FR2774810B1 - Boitier semi-conducteur blinde et procede pour sa fabrication - Google Patents

Boitier semi-conducteur blinde et procede pour sa fabrication

Info

Publication number
FR2774810B1
FR2774810B1 FR9801549A FR9801549A FR2774810B1 FR 2774810 B1 FR2774810 B1 FR 2774810B1 FR 9801549 A FR9801549 A FR 9801549A FR 9801549 A FR9801549 A FR 9801549A FR 2774810 B1 FR2774810 B1 FR 2774810B1
Authority
FR
France
Prior art keywords
armored
production
semiconductor package
package
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9801549A
Other languages
English (en)
Other versions
FR2774810A1 (fr
Inventor
Remi Brechignac
Alexandre Castellane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR9801549A priority Critical patent/FR2774810B1/fr
Priority to US09/237,345 priority patent/US6312975B1/en
Publication of FR2774810A1 publication Critical patent/FR2774810A1/fr
Application granted granted Critical
Publication of FR2774810B1 publication Critical patent/FR2774810B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
FR9801549A 1998-02-10 1998-02-10 Boitier semi-conducteur blinde et procede pour sa fabrication Expired - Fee Related FR2774810B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9801549A FR2774810B1 (fr) 1998-02-10 1998-02-10 Boitier semi-conducteur blinde et procede pour sa fabrication
US09/237,345 US6312975B1 (en) 1998-02-10 1999-01-26 Semiconductor package and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9801549A FR2774810B1 (fr) 1998-02-10 1998-02-10 Boitier semi-conducteur blinde et procede pour sa fabrication

Publications (2)

Publication Number Publication Date
FR2774810A1 FR2774810A1 (fr) 1999-08-13
FR2774810B1 true FR2774810B1 (fr) 2003-06-06

Family

ID=9522789

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9801549A Expired - Fee Related FR2774810B1 (fr) 1998-02-10 1998-02-10 Boitier semi-conducteur blinde et procede pour sa fabrication

Country Status (2)

Country Link
US (1) US6312975B1 (fr)
FR (1) FR2774810B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8507319B2 (en) * 2007-12-07 2013-08-13 Stats Chippac Ltd. Integrated circuit package system with shield
US7902644B2 (en) * 2007-12-07 2011-03-08 Stats Chippac Ltd. Integrated circuit package system for electromagnetic isolation
US9406646B2 (en) 2011-10-27 2016-08-02 Infineon Technologies Ag Electronic device and method for fabricating an electronic device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122759A (ja) * 1982-01-14 1983-07-21 Fujitsu Ltd 半導体装置
JPS5922333A (ja) * 1982-07-28 1984-02-04 Citizen Watch Co Ltd Ｉｃの樹脂封止方法
JPS5951555A (ja) * 1982-09-17 1984-03-26 Nec Corp 半導体集積回路装置
JPH0353550A (ja) * 1989-07-21 1991-03-07 Nec Corp Ｉｃパッケージ
US5270488A (en) * 1990-07-27 1993-12-14 Mitsubishi Denki Kabushiki Kaisha Shield construction for electrical devices
JPH04147652A (ja) * 1990-10-09 1992-05-21 Nec Ic Microcomput Syst Ltd 半導体装置用パッケージ
JPH04278567A (ja) * 1991-03-07 1992-10-05 Hitachi Ltd 半導体集積回路装置
US5679975A (en) * 1995-12-18 1997-10-21 Integrated Device Technology, Inc. Conductive encapsulating shield for an integrated circuit

Also Published As

Publication number Publication date
US6312975B1 (en) 2001-11-06
FR2774810A1 (fr) 1999-08-13

Similar Documents

Publication Publication Date Title
FR2781310B1 (fr) Condensateur cylindrique et procede pour sa fabrication
GB2353404B (en) Semiconductor device and method for manufacturing the same
HK1034805A1 (en) Chip scale surface mount package for semiconductordevice and process of fabricating the same.
KR960012575A (ko) 반도체 장치 제조 방법
EP1122769A4 (fr) Dispositif a semi-conducteurs et procede de fabrication de ce dernier
FR2798220B1 (fr) Inductance et procede de fabrication
FR2804681B1 (fr) Compose antidiabetique et procede pour sa production
KR960012574A (ko) 반도체장치 제조방법
GB2296819B (en) Method for fabricating semiconductor devices
SG77707A1 (en) Semiconductor device and method for manufacturing the same
GB9927693D0 (en) Semiconductor device production method
FI954241A (fi) Puolijohdelaitteen valmistusmenetelmä
FR2756887B1 (fr) Tribosysteme et procede pour sa fabrication
FR2786939B1 (fr) Laser a semi-conducteur et son procede de fabrication
FR2845206B1 (fr) Concentrateur d'ondes electromagnetiques ultraleger, et procede de fabrication de celui-ci
HK1042163A1 (zh) 半導體製作方法
FR2778907B1 (fr) Ozoniseur et procede de fabrication dudit ozoniseur
EP1081769A4 (fr) Dispositif semi-conducteur et son procede de fabrication
FR2783356B1 (fr) Photodetecteur infrarouge et procede pour sa fabrication
FR2748183B1 (fr) Hydrophone et procede pour sa fabrication
FR2664745B1 (fr) Convertisseur thermoelectrique et procede pour sa fabrication.
FR2766920B1 (fr) Micromonochromateur et procede de realisation de celui-ci
FR2774810B1 (fr) Boitier semi-conducteur blinde et procede pour sa fabrication
FR2782229B1 (fr) Luminophore et procede pour produire celui-ci
SG70677A1 (en) Process for the production of semiconductor device

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20071030