RU94028645A - Металлическая фольга с промотирующим адгезию сбоем - Google Patents

Металлическая фольга с промотирующим адгезию сбоем

Info

Publication number
RU94028645A
RU94028645A RU94028645/02A RU94028645A RU94028645A RU 94028645 A RU94028645 A RU 94028645A RU 94028645/02 A RU94028645/02 A RU 94028645/02A RU 94028645 A RU94028645 A RU 94028645A RU 94028645 A RU94028645 A RU 94028645A
Authority
RU
Russia
Prior art keywords
promoting layer
adhesion
foil
metal foil
adhesion promoting
Prior art date
Application number
RU94028645/02A
Other languages
English (en)
Inventor
А.Путас Чарльз III
Us]
М.Ковакс Андреа
Original Assignee
Гоулд Электроникс Инк. (US)
Гоулд Электроникс Инк.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22293242&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=RU94028645(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Гоулд Электроникс Инк. (US), Гоулд Электроникс Инк. filed Critical Гоулд Электроникс Инк. (US)
Publication of RU94028645A publication Critical patent/RU94028645A/ru

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

Изобретение относится к металлической фольге с промотирующим адгезию слоем, нанесенным по крайней мере на одну сторону указанной фольги, причем указанный промотирующий адгезию слой содержит по крайней мере один силановый сопрягающий агент, а основная поверхность указанной фольги, лежащая под указанным промотирующим адгезию слоем, отличается отсутствием дополнительной шероховатой поверхности. В одном варианте промотирующий адгезию слой отличается отсутствием хрома. В другом варианте основная поверхность, лежащая под промотирующим адгезию слоем, отличается отсутствием слоя цинка или хрома, адгезированного к указанной основной поверхности

Claims (1)

  1. Изобретение относится к металлической фольге с промотирующим адгезию слоем, нанесенным по крайней мере на одну сторону указанной фольги, причем указанный промотирующий адгезию слой содержит по крайней мере один силановый сопрягающий агент, а основная поверхность указанной фольги, лежащая под указанным промотирующим адгезию слоем, отличается отсутствием дополнительной шероховатой поверхности. В одном варианте промотирующий адгезию слой отличается отсутствием хрома. В другом варианте основная поверхность, лежащая под промотирующим адгезию слоем, отличается отсутствием слоя цинка или хрома, адгезированного к указанной основной поверхности.
RU94028645/02A 1993-08-06 1994-08-05 Металлическая фольга с промотирующим адгезию сбоем RU94028645A (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10307593A 1993-08-06 1993-08-06
US103075 1993-08-06

Publications (1)

Publication Number Publication Date
RU94028645A true RU94028645A (ru) 1996-08-27

Family

ID=22293242

Family Applications (1)

Application Number Title Priority Date Filing Date
RU94028645/02A RU94028645A (ru) 1993-08-06 1994-08-05 Металлическая фольга с промотирующим адгезию сбоем

Country Status (8)

Country Link
EP (1) EP0637902B1 (ru)
JP (1) JPH07170064A (ru)
KR (1) KR950007619A (ru)
CN (1) CN1106977A (ru)
AT (1) ATE178451T1 (ru)
DE (1) DE69417489T2 (ru)
RU (1) RU94028645A (ru)
TW (1) TW326423B (ru)

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US6489034B1 (en) 2000-02-08 2002-12-03 Gould Electronics Inc. Method of forming chromium coated copper for printed circuit boards
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US7749611B2 (en) * 2002-12-05 2010-07-06 Gbc Metals, L.L.C. Peel strength enhancement of copper laminates
TWI262041B (en) * 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
JP4913328B2 (ja) * 2004-01-30 2012-04-11 日立化成工業株式会社 接着補助剤付金属箔及びそれを用いたプリント配線板
TW200721932A (en) 2004-01-30 2007-06-01 Hitachi Chemical Co Ltd Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
CN100581808C (zh) * 2005-06-07 2010-01-20 财团法人工业技术研究院 提升耐折性能的铜箔结构及其形成方法
JP2006344553A (ja) * 2005-06-10 2006-12-21 Shin Etsu Chem Co Ltd 燃料電池用電極触媒
TW200704833A (en) * 2005-06-13 2007-02-01 Mitsui Mining & Smelting Co Surface treated copper foil, process for producing surface treated copper foil, and surface treated copper foil with very thin primer resin layer
JP4850508B2 (ja) * 2005-12-22 2012-01-11 富士通株式会社 多層回路基板およびその製造方法
JP4850525B2 (ja) * 2006-01-31 2012-01-11 富士通株式会社 多層回路基板およびその製造方法
JP5024930B2 (ja) 2006-10-31 2012-09-12 三井金属鉱業株式会社 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法
JP2008179127A (ja) * 2007-01-15 2008-08-07 Ls Cable Ltd 銅箔積層構造体及び銅箔の表面処理方法
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JP2008111188A (ja) * 2007-09-25 2008-05-15 Hitachi Chem Co Ltd プリント配線板用の銅箔
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WO2009082005A1 (ja) * 2007-12-26 2009-07-02 Denki Kagaku Kogyo Kabushiki Kaisha 表面反応性支持体、それを用いた配線基板及びそれらの製造方法
JP5663739B2 (ja) * 2008-04-04 2015-02-04 日本ペイント株式会社 銅の表面調整組成物および表面処理方法
JP5255349B2 (ja) 2008-07-11 2013-08-07 三井金属鉱業株式会社 表面処理銅箔
KR101475839B1 (ko) * 2008-07-18 2014-12-23 일진머티리얼즈 주식회사 인쇄회로기판용 동박, 그 제조 방법 및 폴리아믹산전구체와 동박을 사용한 연성동박적층필름
KR20100009262A (ko) * 2008-07-18 2010-01-27 일진소재산업주식회사 실란계 화합물, 그 제조 방법 및 이를 포함하는 동박용표면처리제 조성물
JP5415799B2 (ja) * 2009-03-27 2014-02-12 古河電気工業株式会社 電気電子部品用複合材料、該複合材料を用いた電気電子部品、及び電気電子部品用複合材料の製造方法
KR101298998B1 (ko) * 2009-07-29 2013-08-26 한국화학연구원 표면 처리제 조성물, 이의 제조방법, 인쇄회로기판용 동박 및 연성동박적층필름
JP5506368B2 (ja) * 2009-12-17 2014-05-28 Ｊｘ日鉱日石金属株式会社 環境配慮型プリント配線板用銅箔
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KR101460353B1 (ko) * 2014-03-04 2014-11-10 동우 화인켐 주식회사 점착제 조성물
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TWI597574B (zh) * 2015-08-19 2017-09-01 奇美實業股份有限公司 感光性樹脂組成物及其應用
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CN110820021B (zh) * 2019-11-15 2021-01-05 安徽德科科技有限公司 一种抗剥离电路板用铜箔及其制备方法
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Also Published As

Publication number Publication date
EP0637902A1 (en) 1995-02-08
TW326423B (en) 1998-02-11
DE69417489D1 (de) 1999-05-06
DE69417489T2 (de) 1999-10-07
EP0637902B1 (en) 1999-03-31
KR950007619A (ko) 1995-03-21
ATE178451T1 (de) 1999-04-15
JPH07170064A (ja) 1995-07-04
CN1106977A (zh) 1995-08-16

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