SG11201506001VA - Polishing composition, method for producing polishing composition and method for producing polished article - Google Patents
Polishing composition, method for producing polishing composition and method for producing polished articleInfo
- Publication number
- SG11201506001VA SG11201506001VA SG11201506001VA SG11201506001VA SG11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA SG 11201506001V A SG11201506001V A SG 11201506001VA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing composition
- producing
- polished article
- article
- producing polished
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1436—Composite particles, e.g. coated particles
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013026020 | 2013-02-13 | ||
| PCT/JP2014/053065 WO2014126051A1 (fr) | 2013-02-13 | 2014-02-10 | Composition de polissage, procédé de production pour composition de polissage et procédé de production pour article poli |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201506001VA true SG11201506001VA (en) | 2015-09-29 |
Family
ID=51354053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201506001VA SG11201506001VA (en) | 2013-02-13 | 2014-02-10 | Polishing composition, method for producing polishing composition and method for producing polished article |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20150376464A1 (fr) |
| EP (1) | EP2957613B1 (fr) |
| JP (2) | JP5897200B2 (fr) |
| KR (1) | KR102226441B1 (fr) |
| CN (1) | CN104995277B (fr) |
| SG (1) | SG11201506001VA (fr) |
| TW (1) | TWI624536B (fr) |
| WO (1) | WO2014126051A1 (fr) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10717899B2 (en) | 2013-03-19 | 2020-07-21 | Fujimi Incorporated | Polishing composition, method for producing polishing composition and polishing composition preparation kit |
| JP5900913B2 (ja) | 2013-03-19 | 2016-04-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨用組成物製造方法および研磨用組成物調製用キット |
| JP6314019B2 (ja) * | 2014-03-31 | 2018-04-18 | ニッタ・ハース株式会社 | 半導体基板の研磨方法 |
| JP6185432B2 (ja) * | 2014-06-24 | 2017-08-23 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| WO2016089660A1 (fr) * | 2014-12-05 | 2016-06-09 | 3M Innovative Properties Company | Composition abrasive |
| KR102594932B1 (ko) * | 2015-05-08 | 2023-10-27 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
| JP6582601B2 (ja) * | 2015-06-22 | 2019-10-02 | 日立化成株式会社 | 研磨液、貯蔵液及び研磨方法 |
| WO2017002433A1 (fr) * | 2015-07-01 | 2017-01-05 | 東亞合成株式会社 | Agent mouillant pour polissage et composition liquide de polissage |
| CN109476116B (zh) | 2016-04-28 | 2021-07-16 | 自然工作有限责任公司 | 具有包含耐热聚合物层和聚丙交酯树脂层的多层片材的饰面的聚合物泡沫隔热结构 |
| WO2018079334A1 (fr) * | 2016-10-28 | 2018-05-03 | 株式会社トクヤマ | Silice pyrogénée et sa méthode de production |
| JP6792413B2 (ja) * | 2016-10-31 | 2020-11-25 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| CN109996853A (zh) * | 2016-11-22 | 2019-07-09 | 福吉米株式会社 | 研磨用组合物 |
| WO2018150945A1 (fr) * | 2017-02-20 | 2018-08-23 | 株式会社フジミインコーポレーテッド | Composition de polissage intermédiaire de substrat de silicium et ensemble de composition de polissage de substrat de silicium |
| JP7074525B2 (ja) | 2017-03-30 | 2022-05-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP6879798B2 (ja) * | 2017-03-30 | 2021-06-02 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| WO2018216733A1 (fr) * | 2017-05-26 | 2018-11-29 | 株式会社フジミインコーポレーテッド | Composition de polissage et procédé de polissage l'utilisant |
| EP3410236B1 (fr) * | 2017-05-29 | 2021-02-17 | The Swatch Group Research and Development Ltd | Dispositif et procede d'ajustement de marche et correction d'etat d'une montre |
| JP7227132B2 (ja) * | 2017-07-21 | 2023-02-21 | 株式会社フジミインコーポレーテッド | 基板の研磨方法および研磨用組成物セット |
| US11649377B2 (en) * | 2017-08-14 | 2023-05-16 | Resonac Corporation | Polishing liquid, polishing liquid set and polishing method |
| JP6929239B2 (ja) * | 2018-03-30 | 2021-09-01 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| CN112384590A (zh) * | 2018-07-04 | 2021-02-19 | 住友精化株式会社 | 研磨用组合物 |
| JP7424768B2 (ja) * | 2019-08-08 | 2024-01-30 | 株式会社フジミインコーポレーテッド | 研磨用添加剤含有液の濾過方法、研磨用添加剤含有液、研磨用組成物、研磨用組成物の製造方法およびフィルタ |
| EP3792327A1 (fr) * | 2019-09-11 | 2021-03-17 | Fujimi Incorporated | Composition de polissage, procédé de polissage et procédé de fabrication d'un substrat à semiconducteur |
| CN112175524B (zh) * | 2020-09-21 | 2022-02-15 | 万华化学集团电子材料有限公司 | 一种蓝宝石抛光组合物及其应用 |
| KR102492236B1 (ko) * | 2020-12-17 | 2023-01-26 | 에스케이실트론 주식회사 | 연마장치 및 웨이퍼의 연마방법 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2001185516A (ja) * | 1999-12-24 | 2001-07-06 | Kao Corp | 研磨助剤 |
| JP2004051756A (ja) * | 2002-07-19 | 2004-02-19 | Sanyo Chem Ind Ltd | Ｃｍｐプロセス用研磨組成物 |
| JP4593064B2 (ja) | 2002-09-30 | 2010-12-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP4212861B2 (ja) * | 2002-09-30 | 2009-01-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いたシリコンウエハの研磨方法、並びにリンス用組成物及びそれを用いたシリコンウエハのリンス方法 |
| JP4668528B2 (ja) | 2003-09-05 | 2011-04-13 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| JP2005268664A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| CN100503167C (zh) * | 2004-05-19 | 2009-06-24 | 日产化学工业株式会社 | 研磨用组合物 |
| US20060000808A1 (en) * | 2004-07-01 | 2006-01-05 | Fuji Photo Film Co., Ltd. | Polishing solution of metal and chemical mechanical polishing method |
| JP4814502B2 (ja) * | 2004-09-09 | 2011-11-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP2006086462A (ja) * | 2004-09-17 | 2006-03-30 | Fujimi Inc | 研磨用組成物およびそれを用いた配線構造体の製造法 |
| JP5026665B2 (ja) * | 2004-10-15 | 2012-09-12 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP4027929B2 (ja) * | 2004-11-30 | 2007-12-26 | 花王株式会社 | 半導体基板用研磨液組成物 |
| JP2006352043A (ja) * | 2005-06-20 | 2006-12-28 | Nitta Haas Inc | 半導体研磨用組成物 |
| JP2007073548A (ja) * | 2005-09-02 | 2007-03-22 | Fujimi Inc | 研磨方法 |
| JP2007095946A (ja) * | 2005-09-28 | 2007-04-12 | Fujifilm Corp | 金属用研磨液及び研磨方法 |
| EP1813656A3 (fr) * | 2006-01-30 | 2009-09-02 | FUJIFILM Corporation | Liquide de polissage de métaux et procédé de polissage mécano-chimique l'utilisant |
| JP2007214205A (ja) * | 2006-02-07 | 2007-08-23 | Fujimi Inc | 研磨用組成物 |
| JP5335183B2 (ja) * | 2006-08-24 | 2013-11-06 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP5204960B2 (ja) * | 2006-08-24 | 2013-06-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP2008091524A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| JP5196819B2 (ja) * | 2007-03-19 | 2013-05-15 | ニッタ・ハース株式会社 | 研磨用組成物 |
| CN103131330B (zh) * | 2008-02-01 | 2015-09-23 | 福吉米株式会社 | 研磨用组合物以及使用其的研磨方法 |
| US9202709B2 (en) * | 2008-03-19 | 2015-12-01 | Fujifilm Corporation | Polishing liquid for metal and polishing method using the same |
| JP2009231486A (ja) * | 2008-03-21 | 2009-10-08 | Kao Corp | シリコンウエハ用研磨液組成物 |
| CN102105267B (zh) * | 2008-06-18 | 2016-08-03 | 福吉米株式会社 | 抛光组合物及利用该抛光组合物的抛光方法 |
| JP5474400B2 (ja) * | 2008-07-03 | 2014-04-16 | 株式会社フジミインコーポレーテッド | 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法 |
| JP5362319B2 (ja) * | 2008-10-21 | 2013-12-11 | 花王株式会社 | 研磨液組成物 |
| US20100164106A1 (en) * | 2008-12-31 | 2010-07-01 | Cheil Industries Inc. | CMP Slurry Composition for Barrier Polishing for Manufacturing Copper Interconnects, Polishing Method Using the Composition, and Semiconductor Device Manufactured by the Method |
| JP2011171689A (ja) * | 2009-07-07 | 2011-09-01 | Kao Corp | シリコンウエハ用研磨液組成物 |
| JP5493528B2 (ja) * | 2009-07-15 | 2014-05-14 | 日立化成株式会社 | Ｃｍｐ研磨液及びこのｃｍｐ研磨液を用いた研磨方法 |
| JP5441578B2 (ja) * | 2009-09-11 | 2014-03-12 | 花王株式会社 | 研磨液組成物 |
| JP5321430B2 (ja) * | 2009-12-02 | 2013-10-23 | 信越半導体株式会社 | シリコンウェーハ研磨用研磨剤およびシリコンウェーハの研磨方法 |
| JP5492603B2 (ja) * | 2010-03-02 | 2014-05-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP5544244B2 (ja) * | 2010-08-09 | 2014-07-09 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
| JP2012079964A (ja) * | 2010-10-04 | 2012-04-19 | Nissan Chem Ind Ltd | 半導体ウェーハ用研磨液組成物 |
| CN103403123B (zh) * | 2011-01-26 | 2015-04-08 | 福吉米株式会社 | 研磨用组合物、使用其的研磨方法及基板的制造方法 |
| KR20140034231A (ko) * | 2011-05-24 | 2014-03-19 | 가부시키가이샤 구라레 | 화학 기계 연마용 부식 방지제, 화학 기계 연마용 슬러리, 및 화학 기계 연마 방법 |
| JP2014041978A (ja) * | 2012-08-23 | 2014-03-06 | Fujimi Inc | 研磨用組成物、研磨用組成物の製造方法、及び研磨用組成物原液の製造方法 |
-
2014
- 2014-02-10 EP EP14751996.1A patent/EP2957613B1/fr active Active
- 2014-02-10 US US14/767,494 patent/US20150376464A1/en not_active Abandoned
- 2014-02-10 KR KR1020157024572A patent/KR102226441B1/ko active IP Right Grant
- 2014-02-10 SG SG11201506001VA patent/SG11201506001VA/en unknown
- 2014-02-10 WO PCT/JP2014/053065 patent/WO2014126051A1/fr active Application Filing
- 2014-02-10 JP JP2015500230A patent/JP5897200B2/ja active Active
- 2014-02-10 CN CN201480008802.5A patent/CN104995277B/zh active Active
- 2014-02-12 TW TW103104570A patent/TWI624536B/zh active
-
2016
- 2016-03-01 JP JP2016038583A patent/JP6387032B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2957613A4 (fr) | 2016-11-09 |
| JPWO2014126051A1 (ja) | 2017-02-02 |
| TW201443212A (zh) | 2014-11-16 |
| KR20150119062A (ko) | 2015-10-23 |
| JP6387032B2 (ja) | 2018-09-05 |
| KR102226441B1 (ko) | 2021-03-12 |
| JP5897200B2 (ja) | 2016-03-30 |
| TWI624536B (zh) | 2018-05-21 |
| US20150376464A1 (en) | 2015-12-31 |
| CN104995277B (zh) | 2018-05-08 |
| CN104995277A (zh) | 2015-10-21 |
| EP2957613B1 (fr) | 2020-11-18 |
| JP2016138278A (ja) | 2016-08-04 |
| WO2014126051A1 (fr) | 2014-08-21 |
| EP2957613A1 (fr) | 2015-12-23 |
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