AR246665A1 - Un aparato electromagnetico blindado para al menos un componente electronico. - Google Patents

Un aparato electromagnetico blindado para al menos un componente electronico.

Info

Publication number
AR246665A1
AR246665A1 AR92322236A AR32223692A AR246665A1 AR 246665 A1 AR246665 A1 AR 246665A1 AR 92322236 A AR92322236 A AR 92322236A AR 32223692 A AR32223692 A AR 32223692A AR 246665 A1 AR246665 A1 AR 246665A1
Authority
AR
Argentina
Prior art keywords
armored
contact
component
project
substrate
Prior art date
Application number
AR92322236A
Other languages
English (en)
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of AR246665A1 publication Critical patent/AR246665A1/es

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B15/00Suppression or limitation of noise or interference
    • H04B15/02Reducing interference from electric apparatus by means located at or near the interfering apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

APARATO ELECTROMAGNETICO BLINDADO PARA UN COMPONENTE ELECTRONICO QUE TIENEN A) UN SUSTRATO QUE INCLUYE MEDIOS DEFORMABLES CONDUCTORES ELECTRICOS QUE TIENEN UNA SUPERFICIE; B) MEDIOS QUE FORMAN UNA SUPERFICIE BLINDADA, PARA CUBRIR UNA PORCION DEL COMPONENTE, LA SUPERFICIE BLINDADA FORMADA ASI, ESTA COMPUESTA DE UN CONDUCTOR ELECTRICO, MATERIAL DE ABSORCION DE ONDAS ELECTROMAGNETICAS QUE ABSORBEN ENERGIA ELECTROMAGNETICA RADIADA POR O HACIA EL COMPONENTE; C) MEDIOS QUE FORMAN UN CONTACTO CONDUCTOR ELECTRICO, PARA PROPORCIONAR UNA SALIENTE CON UN BORDE; Y D)MEDIOS QUE FORMAN UN MIEMBRO DE RESORTE CONDUCTOR ELECTRICO, PARA ACOPLAR EL CONTACTO Y LA SUPERFICIE BLINDADA Y PARA INCLINAR EL CONTACTO HACIA EL SUSTRATO, PERMITIENDO AL BORDE DE LA SALIENTE EXTENDERSE SUSTANCIALMENTE MAS ALLA DE LA SUPERFICIE DE LOS MEDIOS DEFORMABLES CONDUCTORES ELECTRICOS, CAUSANDO UN DESPLAZAMIENTO PARCIAL DE LOS MISMOS Y UNA CONEXION ELECTRICA ENTRE LOS DOS.
AR92322236A 1991-05-03 1992-04-29 Un aparato electromagnetico blindado para al menos un componente electronico. AR246665A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/695,080 US5239127A (en) 1991-05-03 1991-05-03 Electrical interconnect apparatus

Publications (1)

Publication Number Publication Date
AR246665A1 true AR246665A1 (es) 1994-09-30

Family

ID=24791477

Family Applications (1)

Application Number Title Priority Date Filing Date
AR92322236A AR246665A1 (es) 1991-05-03 1992-04-29 Un aparato electromagnetico blindado para al menos un componente electronico.

Country Status (9)

Country Link
US (1) US5239127A (es)
JP (1) JPH05508518A (es)
KR (1) KR960015905B1 (es)
AR (1) AR246665A1 (es)
CA (1) CA2083278A1 (es)
DE (1) DE4291264T1 (es)
GB (1) GB2261121B (es)
MX (1) MX9202049A (es)
WO (1) WO1992020207A1 (es)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5373101A (en) * 1991-05-03 1994-12-13 Motorola, Inc. Electrical interconnect apparatus
DE4223322C1 (es) * 1992-07-16 1993-07-29 Schroff Gmbh, 7541 Straubenhardt, De
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
JPH0818265A (ja) * 1994-06-29 1996-01-19 Molex Inc プリント回路基板上での電磁波等のシ−ルド方法 及びその為のシ−ルドカバ−
US5814762A (en) * 1995-04-12 1998-09-29 Digital Equipment Corporation Grounding for enclosures
US6625881B2 (en) * 2001-09-11 2003-09-30 Xytrans, Inc. Solderless method for transferring high frequency, radio frequency signals between printed circuit boards
US6829148B2 (en) * 2001-09-14 2004-12-07 Honeywell International Inc. Apparatus and method for providing a ground reference potential
US20040000428A1 (en) * 2002-06-26 2004-01-01 Mirng-Ji Lii Socketless package to circuit board assemblies and methods of using same
KR100625121B1 (ko) * 2003-07-01 2006-09-19 에스케이 텔레콤주식회사 통신핸드셋 장치에서의 sar 노출 감소 방법 및 장치
US20110255850A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Electronic subassemblies for electronic devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2241888B1 (es) * 1973-04-20 1976-04-23 Mecanique Ind Int
DE3523770A1 (de) * 1985-07-03 1987-01-08 Bosch Gmbh Robert Hochfrequenzdichtes gehaeuse
US4772218A (en) * 1987-06-12 1988-09-20 Don Ross Terminal block
JPS6427298A (en) * 1987-07-23 1989-01-30 Uniden Kk Shielding structure for circuit device on substrate
DE3843412A1 (de) * 1988-04-22 1990-06-28 Bayer Ag Neue polythiophene, verfahren zu ihrer herstellung und ihre verwendung
US4890199A (en) * 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
US5043528A (en) * 1989-03-30 1991-08-27 Richard Mohr Device for providing electrical continuity between electrically conductive surfaces
US5053926A (en) * 1989-11-16 1991-10-01 Voice Data Image Corporation Inc. Electronic equipment cabinet cover panel with integrated connector assembly
US5053924A (en) * 1990-03-30 1991-10-01 Motorola, Inc. Electromagnetic shield for electrical circuit
US5124889A (en) * 1990-04-24 1992-06-23 Motorola, Inc. Electromagnetic shielding apparatus for cellular telephones

Also Published As

Publication number Publication date
WO1992020207A1 (en) 1992-11-12
CA2083278A1 (en) 1992-11-04
KR960015905B1 (ko) 1996-11-23
JPH05508518A (ja) 1993-11-25
GB2261121A (en) 1993-05-05
KR930701908A (ko) 1993-06-12
MX9202049A (es) 1992-11-01
DE4291264T1 (es) 1993-05-13
US5239127A (en) 1993-08-24
GB2261121B (en) 1995-10-18
GB9225966D0 (en) 1993-03-10

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