SG10201508429XA - Resin molding machine - Google Patents
Resin molding machineInfo
- Publication number
- SG10201508429XA SG10201508429XA SG10201508429XA SG10201508429XA SG10201508429XA SG 10201508429X A SG10201508429X A SG 10201508429XA SG 10201508429X A SG10201508429X A SG 10201508429XA SG 10201508429X A SG10201508429X A SG 10201508429XA SG 10201508429X A SG10201508429X A SG 10201508429XA
- Authority
- SG
- Singapore
- Prior art keywords
- molding machine
- resin molding
- resin
- machine
- molding
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/34—Feeding the material to the mould or the compression means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/008—Handling preformed parts, e.g. inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
- B29C37/0007—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots
- B29C37/001—Discharging moulded articles from the mould using means operable from outside the mould for moving between mould parts, e.g. robots combined with means for loading preforms to be moulded or inserts, e.g. preformed layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
- B29C2043/181—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles encapsulated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5833—Measuring, controlling or regulating movement of moulds or mould parts, e.g. opening or closing, actuating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
- B29C2043/5875—Measuring, controlling or regulating the material feed to the moulds or mould parts, e.g. controlling feed flow, velocity, weight, doses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/042—Feeding of the material to be moulded, e.g. into a mould cavity using dispensing heads, e.g. extruders, placed over or apart from the moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C45/1468—Plants therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010262681A JP5693931B2 (ja) | 2010-11-25 | 2010-11-25 | 樹脂モールド装置 |
JP2010281457A JP5663785B2 (ja) | 2010-12-17 | 2010-12-17 | 樹脂モールド方法及び樹脂モールド装置 |
JP2011178592A JP5793806B2 (ja) | 2011-08-17 | 2011-08-17 | 樹脂モールド装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201508429XA true SG10201508429XA (en) | 2015-11-27 |
Family
ID=45093427
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201508429XA SG10201508429XA (en) | 2010-11-25 | 2011-11-16 | Resin molding machine |
SG2011084753A SG181252A1 (en) | 2010-11-25 | 2011-11-16 | Resin molding machine |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2011084753A SG181252A1 (en) | 2010-11-25 | 2011-11-16 | Resin molding machine |
Country Status (6)
Country | Link |
---|---|
US (1) | US9738014B2 (zh) |
EP (1) | EP2457710B1 (zh) |
KR (4) | KR101932434B1 (zh) |
CN (2) | CN102543773B (zh) |
SG (2) | SG10201508429XA (zh) |
TW (3) | TWI585908B (zh) |
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JP5716227B2 (ja) * | 2010-12-17 | 2015-05-13 | アピックヤマダ株式会社 | 樹脂モールド装置 |
DE102011082157A1 (de) * | 2011-09-06 | 2013-03-07 | Osram Opto Semiconductors Gmbh | Presswerkzeug und Verfahrenzum Herstellen eines Silikonelements |
EP2980836A1 (en) * | 2013-03-28 | 2016-02-03 | Nitto Denko Corporation | Method for manufacturing optical semiconductor device, system, manufacturing conditions determination device, and manufacturing management device |
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US9209046B2 (en) * | 2013-10-02 | 2015-12-08 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
KR101523057B1 (ko) * | 2013-10-22 | 2015-05-26 | 주식회사 넥스플러스 | 몰드프레임 새시 제조장치 |
JP6071869B2 (ja) * | 2013-12-27 | 2017-02-01 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6310773B2 (ja) * | 2014-05-22 | 2018-04-11 | Towa株式会社 | 樹脂成形装置及び樹脂成形方法 |
JP6307374B2 (ja) * | 2014-07-22 | 2018-04-04 | アピックヤマダ株式会社 | 成形金型、成形装置および成形品の製造方法 |
JP6491464B2 (ja) * | 2014-11-28 | 2019-03-27 | Towa株式会社 | 成形品製造装置及び成形品製造方法 |
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EP3538900B1 (en) | 2016-11-08 | 2022-07-20 | O.I. Corporation | Smart slide |
JP6721525B2 (ja) * | 2017-03-03 | 2020-07-15 | キオクシア株式会社 | 金型 |
JP6804409B2 (ja) * | 2017-08-04 | 2020-12-23 | Towa株式会社 | 樹脂成形装置及び樹脂成形品製造方法 |
JP6923394B2 (ja) * | 2017-08-30 | 2021-08-18 | Towa株式会社 | 吸着ハンド、搬送機構、樹脂成形装置、搬送方法および樹脂成形品の製造方法 |
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JP6894403B2 (ja) * | 2018-05-24 | 2021-06-30 | Towa株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
JP6923503B2 (ja) * | 2018-11-27 | 2021-08-18 | Towa株式会社 | 樹脂成形装置、及び樹脂成形品の製造方法 |
JP7203414B2 (ja) * | 2018-12-27 | 2023-01-13 | アピックヤマダ株式会社 | 樹脂供給取出装置、ワーク搬送装置及び樹脂モールド装置 |
CN111037891B (zh) * | 2019-12-09 | 2021-10-19 | 衢州学院 | 一种用于网球半球压模的连续性成型装置 |
JP7291663B2 (ja) * | 2020-04-24 | 2023-06-15 | Towa株式会社 | 位置決め装置、位置決め方法、樹脂成形システムおよび樹脂成形品の製造方法 |
JP7323937B2 (ja) * | 2020-05-22 | 2023-08-09 | アピックヤマダ株式会社 | 樹脂モールド装置 |
JP7406247B2 (ja) * | 2020-05-22 | 2023-12-27 | アピックヤマダ株式会社 | 樹脂モールド装置 |
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- 2011-10-12 TW TW106111012A patent/TWI623071B/zh active
- 2011-10-12 TW TW100136903A patent/TWI523164B/zh active
- 2011-11-16 SG SG10201508429XA patent/SG10201508429XA/en unknown
- 2011-11-16 SG SG2011084753A patent/SG181252A1/en unknown
- 2011-11-21 CN CN201110376636.2A patent/CN102543773B/zh active Active
- 2011-11-21 KR KR1020110121434A patent/KR101932434B1/ko active IP Right Grant
- 2011-11-21 CN CN201610473601.3A patent/CN106042247B/zh active Active
- 2011-11-23 US US13/303,340 patent/US9738014B2/en active Active
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CN102543773A (zh) | 2012-07-04 |
CN102543773B (zh) | 2016-08-03 |
US20120135096A1 (en) | 2012-05-31 |
KR20200125566A (ko) | 2020-11-04 |
TW201727846A (zh) | 2017-08-01 |
US9738014B2 (en) | 2017-08-22 |
EP2457710A1 (en) | 2012-05-30 |
SG181252A1 (en) | 2012-06-28 |
KR102288499B1 (ko) | 2021-08-09 |
KR20190132336A (ko) | 2019-11-27 |
EP2457710B1 (en) | 2017-06-14 |
KR102049609B1 (ko) | 2019-11-27 |
TWI585908B (zh) | 2017-06-01 |
KR101932434B1 (ko) | 2018-12-26 |
TWI623071B (zh) | 2018-05-01 |
KR102173980B1 (ko) | 2020-11-04 |
CN106042247B (zh) | 2018-04-03 |
TW201222738A (en) | 2012-06-01 |
KR20120056774A (ko) | 2012-06-04 |
KR20190002380A (ko) | 2019-01-08 |
TWI523164B (zh) | 2016-02-21 |
CN106042247A (zh) | 2016-10-26 |
TW201614782A (en) | 2016-04-16 |
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