SE440292B - Flat kapsel for integrerade kretsar - Google Patents

Flat kapsel for integrerade kretsar

Info

Publication number
SE440292B
SE440292B SE7906962A SE7906962A SE440292B SE 440292 B SE440292 B SE 440292B SE 7906962 A SE7906962 A SE 7906962A SE 7906962 A SE7906962 A SE 7906962A SE 440292 B SE440292 B SE 440292B
Authority
SE
Sweden
Prior art keywords
capsule
conductors
circuit arrangement
group
washer
Prior art date
Application number
SE7906962A
Other languages
English (en)
Swedish (sv)
Other versions
SE7906962L (sv
Inventor
Michel Ugon
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of SE7906962L publication Critical patent/SE7906962L/xx
Publication of SE440292B publication Critical patent/SE440292B/sv

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/14Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145Organic substrates, e.g. plastic
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L23/538Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H01L2924/181Encapsulation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Dispersion Chemistry (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Packaging Frangible Articles (AREA)
  • Credit Cards Or The Like (AREA)
SE7906962A 1978-10-19 1979-08-21 Flat kapsel for integrerade kretsar SE440292B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7829844A FR2439478A1 (fr) 1978-10-19 1978-10-19 Boitier plat pour dispositifs a circuits integres

Publications (2)

Publication Number Publication Date
SE7906962L SE7906962L (sv) 1980-04-20
SE440292B true SE440292B (sv) 1985-07-22

Family

ID=9213942

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7906962A SE440292B (sv) 1978-10-19 1979-08-21 Flat kapsel for integrerade kretsar

Country Status (10)

Country Link
US (1) US4264917A (de)
JP (2) JPS5556647A (de)
CA (1) CA1148267A (de)
CH (1) CH632870A5 (de)
DE (1) DE2942422A1 (de)
FR (1) FR2439478A1 (de)
GB (1) GB2035701B (de)
IT (1) IT1123868B (de)
NL (1) NL190090C (de)
SE (1) SE440292B (de)

Families Citing this family (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
FR2490917A1 (fr) * 1980-09-02 1982-03-26 Motorola Semiconducteurs Boitier pour circuit electrique et procede de fabrication
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
FR2498814B1 (fr) * 1981-01-26 1985-12-20 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
FR2512990B1 (fr) * 1981-09-11 1987-06-19 Radiotechnique Compelec Procede pour fabriquer une carte de paiement electronique, et carte realisee selon ce procede
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CA1148267A (fr) 1983-06-14
SE7906962L (sv) 1980-04-20
IT1123868B (it) 1986-04-30
IT7926530A0 (it) 1979-10-16
NL7905082A (nl) 1980-04-22
NL190090B (nl) 1993-05-17
FR2439478A1 (fr) 1980-05-16
GB2035701B (en) 1983-06-29
DE2942422A1 (de) 1980-04-30
JPS5556647A (en) 1980-04-25
FR2439478B1 (de) 1981-04-17
NL190090C (nl) 1993-10-18
CH632870A5 (fr) 1982-10-29
US4264917A (en) 1981-04-28
JPS5936249U (ja) 1984-03-07
GB2035701A (en) 1980-06-18

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