stopping the time interval of supply lapping liquid.Namely the number of times of open and close valve 20 afore mentioned rules of on-off action repeatedly repeatedly carries out the supply of lapping liquid and stops the number of times of supply to be at least once.In the example shown in Fig. 8, supply and the stopping of lapping liquid supply (on-off action of open and close valve 20) three times repeatedly.At the end of cleaning filtration operation, lapping liquid is supplied on grinding pad 1 with the flow preset, and substrate W is polished on grinding pad 1 simultaneously.
Fig. 9 is the chart of the discharge rate of oversize grain after representing the cleaning filtration operation implemented according to the 2nd embodiment.Comparative example shown in Fig. 9 represents the amount according to lapping liquid supply method in the past from the oversize grain of filter 14 discharge.Transverse axis represents the sheet number of the substrate after grinding, and the longitudinal axis represents the amount of the oversize grain of discharging from the filter 14 after cleaning filtration.As can be seen from Figure 9, make lapping liquid intermittent by filter 14 in advance, significantly can reduce the amount from the oversize grain of filter 14 discharge in grinding thus.
Figure 10 is the chart of the variation representing the 2nd embodiment, and Figure 11 is the chart of another variation representing the 2nd embodiment.The horizontal axis representing time of Figure 10 and Figure 11, the longitudinal axis represents the flow of lapping liquid.As shown in Figure 10, also can must be larger than the flow of lapping liquid during grinding base plate W by the flow set of lapping liquid during intermittent entry.As shown in figure 11, also can must be less than the flow of lapping liquid during grinding base plate W by the flow set of lapping liquid during intermittent entry.
Figure 12 is the chart representing the 3rd embodiment.The horizontal axis representing time of Figure 12, the longitudinal axis represents the flow of lapping liquid.As shown in figure 12, before grinding base plate W, during stipulated time T1, lapping liquid more than flow during grinding is supplied to filter 14 continuously.With large discharge by the lapping liquid in filter 14, can remove from filter 14 oversize grain captured by filter 14.That is, when lapping liquid is supplied to filter 14 by the flow more than flow when to grind, the entrance side of filter 14 and the pressure differential of outlet side become greatly, extrude the power continuous action of oversize grain in filter 14 from filter 14.Therefore, the oversize grain captured by filter 14 is removed from filter 14.In the following description, sometimes flow more than flow when making lapping liquid to grind is called the large discharge supply of lapping liquid by the situation in filter 14.
The large discharge supply of this lapping liquid is the cleaning filtration operation removing oversize grain from filter 14.This cleaning filtration operation is carried out when not grinding base plate W.The large discharge supply of lapping liquid also can any position in position P1 to be avoided, the supply position P2 shown in Fig. 3 be carried out.Carry out the occasion of the large discharge supply of lapping liquid at supply position P2, because oversize grain can drop on grinding pad 1, therefore, after the supply of lapping liquid terminates, the abradant surface 1a of grinding pad 1 is cleaned by above-mentioned pad wiper mechanism.In this embodiment, pad wiper mechanism is made up of the combination of above-mentioned repair component 24 and pure water nozzle for supplying 25, or is made up of sprayer 40.
Carry out the occasion of the large discharge supply of lapping liquid at position P1 to be avoided, be discharged in the floss hole 30 be located at outside grinding pad 1 by the lapping liquid of filter 14.Or, be recovered by the lapping liquid of filter 14, be returned to lapping liquid feed mechanism 4 and used again.In this occasion, because oversize grain can not drop on grinding pad 1, therefore, the operation that grinding pad 1 is cleaned can be omitted.From the viewpoint of the treating capacity of raising lapping device, be preferably the large discharge supply carrying out lapping liquid at position P1 to be avoided.
The supply action of concrete lapping liquid is now described.During stipulated time T1, open and close valve 20 is opened, and lapping liquid is supplied to filter 14 with the regulation flow larger than flow during grinding.The flow of lapping liquid is controlled by adjuster 16 according to the instruction from control part 22.The large discharge supply of this lapping liquid is above-mentioned cleaning filtration operation, and it carries out with stipulated time T1.After cleaning filtration operation, adjuster 16 is controlled to and makes the flow of lapping liquid drop to the abradant setting value of substrate (being equivalent to above-mentioned setting value F) by control part 22.Further, lapping liquid to be supplied on grinding pad 1 with above-mentioned setting value, while on grinding pad 1 grinding base plate W.
Figure 13 is the chart of the discharge rate of oversize grain after representing the cleaning filtration operation implemented according to the 3rd embodiment.Comparative example shown in Figure 13 represents the amount according to lapping liquid supply method in the past from the oversize grain of filter 14 discharge.Transverse axis represents the sheet number of the substrate after grinding, and the longitudinal axis represents the amount of the oversize grain of discharging from the filter 14 after cleaning filtration.As can be seen from Figure 13, make lapping liquid in advance with large discharge by filter 14, significantly can reduce the amount from the oversize grain of filter 14 discharge in grinding thus.
As shown in figure 14, also the 1st embodiment and the 2nd embodiment can be combined.The horizontal axis representing time of Figure 14, the longitudinal axis represents the flow of lapping liquid.As shown in figure 14, flow is made to increase gradually until the flow of lapping liquid reaches the setting value of regulation from initial value.Reach the setting value of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily, grinding base plate W in this condition.At the end of the grinding of substrate W, just stop supply lapping liquid.Substrate W after grinding is transported to subsequent processing.
Until next substrate is transported on grinding pad 1, lapping liquid intermittence is supplied to filter 14, and the oversize grain in filter 14 is removed.In the example shown in Figure 14, the flow of lapping liquid during intermittent entry lapping liquid is identical with flow during grinding base plate.The intermittent entry of lapping liquid comprises the supply of lapping liquid and the stopping supply of lapping liquid.After the supply of this lapping liquid and the stopping of lapping liquid supply the number of times repeatedly specified, next substrate is just transported on grinding pad 1, then the flow of lapping liquid is increased until reach the setting value of regulation gradually from the initial value of regulation.Reach the setting value of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily, in this condition grinding base plate on grinding pad 1.
As shown in figure 15, also the variation of the 1st embodiment and the 2nd embodiment can be combined.The horizontal axis representing time of Figure 15, the longitudinal axis represents the flow of lapping liquid.As shown in figure 15, the flow of lapping liquid is made to increase gradually until the flow of lapping liquid reaches the setting value of regulation from initial value.Reach the setting value of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily, grinding base plate W in this condition.At the end of the grinding of substrate W, just stop supply lapping liquid.Substrate W after grinding is transported to subsequent processing.
Until next substrate is transported on grinding pad 1, lapping liquid intermittence is supplied to filter 14, carries out cleaning filtration operation.In the example shown in Figure 15, the flow of the lapping liquid during flow-rate ratio grinding base plate of the lapping liquid in the starting stage of cleaning filtration operation is large, the stopping of each supply and lapping liquid of repeatedly carrying out lapping liquid supplies, the flow of lapping liquid just declines, the flow of the lapping liquid when flow of the lapping liquid in the terminal stage of cleaning filtration operation is less than grinding base plate.After cleaning filtration operation terminates, next substrate is just transported on grinding pad 1, then the flow of lapping liquid is increased until reach the setting value of regulation gradually from the initial value of regulation.Reach the setting value of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily, in this condition grinding base plate on grinding pad 1.
As shown in figure 16, also the 1st embodiment and the 3rd embodiment can be combined.The horizontal axis representing time of Figure 16, the longitudinal axis represents the flow of lapping liquid.As shown in figure 16, the flow of lapping liquid is made to increase gradually until reach the setting value of regulation from the initial value of regulation.Reach the setting value of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily, grinding base plate W in this condition.At the end of the grinding of substrate W, just stop supply lapping liquid.Substrate W after grinding is transported to subsequent processing.
Before next substrate is polished, lapping liquid more than flow during grinding base plate is supplied to filter 14 continuously during stipulated time T2, removes the oversize grain in filter 14.When through stipulated time T2, the flow of lapping liquid is temporarily reduced to the initial value of regulation, then the flow of lapping liquid is increased gradually until reach the setting value of regulation.Reach the setting value of regulation at the flow of lapping liquid after, the flow of lapping liquid is maintained necessarily, grinds next substrate in this condition on grinding pad 1.
As shown in figure 17, lapping liquid feed mechanism 4 also can have pressure gauge 32 and replace flowmeter 18.In this embodiment, adjuster 16 adjusts the pressure of lapping liquid according to the instruction from control part 22.Pressure gauge 32 also can be located at the outside of adjuster 16.Because between the flow of lapping liquid and pressure, dependency relation is set up, therefore, the pressure of lapping liquid changes identically with the flow of lapping liquid.That is, if the flow of lapping liquid increases, then the pressure of lapping liquid also increases, if the flow of lapping liquid reduces, then the pressure of lapping liquid also reduces.Therefore, the situation that the pressure representative of lapping liquid is identical with the flow shown in above-mentioned Fig. 4 to Figure 16.Therefore, the chart relevant with the pressure of lapping liquid is omitted.The flow of lapping liquid and pressure are all the physical quantitys of lapping liquid.The physical quantity should carrying out monitoring is selected in advance, forms lapping liquid feed mechanism 4 based on selected physical quantity (i.e. flow or pressure).
So far, describe an embodiment of the present invention, the present invention is not limited to above-mentioned embodiment, certainly can implement by various different form in the scope of its technological thought.
Claims (24)
1. a Ginding process, is supplied to the lapping liquid by filter on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this Ginding process is,
While to increase as the one party in the flow of the described lapping liquid of the physical quantity of lapping liquid and pressure until described physical quantity reaches the setting value of regulation, make described lapping liquid by described filter,
While the described lapping liquid by described filter is supplied on described grinding pad, described grinding pad grinds described substrate.
2. Ginding process as claimed in claim 1, it is characterized in that, reach the setting value of described regulation in the physical quantity of described lapping liquid after, the described lapping liquid by described filter is supplied on described grinding pad, while grind described substrate on described grinding pad.
3. Ginding process as claimed in claim 2, is characterized in that, be supplied on described grinding pad by the described lapping liquid by described filter, until the physical quantity of described lapping liquid reaches the setting value of described regulation.
4. Ginding process as claimed in claim 2, is characterized in that, is discharged to by the described lapping liquid by described filter outside described grinding pad or is reclaimed, until the physical quantity of described lapping liquid reaches the setting value of described regulation.
5. a Ginding process, is supplied to the lapping liquid by filter on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this Ginding process is,
When not grinding described substrate, carry out making the intermittent cleaning filtration operation by described filter of lapping liquid,
While the described lapping liquid by described filter is supplied on described grinding pad, described grinding pad grinds described substrate.
6. Ginding process as claimed in claim 5, is characterized in that, is discharged to by the described lapping liquid by described filter in described cleaning filtration operation outside described grinding pad or is reclaimed.
7. Ginding process as claimed in claim 5, is characterized in that, be supplied on described grinding pad by the described lapping liquid by described filter in described cleaning filtration operation,
Washing fluid is supplied to described grinding pad and removes described lapping liquid from described grinding pad,
While the lapping liquid by described filter is supplied on described grinding pad, while grind described substrate on described grinding pad.
8. Ginding process as claimed in claim 5, it is characterized in that, after described cleaning filtration operation, while increase as the one party in the flow of the described lapping liquid of the physical quantity of described lapping liquid and pressure until described physical quantity reaches the setting value of regulation, while make described lapping liquid by described filter
While the described lapping liquid by described filter is supplied on grinding pad, while grind described substrate on described grinding pad.
9. a Ginding process, is supplied to the lapping liquid by filter on grinding pad, while make substrate and grinding pad slidingly contact and grind this substrate, the feature of this Ginding process is,
Cleaning filtration operation is carried out when not grinding described substrate, this cleaning filtration operation is, the numerical value that described physical quantity when the one party in the flow of the described lapping liquid of the physical quantity as lapping liquid and pressure being held in the grinding than described substrate is large also makes described lapping liquid continue through the operation of described filter
While the described lapping liquid by described filter is supplied on described grinding pad, described grinding pad grinds described substrate.
10. Ginding process as claimed in claim 9, is characterized in that, is discharged to by the described lapping liquid by described filter in described cleaning filtration operation outside described grinding pad or is reclaimed.
11. Ginding process as claimed in claim 9, is characterized in that, be supplied on described grinding pad by the described lapping liquid by described filter in described cleaning filtration operation,
Washing fluid is supplied on described grinding pad and removes described lapping liquid from described grinding pad,
While the described lapping liquid by described filter is supplied on described grinding pad, described grinding pad grinds described substrate.
12. Ginding process as claimed in claim 9, is characterized in that, after described cleaning filtration operation, increase described physical quantity until the setting value that described physical quantity reaches regulation makes described lapping liquid by described filter,
While the described lapping liquid by described filter is supplied on described grinding pad, while grind described substrate on described grinding pad.
13. 1 kinds of lapping devices, are supplied to lapping liquid on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this lapping device are, has:
To the grinding table that described grinding pad supports;
Substrate is pressed into the apical ring on described grinding pad; And
Lapping liquid is supplied to the lapping liquid feed mechanism on described grinding pad,
Described lapping liquid feed mechanism has:
Described lapping liquid is supplied to the slurry nozzle for supplying on described grinding pad;
The filter be connected with described slurry nozzle for supplying; And
To the adjuster that the one party in the flow of the described lapping liquid of the physical quantity as the described lapping liquid by described filter and pressure adjusts,
Described adjuster increases described physical quantity until described physical quantity reaches the setting value of regulation.
14. lapping devices as claimed in claim 13, it is characterized in that, reach the setting value of described regulation in described physical quantity after, while described lapping liquid is supplied to described grinding pad by described lapping liquid feed mechanism, by described apical ring, described substrate is pressed on described grinding pad and described substrate is ground.
15. lapping devices as claimed in claim 14, it is characterized in that, the described lapping liquid by described filter is supplied on described grinding pad by described slurry nozzle for supplying, until described physical quantity reaches the setting value of described regulation.
16. lapping devices as claimed in claim 14, it is characterized in that, described slurry nozzle for supplying carries out such action: be discharged to outside described grinding pad by the described lapping liquid by described filter, until described physical quantity reaches the setting value of described regulation.
17. 1 kinds of lapping devices, are supplied to lapping liquid on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this lapping device are, has:
To the grinding table that described grinding pad supports;
Substrate is pressed into the apical ring on described grinding pad; And
Lapping liquid is supplied to the lapping liquid feed mechanism on described grinding pad,
Described lapping liquid feed mechanism has:
Described lapping liquid is supplied to the slurry nozzle for supplying on described grinding pad;
Described lapping liquid is transplanted on the transfer tube of described slurry nozzle for supplying;
Described transfer tube is carried out to the open and close valve of opening and closing; And
The filter be connected with described transfer tube,
When not grinding described substrate, described open and close valve carries out the on-off action of the number of times specified and makes described lapping liquid intermittent by described filter.
18. lapping devices as claimed in claim 17, it is characterized in that, described slurry nozzle for supplying carries out such action: be discharged to outside described grinding pad by the described lapping liquid of intermittence by described filter.
19. lapping devices as claimed in claim 17, is characterized in that, also have the pad wiper mechanism be supplied to by washing fluid on described grinding pad,
Intermittence is supplied on described grinding pad by the described lapping liquid of described filter by described slurry nozzle for supplying,
Described washing fluid is supplied to described grinding pad and removes described lapping liquid from described grinding pad by described pad wiper mechanism.
20. lapping devices as claimed in claim 17, it is characterized in that, described lapping liquid feed mechanism also has adjuster, and this adjuster adjusts the one party in the flow of the described lapping liquid of the physical quantity as the described lapping liquid by described filter and pressure
Carry out the on-off action of the number of times specified at described open and close valve after, described adjuster increases described physical quantity until described physical quantity reaches the setting value of regulation.
21. 1 kinds of lapping devices, are supplied to lapping liquid on grinding pad, while make substrate and described grinding pad slidingly contact and grind this substrate, the feature of this lapping device are, has:
Described grinding pad is carried out to the grinding table supported;
Substrate is pressed into the apical ring on described grinding pad; And
Lapping liquid is supplied to the lapping liquid feed mechanism on described grinding pad,
Described lapping liquid feed mechanism has:
Described lapping liquid is supplied to the slurry nozzle for supplying on described grinding pad;
The filter be connected with described slurry nozzle for supplying; And
To the adjuster that the one party in the flow of the described lapping liquid of the physical quantity as the described lapping liquid by described filter and pressure adjusts,
Described lapping liquid feed mechanism carries out cleaning filtration operation when not grinding described substrate, this cleaning filtration operation is, the numerical value that the described physical quantity when physical quantity of described lapping liquid being held in the grinding than described substrate is large, while make described lapping liquid continue through the operation of filter.
22. lapping devices as claimed in claim 21, it is characterized in that, described slurry nozzle for supplying carries out such action: be discharged to outside described grinding pad by the described lapping liquid by described filter in described cleaning filtration operation.
23. lapping devices as claimed in claim 21, is characterized in that, also have the pad wiper mechanism be supplied to by washing fluid on described grinding pad,
Described slurry nozzle for supplying, is supplied on described grinding pad by the described lapping liquid by described filter in described cleaning filtration operation,
Described washing fluid is supplied to described grinding pad and removes described lapping liquid from described grinding pad by described pad wiper mechanism.
24. lapping devices as claimed in claim 21, is characterized in that, after described cleaning filtration operation, described adjuster increases described physical quantity until described physical quantity reaches the setting value of regulation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013220327A JP6140051B2 (en) | 2013-10-23 | 2013-10-23 | Polishing method and polishing apparatus |
| JP2013-220327 | 2013-10-23 |
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| CN104552008A true CN104552008A (en) | 2015-04-29 |
| CN104552008B CN104552008B (en) | 2018-04-06 |
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| CN201410566888.5A Active CN104552008B (en) | 2013-10-23 | 2014-10-22 | Ginding process and lapping device |
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|---|---|
| US (2) | US20150140907A1 (en) |
| JP (2) | JP6140051B2 (en) |
| KR (2) | KR102189477B1 (en) |
| CN (1) | CN104552008B (en) |
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- 2014-10-21 US US14/520,242 patent/US20150140907A1/en not_active Abandoned
- 2014-10-21 SG SG10201406812YA patent/SG10201406812YA/en unknown
- 2014-10-21 SG SG10201707376TA patent/SG10201707376TA/en unknown
- 2014-10-22 CN CN201410566888.5A patent/CN104552008B/en active Active
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2017
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Also Published As
| Publication number | Publication date |
|---|---|
| KR102189477B1 (en) | 2020-12-11 |
| KR20200139655A (en) | 2020-12-14 |
| JP2015082602A (en) | 2015-04-27 |
| KR20150047096A (en) | 2015-05-04 |
| SG10201406812YA (en) | 2015-05-28 |
| KR102274731B1 (en) | 2021-07-08 |
| JP2017132035A (en) | 2017-08-03 |
| JP6367419B2 (en) | 2018-08-01 |
| JP6140051B2 (en) | 2017-05-31 |
| SG10201707376TA (en) | 2017-10-30 |
| US20150140907A1 (en) | 2015-05-21 |
| CN104552008B (en) | 2018-04-06 |
| US11192216B2 (en) | 2021-12-07 |
| TW201529233A (en) | 2015-08-01 |
| US20180169831A1 (en) | 2018-06-21 |
| TWI645938B (en) | 2019-01-01 |
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