SG10201506152WA - Resin composition, prepreg, and laminated sheet - Google Patents
Resin composition, prepreg, and laminated sheetInfo
- Publication number
- SG10201506152WA SG10201506152WA SG10201506152WA SG10201506152WA SG10201506152WA SG 10201506152W A SG10201506152W A SG 10201506152WA SG 10201506152W A SG10201506152W A SG 10201506152WA SG 10201506152W A SG10201506152W A SG 10201506152WA SG 10201506152W A SG10201506152W A SG 10201506152WA
- Authority
- SG
- Singapore
- Prior art keywords
- prepreg
- resin composition
- laminated sheet
- laminated
- sheet
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/58—Cuttability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
- B32B2307/734—Dimensional stability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/262—Alkali metal carbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/267—Magnesium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010194390 | 2010-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201506152WA true SG10201506152WA (en) | 2015-09-29 |
Family
ID=45772778
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013006192A SG187208A1 (en) | 2010-08-31 | 2011-08-29 | Resin composition, prepreg, and laminated sheet |
SG10201506152WA SG10201506152WA (en) | 2010-08-31 | 2011-08-29 | Resin composition, prepreg, and laminated sheet |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013006192A SG187208A1 (en) | 2010-08-31 | 2011-08-29 | Resin composition, prepreg, and laminated sheet |
Country Status (8)
Country | Link |
---|---|
US (2) | US20130136930A1 (en) |
EP (1) | EP2612885B1 (en) |
JP (1) | JP6157121B2 (en) |
KR (1) | KR20130141449A (en) |
CN (2) | CN103080225A (en) |
SG (2) | SG187208A1 (en) |
TW (1) | TWI600700B (en) |
WO (1) | WO2012029690A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012050400A2 (en) | 2010-10-14 | 2012-04-19 | 주식회사 엘지화학 | Resin blend for melting process |
SG191949A1 (en) * | 2011-01-20 | 2013-08-30 | Mitsubishi Gas Chemical Co | Resin composition, prepreg and laminate |
JP6010871B2 (en) * | 2011-05-27 | 2016-10-19 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, and laminate |
KR101503005B1 (en) | 2011-07-22 | 2015-03-18 | 주식회사 엘지화학 | Thermosetting resin composition and Prepreg and Metal Clad laminate using the same |
KR20140097272A (en) * | 2011-11-01 | 2014-08-06 | 다우 코닝 코포레이션 | High glass transition temperature resin formulations |
CN104093764B (en) * | 2012-01-31 | 2018-06-08 | 三菱瓦斯化学株式会社 | Printed circuit board material resin combination and prepreg, resin sheet, clad with metal foil plywood and the printed circuit board for having used it |
JP6408752B2 (en) * | 2012-03-14 | 2018-10-17 | 日立化成株式会社 | Compatibilized resin, and prepreg and laminate using the same |
WO2014061811A1 (en) * | 2012-10-19 | 2014-04-24 | 三菱瓦斯化学株式会社 | Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board |
WO2014059654A1 (en) * | 2012-10-19 | 2014-04-24 | 广东生益科技股份有限公司 | Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same |
US9902851B2 (en) | 2012-10-19 | 2018-02-27 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, laminate, and printed wiring board |
KR102124753B1 (en) * | 2012-11-28 | 2020-06-19 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, laminated plate, metal foil-clad laminated plate, and printed circuit board |
JP6183583B2 (en) * | 2013-02-14 | 2017-08-23 | 味の素株式会社 | Curable resin composition |
JP6217895B2 (en) * | 2013-02-14 | 2017-10-25 | 味の素株式会社 | Curable resin composition |
JP6308344B2 (en) * | 2013-04-08 | 2018-04-11 | 味の素株式会社 | Curable resin composition |
WO2014203866A1 (en) * | 2013-06-18 | 2014-12-24 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, resin sheet and metal foil-clad laminate |
WO2015051541A1 (en) * | 2013-10-11 | 2015-04-16 | 广东生益科技股份有限公司 | Thermosetting resin composition and use thereof |
US9929319B2 (en) * | 2014-06-13 | 2018-03-27 | General Electric Company | LED package with red-emitting phosphors |
CN104403186B (en) * | 2014-11-14 | 2017-02-22 | 宁波一舟塑胶有限公司 | Composite synergistic flame-retardant smoke-suppression low-smoke halogen-free framework material |
FI127564B (en) * | 2016-12-21 | 2018-09-14 | Paroc Group Oy | Fire retardant composition and method of producing the same, and insulation product comprising the fire retardant composition and method of producing the same |
CN113631533A (en) * | 2019-02-22 | 2021-11-09 | 美铝澳大利亚有限公司 | Fertilizer composition |
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JPS55163057A (en) * | 1979-05-15 | 1980-12-18 | Dainippon Ink & Chemicals | Powdered fireeextinguishing substance and its preparation |
JPH02255843A (en) | 1988-11-22 | 1990-10-16 | Furukawa Electric Co Ltd:The | Flame-retarding resin composition and flame-retarding cable prepared by using same |
JPH03190965A (en) * | 1989-12-20 | 1991-08-20 | Furukawa Electric Co Ltd:The | Thermosetting resin composition |
JP2592191B2 (en) * | 1991-12-24 | 1997-03-19 | 積水樹脂株式会社 | Low smoke emitting flame retardant resin composition |
US6130282A (en) * | 1997-10-01 | 2000-10-10 | Kyowa Chemical Industry Co Ltd | Flame retardant resin composition |
DK0960907T3 (en) * | 1998-05-22 | 2004-01-26 | Kyowa Chem Ind Co Ltd | Flame retardant thermoplastic resin composition |
JP2002521409A (en) * | 1998-07-30 | 2002-07-16 | ザ、プロクター、エンド、ギャンブル、カンパニー | Hair conditioning composition comprising carboxylic acid / carboxylate copolymer and visible particles |
BR9916010A (en) * | 1998-12-09 | 2001-09-04 | Vantico Ag | Hydrophobic epoxy resin system |
JP2002284844A (en) | 2001-03-23 | 2002-10-03 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP2004059643A (en) | 2002-07-25 | 2004-02-26 | Mitsubishi Gas Chem Co Inc | Prepreg and laminated plate |
US7118494B2 (en) * | 2005-01-24 | 2006-10-10 | Bridgestone Sports Co., Ltd. | Multi-piece solid golf ball |
JP4940680B2 (en) | 2006-02-06 | 2012-05-30 | 三菱瓦斯化学株式会社 | Resin composition and prepreg and laminate using the same |
US8153555B2 (en) * | 2006-09-29 | 2012-04-10 | Dai Nippon Printing Co., Ltd. | Thermal transfer sheet |
KR101090654B1 (en) * | 2006-10-02 | 2011-12-07 | 히다치 가세고교 가부시끼가이샤 | Epoxy resin molding material for sealing and electronic component device |
JP5024205B2 (en) | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
JP5559992B2 (en) * | 2008-06-11 | 2014-07-23 | 花王株式会社 | Water-in-oil emulsified cosmetic |
JP5497287B2 (en) * | 2008-12-25 | 2014-05-21 | 高級アルコール工業株式会社 | Water-in-oil emulsified cosmetic |
CN105399975B (en) | 2009-02-25 | 2020-10-27 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
CN101643570B (en) * | 2009-08-24 | 2011-08-10 | 广东生益科技股份有限公司 | Halogen-free flame resistance resin composite and prepreg, laminate and laminate for printed circuit prepared from same |
US8031344B2 (en) | 2009-10-30 | 2011-10-04 | Hermes Microvision, Inc. | Z-stage configuration and application thereof |
CN102844350B (en) | 2010-03-02 | 2015-11-25 | 三菱瓦斯化学株式会社 | Resin combination, prepreg and veneer sheet |
SG10201502708PA (en) | 2010-04-08 | 2015-05-28 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, and laminated sheet |
-
2011
- 2011-08-29 SG SG2013006192A patent/SG187208A1/en unknown
- 2011-08-29 KR KR1020137004724A patent/KR20130141449A/en active Search and Examination
- 2011-08-29 JP JP2012531853A patent/JP6157121B2/en active Active
- 2011-08-29 CN CN2011800417457A patent/CN103080225A/en active Pending
- 2011-08-29 CN CN201610202827.XA patent/CN105860436B/en active Active
- 2011-08-29 SG SG10201506152WA patent/SG10201506152WA/en unknown
- 2011-08-29 WO PCT/JP2011/069393 patent/WO2012029690A1/en active Application Filing
- 2011-08-29 EP EP11821706.6A patent/EP2612885B1/en active Active
- 2011-08-29 US US13/816,008 patent/US20130136930A1/en not_active Abandoned
- 2011-08-29 TW TW100130933A patent/TWI600700B/en active
-
2016
- 2016-11-29 US US15/363,395 patent/US9902825B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201229121A (en) | 2012-07-16 |
US20170073485A1 (en) | 2017-03-16 |
WO2012029690A1 (en) | 2012-03-08 |
EP2612885A1 (en) | 2013-07-10 |
EP2612885A4 (en) | 2017-05-10 |
US9902825B2 (en) | 2018-02-27 |
CN103080225A (en) | 2013-05-01 |
CN105860436A (en) | 2016-08-17 |
TWI600700B (en) | 2017-10-01 |
US20130136930A1 (en) | 2013-05-30 |
KR20130141449A (en) | 2013-12-26 |
EP2612885B1 (en) | 2019-07-24 |
JPWO2012029690A1 (en) | 2013-10-28 |
CN105860436B (en) | 2019-01-18 |
SG187208A1 (en) | 2013-02-28 |
JP6157121B2 (en) | 2017-07-05 |
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