SG10201501469PA - Resin composition, prepreg, and laminated sheet - Google Patents

Resin composition, prepreg, and laminated sheet

Info

Publication number
SG10201501469PA
SG10201501469PA SG10201501469PA SG10201501469PA SG10201501469PA SG 10201501469P A SG10201501469P A SG 10201501469PA SG 10201501469P A SG10201501469P A SG 10201501469PA SG 10201501469P A SG10201501469P A SG 10201501469PA SG 10201501469P A SG10201501469P A SG 10201501469PA
Authority
SG
Singapore
Prior art keywords
prepreg
resin composition
laminated sheet
laminated
sheet
Prior art date
Application number
SG10201501469PA
Other languages
English (en)
Inventor
Takaaki Ogashiwa
Hiroshi Takahashi
Tetsuro Miyahira
Masayoshi Ueno
Yoshihiro Kato
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG10201501469PA publication Critical patent/SG10201501469PA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
SG10201501469PA 2010-03-02 2011-03-01 Resin composition, prepreg, and laminated sheet SG10201501469PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010045625 2010-03-02

Publications (1)

Publication Number Publication Date
SG10201501469PA true SG10201501469PA (en) 2015-04-29

Family

ID=44542175

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201501469PA SG10201501469PA (en) 2010-03-02 2011-03-01 Resin composition, prepreg, and laminated sheet
SG2012064515A SG183841A1 (en) 2010-03-02 2011-03-01 Resin composition, prepreg, and laminated sheet

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2012064515A SG183841A1 (en) 2010-03-02 2011-03-01 Resin composition, prepreg, and laminated sheet

Country Status (8)

Country Link
US (1) US20130045650A1 (ja)
EP (1) EP2543687B1 (ja)
JP (2) JP5892340B2 (ja)
KR (3) KR102002178B1 (ja)
CN (2) CN102844350B (ja)
SG (2) SG10201501469PA (ja)
TW (1) TWI499632B (ja)
WO (1) WO2011108524A1 (ja)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041386A (ja) * 2010-08-12 2012-03-01 Sumitomo Bakelite Co Ltd 回路基板用熱硬化性樹脂組成物
SG187208A1 (en) 2010-08-31 2013-02-28 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminated sheet
US10655003B2 (en) 2010-10-14 2020-05-19 Lg Chem, Ltd. Resin blend for melting process
KR101856806B1 (ko) * 2011-01-20 2018-06-19 미츠비시 가스 가가쿠 가부시키가이샤 수지 조성물, 프리프레그, 및 적층판
WO2012165240A1 (ja) * 2011-05-27 2012-12-06 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、および積層板
CN103298882B (zh) 2011-07-22 2016-08-17 株式会社Lg化学 热固性树脂组合物及使用其的预浸料和金属箔层压板
JP5344022B2 (ja) * 2011-11-16 2013-11-20 住友ベークライト株式会社 エポキシ樹脂組成物、プリプレグ、積層板、樹脂シート、プリント配線板及び半導体装置
JP6065845B2 (ja) * 2012-01-31 2017-01-25 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
JP5987262B2 (ja) * 2012-08-16 2016-09-07 Dic株式会社 硬化性樹脂組成物、硬化物、及びプリント配線基板
JP5987261B2 (ja) * 2012-08-16 2016-09-07 Dic株式会社 硬化性樹脂組成物、硬化物、及びプリント配線基板
JP6314830B2 (ja) * 2012-10-19 2018-04-25 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、積層板、及びプリント配線板
CN102911502A (zh) * 2012-10-19 2013-02-06 广东生益科技股份有限公司 氰酸酯树脂组合物及使用其制作的预浸料、层压材料与覆金属箔层压材料
CN102924865A (zh) * 2012-10-19 2013-02-13 广东生益科技股份有限公司 氰酸酯树脂组合物及使用其制作的预浸料、层压材料与覆金属箔层压材料
US10030141B2 (en) 2012-10-19 2018-07-24 Mitsubishi Gas Chemical Company, Inc. Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board
CN103724998A (zh) * 2013-05-30 2014-04-16 广东生益科技股份有限公司 一种氰酸酯树脂组合物及其用途
CN103724999A (zh) * 2013-05-30 2014-04-16 广东生益科技股份有限公司 一种氰酸酯树脂组合物及其用途
JP2014240456A (ja) * 2013-06-11 2014-12-25 住友ベークライト株式会社 プライマー層付きプリプレグ、金属張積層板、プリント配線基板および半導体パッケージ
KR101516068B1 (ko) * 2013-06-14 2015-04-29 삼성전기주식회사 인쇄회로기판용 수지 조성물, 빌드업필름, 프리프레그 및 인쇄회로기판
JP6186977B2 (ja) * 2013-07-22 2017-08-30 住友ベークライト株式会社 樹脂組成物、樹脂シート、プリプレグ、積層板、プリント配線板、及び半導体装置
EP3061745A4 (en) * 2013-10-25 2017-07-12 Mitsubishi Gas Chemical Company, Inc. Cyanic acid ester compound, curable resin composition containing said compound, and cured product thereof
JP6229439B2 (ja) * 2013-11-05 2017-11-15 住友ベークライト株式会社 金属張積層板、プリント配線基板、および半導体装置
JP2015232066A (ja) * 2014-06-09 2015-12-24 日立化成株式会社 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
JP6318885B2 (ja) * 2014-06-09 2018-05-09 日立化成株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及びプリント配線板
KR101737179B1 (ko) * 2014-09-23 2017-05-18 삼성에스디아이 주식회사 반도체 소자 밀봉용 에폭시수지 조성물 및 이를 사용하여 밀봉된 반도체 소자
JP6011745B2 (ja) * 2014-10-01 2016-10-19 Dic株式会社 エポキシ樹脂組成物及びその硬化物
US10869390B2 (en) * 2015-07-06 2020-12-15 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate, and printed circuit board
JP7088031B2 (ja) * 2017-02-17 2022-06-21 昭和電工マテリアルズ株式会社 プリプレグ、積層板、プリント配線板、コアレス基板、半導体パッケージ及びコアレス基板の製造方法
JP6354884B1 (ja) * 2017-03-13 2018-07-11 横浜ゴム株式会社 シアネートエステル樹脂組成物およびプリプレグ
US20200166844A1 (en) 2017-05-15 2020-05-28 Mitsubishi Gas Chemical Company, Inc. Film forming material for lithography, composition for film formation for lithography, underlayer film for lithography, and method for forming pattern
JP6905683B2 (ja) * 2017-07-11 2021-07-21 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート及びプリント配線板
CN107696184A (zh) * 2017-08-31 2018-02-16 成都九十度工业产品设计有限公司 一种酚醛树脂浸渍纸客车底板用板材
TWI675063B (zh) 2018-01-02 2019-10-21 聯茂電子股份有限公司 無鹵環氧樹脂組成物、積層板以及印刷電路板
TW201936578A (zh) 2018-02-28 2019-09-16 日商三菱瓦斯化學股份有限公司 化合物、樹脂、組成物及使用其之微影用膜形成材料
CN112400138A (zh) 2018-06-26 2021-02-23 三菱瓦斯化学株式会社 光刻用膜形成材料、光刻用膜形成用组合物、光刻用下层膜和图案形成方法
EP3831882A4 (en) 2018-07-31 2021-09-22 Mitsubishi Gas Chemical Company, Inc. COMPOSITION FOR FORMING AN OPTICAL COMPONENT, OPTICAL COMPONENT, JOINT AND RESIN
EP3842863A4 (en) 2018-08-20 2021-11-03 Mitsubishi Gas Chemical Company, Inc. FILM EDUCATION MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FILM FORMATION FOR LITHOGRAPHY, LAYER FILM FOR LITHOGRAPHY AND PATTERN GENERATION PROCESS
JP7426629B2 (ja) * 2018-12-12 2024-02-02 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及びプリント配線板
CN111757911B (zh) * 2018-12-29 2023-02-28 广东生益科技股份有限公司 树脂组合物、预浸料、层压板、覆金属箔层压板和印刷线路板
CN112936690A (zh) * 2021-02-03 2021-06-11 哈尔滨玻璃钢研究院有限公司 一种耐烧蚀内衬的成型方法
TW202323344A (zh) * 2021-10-15 2023-06-16 日商三菱瓦斯化學股份有限公司 樹脂組成物、疊層體、設有樹脂組成物層之半導體晶片、設有樹脂組成物層之半導體晶片搭載用基板、及半導體裝置
WO2023063282A1 (ja) * 2021-10-15 2023-04-20 三菱瓦斯化学株式会社 樹脂組成物、積層体、樹脂組成物層付き半導体チップ、樹脂組成物層付き半導体チップ搭載用基板、及び半導体装置

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0848001A (ja) 1994-08-08 1996-02-20 Matsushita Electric Works Ltd 銅張積層板
JP3173332B2 (ja) 1995-03-13 2001-06-04 新神戸電機株式会社 金属箔張り積層板の製造法
JPH093167A (ja) * 1995-04-21 1997-01-07 Toshiba Corp 樹脂組成物及びこれを用いた樹脂封止型半導体装置
JPH11124487A (ja) * 1997-10-22 1999-05-11 Mitsubishi Gas Chem Co Inc シアン酸エステル−マレイミド液状樹脂組成物及び半導体封止装置
JPH11322895A (ja) * 1998-05-19 1999-11-26 Hitachi Ltd エポキシ樹脂、エポキシ樹脂組成物
JP2000158589A (ja) 1998-11-30 2000-06-13 Shin Kobe Electric Mach Co Ltd 金属箔張り積層板の製造法
JP2003002949A (ja) * 2001-06-26 2003-01-08 Matsushita Electric Works Ltd 半導体封止用液状エポキシ樹脂組成物および半導体装置
JP2003246849A (ja) 2002-02-26 2003-09-05 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物、ならびにそれを用いたプリプレグ、積層板及びプリント配線板
JP4198508B2 (ja) * 2003-04-08 2008-12-17 三井化学株式会社 変性ポリイミド樹脂組成物ならびにそれを用いたプリプレグおよび積層板
JP4059244B2 (ja) 2004-11-24 2008-03-12 松下電工株式会社 エポキシ樹脂組成物、並びにプリプレグ、積層板、プリント配線板
JP4707615B2 (ja) 2006-06-20 2011-06-22 ヤンマー株式会社 コンバイン
JP5387872B2 (ja) 2006-07-31 2014-01-15 Ｄｉｃ株式会社 エポキシ樹脂組成物及びその硬化物
JP5332094B2 (ja) * 2006-09-21 2013-11-06 住友ベークライト株式会社 半導体封止用樹脂組成物及び半導体装置
US7601429B2 (en) * 2007-02-07 2009-10-13 Mitsubishi Gas Chemical Company, Inc. Prepreg and laminate
JP5263705B2 (ja) * 2007-02-07 2013-08-14 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP5024205B2 (ja) * 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP5384809B2 (ja) * 2007-07-18 2014-01-08 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP2009120667A (ja) * 2007-11-13 2009-06-04 Showa Highpolymer Co Ltd 熱硬化性樹脂組成物、それを用いた硬化物及び積層板
JP2009155399A (ja) * 2007-12-25 2009-07-16 Hitachi Chem Co Ltd 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板
JP2009227742A (ja) * 2008-03-19 2009-10-08 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物、半導体封止用エポキシ樹脂組成物及び半導体装置
DE602009000326D1 (de) * 2008-04-01 2010-12-23 Mitsubishi Gas Chemical Co Harzzusammensetzung, Prepreg und mit einer Metallfolie kaschiertes Laminat
JP5008201B2 (ja) * 2008-05-21 2012-08-22 三智商事株式会社 無線ｉｃタグ
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JP3173332U (ja) 2011-11-17 2012-02-02 奇▲こう▼科技股▲ふん▼有限公司 含油軸受ファン構造

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TWI499632B (zh) 2015-09-11
KR102002178B1 (ko) 2019-10-21
KR20190086052A (ko) 2019-07-19
CN102844350B (zh) 2015-11-25
EP2543687A1 (en) 2013-01-09
TW201141936A (en) 2011-12-01
EP2543687A4 (en) 2017-05-24
WO2011108524A1 (ja) 2011-09-09
SG183841A1 (en) 2012-10-30
KR20130018721A (ko) 2013-02-25
EP2543687B1 (en) 2020-01-15
KR20170133431A (ko) 2017-12-05
CN105315435A (zh) 2016-02-10
KR102107366B1 (ko) 2020-05-07
US20130045650A1 (en) 2013-02-21
CN102844350A (zh) 2012-12-26

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