SE9102183D0 - A shield construction of electrical devices - Google Patents

A shield construction of electrical devices

Info

Publication number
SE9102183D0
SE9102183D0 SE9102183A SE9102183A SE9102183D0 SE 9102183 D0 SE9102183 D0 SE 9102183D0 SE 9102183 A SE9102183 A SE 9102183A SE 9102183 A SE9102183 A SE 9102183A SE 9102183 D0 SE9102183 D0 SE 9102183D0
Authority
SE
Sweden
Prior art keywords
electrical devices
shield construction
shield
deterioration
radiation
Prior art date
Application number
SE9102183A
Other languages
English (en)
Other versions
SE9102183L (sv
SE517149C2 (sv
Inventor
O Hideyo
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2200997A external-priority patent/JPH0817352B2/ja
Priority claimed from JP2260185A external-priority patent/JP2767998B2/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of SE9102183D0 publication Critical patent/SE9102183D0/sv
Publication of SE9102183L publication Critical patent/SE9102183L/sv
Publication of SE517149C2 publication Critical patent/SE517149C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/19—Arrangements of transmitters, receivers, or complete sets to prevent eavesdropping, to attenuate local noise or to prevent undesired transmission; Mouthpieces or receivers specially adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
SE9102183A 1990-07-27 1991-07-15 En skärmningskonstruktion för elektriska anordningar SE517149C2 (sv)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2200997A JPH0817352B2 (ja) 1990-07-27 1990-07-27 電子部品
JP2260185A JP2767998B2 (ja) 1990-09-27 1990-09-27 電子部品のシールド構造

Publications (3)

Publication Number Publication Date
SE9102183D0 true SE9102183D0 (sv) 1991-07-15
SE9102183L SE9102183L (sv) 1992-01-28
SE517149C2 SE517149C2 (sv) 2002-04-23

Family

ID=26512519

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9102183A SE517149C2 (sv) 1990-07-27 1991-07-15 En skärmningskonstruktion för elektriska anordningar

Country Status (3)

Country Link
US (1) US5270488A (sv)
FR (1) FR2665818B1 (sv)
SE (1) SE517149C2 (sv)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2092371C (en) * 1993-03-24 1999-06-29 Boris L. Livshits Integrated circuit packaging
US5473112A (en) * 1993-09-13 1995-12-05 Vlsi Technology, Inc. Security circuitry with select line and data line shielding
JP2944405B2 (ja) * 1993-12-29 1999-09-06 日本電気株式会社 半導体素子の冷却構造および電磁遮蔽構造
US5811050A (en) 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
US5679975A (en) * 1995-12-18 1997-10-21 Integrated Device Technology, Inc. Conductive encapsulating shield for an integrated circuit
FR2774810B1 (fr) * 1998-02-10 2003-06-06 St Microelectronics Sa Boitier semi-conducteur blinde et procede pour sa fabrication
US6613986B1 (en) * 1998-09-17 2003-09-02 Ibiden Co., Ltd. Multilayer build-up wiring board
BR0014718A (pt) 1999-10-12 2003-07-15 Shielding For Electronics Inc Aparelho de confinamento de emi
AU2001229547A1 (en) * 2000-01-18 2001-07-31 Sunrisetek, Llc Dual-sided, surface mountable integrated circuit package
WO2001080314A2 (en) * 2000-04-14 2001-10-25 Mayo Foundation For Medical Education And Research Of The State Of Minnesota Performance enhanced leaded packaging for electrical components
US6643918B2 (en) * 2000-04-17 2003-11-11 Shielding For Electronics, Inc. Methods for shielding of cables and connectors
US20010033478A1 (en) * 2000-04-21 2001-10-25 Shielding For Electronics, Inc. EMI and RFI shielding for printed circuit boards
US6424031B1 (en) 2000-05-08 2002-07-23 Amkor Technology, Inc. Stackable package with heat sink
US6667544B1 (en) 2000-06-30 2003-12-23 Amkor Technology, Inc. Stackable package having clips for fastening package and tool for opening clips
US6452811B1 (en) * 2000-09-01 2002-09-17 Motorola, Inc. Augmented circuitry integration for a printed circuit board
US6768654B2 (en) * 2000-09-18 2004-07-27 Wavezero, Inc. Multi-layered structures and methods for manufacturing the multi-layered structures
JP2003124834A (ja) * 2001-10-12 2003-04-25 Toshiba Corp チューナ用ｉｃ入力回路
JP4641762B2 (ja) * 2003-10-16 2011-03-02 シャープ株式会社 光半導体装置
DE102004014439A1 (de) * 2004-03-24 2005-07-07 Siemens Ag Schaltkreis-Anordnung und Schaltkreis-Vorrichtung
US7636245B2 (en) * 2007-06-25 2009-12-22 Novatel Wireless, Inc. Electronic component cover and arrangement
KR20130038503A (ko) * 2011-10-10 2013-04-18 삼성전자주식회사 전자장치의 ｐｂａ 적층구조
US11049817B2 (en) * 2019-02-25 2021-06-29 Nxp B.V. Semiconductor device with integral EMI shield

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614546A (en) * 1970-01-07 1971-10-19 Rca Corp Shielded semiconductor device
JPS5810396A (ja) * 1981-07-13 1983-01-20 日本電気ホームエレクトロニクス株式会社 放電灯点灯装置
JPS58164292A (ja) * 1982-03-24 1983-09-29 松下電器産業株式会社 印刷配線板
JPS5954249A (ja) * 1982-09-22 1984-03-29 Fujitsu Ltd 半導体装置
US4584627A (en) * 1985-01-09 1986-04-22 Rogers Corporation Flat decoupling capacitor and method of manufacture thereof
JPS624347A (ja) * 1985-07-01 1987-01-10 Fujitsu Ltd パツケ−ジのシ−ルド方法
JPS62137860A (ja) * 1985-12-11 1987-06-20 Nec Corp 半導体集積回路用セラミツクスケ−ス
JPS62183549A (ja) * 1986-02-07 1987-08-11 Nec Kansai Ltd 半導体装置
JPH01102990A (ja) * 1987-10-16 1989-04-20 Matsushita Electric Ind Co Ltd 小形電子部品実装回路
JPH0214554A (ja) * 1988-07-01 1990-01-18 Fujitsu Ltd シールド付ｉｃパッケージおよび製造方法
JPH0258363A (ja) * 1988-08-24 1990-02-27 Hitachi Commun Syst Inc バイパスコンデンサ実装方式
JPH02105557A (ja) * 1988-10-14 1990-04-18 Nec Corp 樹脂封止型半導体装置
US5043533A (en) * 1989-05-08 1991-08-27 Honeywell Inc. Chip package capacitor cover

Also Published As

Publication number Publication date
US5270488A (en) 1993-12-14
SE9102183L (sv) 1992-01-28
FR2665818A1 (fr) 1992-02-14
AU8039091A (en) 1992-01-30
AU647495B2 (en) 1994-03-24
FR2665818B1 (fr) 1995-03-17
SE517149C2 (sv) 2002-04-23

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Legal Events

Date Code Title Description
NUG Patent has lapsed