SE9102183L - En skaermningskonstruktion foer elektriska anordningar - Google Patents

En skaermningskonstruktion foer elektriska anordningar

Info

Publication number
SE9102183L
SE9102183L SE9102183A SE9102183A SE9102183L SE 9102183 L SE9102183 L SE 9102183L SE 9102183 A SE9102183 A SE 9102183A SE 9102183 A SE9102183 A SE 9102183A SE 9102183 L SE9102183 L SE 9102183L
Authority
SE
Sweden
Prior art keywords
electrical devices
shield construction
shielding construction
deterioration
radiation
Prior art date
Application number
SE9102183A
Other languages
Unknown language ( )
English (en)
Other versions
SE517149C2 (sv
SE9102183D0 (sv
Inventor
H Ono
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2200997A external-priority patent/JPH0817352B2/ja
Priority claimed from JP2260185A external-priority patent/JP2767998B2/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SE9102183D0 publication Critical patent/SE9102183D0/sv
Publication of SE9102183L publication Critical patent/SE9102183L/sv
Publication of SE517149C2 publication Critical patent/SE517149C2/sv

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/642Capacitive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/03Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/19Arrangements of transmitters, receivers, or complete sets to prevent eavesdropping, to attenuate local noise or to prevent undesired transmission; Mouthpieces or receivers specially adapted therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SE9102183A 1990-07-27 1991-07-15 En skärmningskonstruktion för elektriska anordningar SE517149C2 (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2200997A JPH0817352B2 (ja) 1990-07-27 1990-07-27 電子部品
JP2260185A JP2767998B2 (ja) 1990-09-27 1990-09-27 電子部品のシールド構造

Publications (3)

Publication Number Publication Date
SE9102183D0 SE9102183D0 (sv) 1991-07-15
SE9102183L true SE9102183L (sv) 1992-01-28
SE517149C2 SE517149C2 (sv) 2002-04-23

Family

ID=26512519

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9102183A SE517149C2 (sv) 1990-07-27 1991-07-15 En skärmningskonstruktion för elektriska anordningar

Country Status (3)

Country Link
US (1) US5270488A (sv)
FR (1) FR2665818B1 (sv)
SE (1) SE517149C2 (sv)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2092371C (en) * 1993-03-24 1999-06-29 Boris L. Livshits Integrated circuit packaging
US5473112A (en) * 1993-09-13 1995-12-05 Vlsi Technology, Inc. Security circuitry with select line and data line shielding
JP2944405B2 (ja) * 1993-12-29 1999-09-06 日本電気株式会社 半導体素子の冷却構造および電磁遮蔽構造
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
US5679975A (en) * 1995-12-18 1997-10-21 Integrated Device Technology, Inc. Conductive encapsulating shield for an integrated circuit
FR2774810B1 (fr) * 1998-02-10 2003-06-06 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
WO2000018202A1 (fr) * 1998-09-17 2000-03-30 Ibiden Co., Ltd. Tableau de connexions multicouche d'accumulation
WO2001028305A1 (en) 1999-10-12 2001-04-19 Shielding For Electronics, Inc. Emi containment apparatus
WO2001054196A1 (en) * 2000-01-18 2001-07-26 Sunrisetek, Llc Dual-sided, surface mountable integrated circuit package
WO2001080314A2 (en) * 2000-04-14 2001-10-25 Mayo Foundation For Medical Education And Research Of The State Of Minnesota Performance enhanced leaded packaging for electrical components
US6643918B2 (en) * 2000-04-17 2003-11-11 Shielding For Electronics, Inc. Methods for shielding of cables and connectors
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
US6424031B1 (en) 2000-05-08 2002-07-23 Amkor Technology, Inc. Stackable package with heat sink
US6667544B1 (en) 2000-06-30 2003-12-23 Amkor Technology, Inc. Stackable package having clips for fastening package and tool for opening clips
US6452811B1 (en) * 2000-09-01 2002-09-17 Motorola, Inc. Augmented circuitry integration for a printed circuit board
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
JP2003124834A (ja) * 2001-10-12 2003-04-25 Toshiba Corp チューナ用ic入力回路
JP4641762B2 (ja) * 2003-10-16 2011-03-02 シャープ株式会社 光半導体装置
DE102004014439A1 (de) * 2004-03-24 2005-07-07 Siemens Ag Schaltkreis-Anordnung und Schaltkreis-Vorrichtung
US7636245B2 (en) * 2007-06-25 2009-12-22 Novatel Wireless, Inc. Electronic component cover and arrangement
KR20130038503A (ko) * 2011-10-10 2013-04-18 삼성전자주식회사 전자장치의 pba 적층구조
US11049817B2 (en) * 2019-02-25 2021-06-29 Nxp B.V. Semiconductor device with integral EMI shield

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614546A (en) * 1970-01-07 1971-10-19 Rca Corp Shielded semiconductor device
JPS5810396A (ja) * 1981-07-13 1983-01-20 日本電気ホームエレクトロニクス株式会社 放電灯点灯装置
JPS58164292A (ja) * 1982-03-24 1983-09-29 松下電器産業株式会社 印刷配線板
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
JPS624347A (ja) * 1985-07-01 1987-01-10 Fujitsu Ltd パツケ−ジのシ−ルド方法
JPS62137860A (ja) * 1985-12-11 1987-06-20 Nec Corp 半導体集積回路用セラミツクスケ−ス
JPS62183549A (ja) * 1986-02-07 1987-08-11 Nec Kansai Ltd 半導体装置
JPH01102990A (ja) * 1987-10-16 1989-04-20 Matsushita Electric Ind Co Ltd 小形電子部品実装回路
JPH0214554A (ja) * 1988-07-01 1990-01-18 Fujitsu Ltd シールド付icパッケージおよび製造方法
JPH0258363A (ja) * 1988-08-24 1990-02-27 Hitachi Commun Syst Inc バイパスコンデンサ実装方式
JPH02105557A (ja) * 1988-10-14 1990-04-18 Nec Corp 樹脂封止型半導体装置
US5043533A (en) * 1989-05-08 1991-08-27 Honeywell Inc. Chip package capacitor cover

Also Published As

Publication number Publication date
SE517149C2 (sv) 2002-04-23
AU647495B2 (en) 1994-03-24
FR2665818B1 (fr) 1995-03-17
AU8039091A (en) 1992-01-30
FR2665818A1 (fr) 1992-02-14
US5270488A (en) 1993-12-14
SE9102183D0 (sv) 1991-07-15

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