PH12015500529A1 - Carrier-attached copper foil - Google Patents

Carrier-attached copper foil

Info

Publication number
PH12015500529A1
PH12015500529A1 PH12015500529A PH12015500529A PH12015500529A1 PH 12015500529 A1 PH12015500529 A1 PH 12015500529A1 PH 12015500529 A PH12015500529 A PH 12015500529A PH 12015500529 A PH12015500529 A PH 12015500529A PH 12015500529 A1 PH12015500529 A1 PH 12015500529A1
Authority
PH
Philippines
Prior art keywords
carrier
copper foil
attached copper
layer
copper
Prior art date
Application number
PH12015500529A
Other languages
English (en)
Other versions
PH12015500529B1 (en
Inventor
Kohiki Michiya
Nagaura Tomota
Sakaguchi Kazuhiko
Chiba Toru
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50278311&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PH12015500529(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12015500529B1 publication Critical patent/PH12015500529B1/en
Publication of PH12015500529A1 publication Critical patent/PH12015500529A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
PH12015500529A 2012-09-11 2015-03-11 Carrier-attached copper foil PH12015500529A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012200017 2012-09-11
JP2012200973 2012-09-12
JP2012280024 2012-12-21
JP2013012468A JP5481577B1 (ja) 2012-09-11 2013-01-25 キャリア付き銅箔
PCT/JP2013/074585 WO2014042201A1 (ja) 2012-09-11 2013-09-11 キャリア付き銅箔

Publications (2)

Publication Number Publication Date
PH12015500529B1 PH12015500529B1 (en) 2015-04-27
PH12015500529A1 true PH12015500529A1 (en) 2015-04-27

Family

ID=50278311

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015500529A PH12015500529A1 (en) 2012-09-11 2015-03-11 Carrier-attached copper foil

Country Status (7)

Country Link
JP (1) JP5481577B1 (ja)
KR (2) KR102050646B1 (ja)
CN (4) CN108588766B (ja)
MY (2) MY188679A (ja)
PH (1) PH12015500529A1 (ja)
TW (2) TWI504788B (ja)
WO (1) WO2014042201A1 (ja)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
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JP2015078422A (ja) * 2012-11-20 2015-04-23 Jx日鉱日石金属株式会社 キャリア付き銅箔
CN105209252B (zh) * 2013-03-04 2018-01-30 Jx日矿日石金属株式会社 附载体铜箔、使用其的覆铜积层板、印刷配线板、电子机器及印刷配线板的制造方法
TWI613940B (zh) * 2014-03-31 2018-02-01 Jx Nippon Mining & Metals Corp 附載體之銅箔、印刷配線板、積層體、電子機器及印刷配線板之製造方法
JP2015205481A (ja) * 2014-04-22 2015-11-19 Jx日鉱日石金属株式会社 キャリア付銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
JP6591766B2 (ja) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、積層体、電子機器及びプリント配線板の製造方法
JP6297011B2 (ja) * 2014-08-28 2018-03-20 株式会社有沢製作所 ３層フレキシブル金属張積層板及び両面３層フレキシブル金属張積層板
CN105050331B (zh) * 2015-07-07 2016-09-07 安徽铜冠铜箔有限公司 一种用于陶瓷基高频覆铜板的高粗糙度电子铜箔的制造方法
JP6782561B2 (ja) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
JP6945523B2 (ja) * 2016-04-14 2021-10-06 三井金属鉱業株式会社 表面処理銅箔、キャリア付銅箔、並びにそれらを用いた銅張積層板及びプリント配線板の製造方法
US10950768B2 (en) 2017-04-27 2021-03-16 Kyocera Corporation Circuit board and light-emitting device provided with same
WO2019003775A1 (ja) 2017-06-29 2019-01-03 京セラ株式会社 回路基板およびこれを備える発光装置
US10711360B2 (en) * 2017-07-14 2020-07-14 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
US11950376B2 (en) 2018-03-30 2024-04-02 Mitsui Mining & Smelting Co., Ltd. Copper-clad laminate
KR102098475B1 (ko) 2018-07-06 2020-04-07 주식회사 포스코 내식성, 도장성이 우수한 표면처리된 Zn-Ni 합금 전기도금강판의 제조방법
JP6895936B2 (ja) * 2018-09-28 2021-06-30 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板及び回路基板
US10581081B1 (en) 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI697549B (zh) * 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
TWI740515B (zh) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 液晶高分子膜及包含其之積層板
EP4132235A4 (en) * 2020-03-30 2024-04-10 Mitsubishi Materials Corp BONDED BODY AND INSULATION CIRCUIT BOARD
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
WO2022153580A1 (ja) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
CN117321253A (zh) * 2021-05-20 2023-12-29 三井金属矿业株式会社 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
WO2022255421A1 (ja) * 2021-06-03 2022-12-08 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
EP4362611A1 (en) * 2021-06-24 2024-05-01 Kyocera Corporation Wiring board
WO2023281759A1 (ja) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板
TWI781818B (zh) * 2021-11-05 2022-10-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2536095B2 (ja) * 1988-10-20 1996-09-18 日立化成工業株式会社 配線板の製造法
TW595280B (en) * 2000-04-25 2004-06-21 Nippon Denkai Kk Copper foil for TAB tape carrier, TAB tape carrier using the copper foil and TAB carrier tape
US7026059B2 (en) 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP2002134858A (ja) * 2000-10-25 2002-05-10 Hitachi Cable Ltd プリント基板用銅箔
JP4178415B2 (ja) 2002-07-04 2008-11-12 三井金属鉱業株式会社 キャリア箔付電解銅箔
JP2005008955A (ja) * 2003-06-19 2005-01-13 Hitachi Cable Ltd 銅箔の表面処理方法
JP4087369B2 (ja) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 キャリア付き極薄銅箔、およびプリント配線板
KR100852863B1 (ko) * 2004-02-17 2008-08-18 닛코킨조쿠 가부시키가이샤 흑화 처리 면 또는 층을 가지는 동박
JP4567360B2 (ja) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 銅箔の製造方法及びその製造方法で得られる銅箔
JP4429979B2 (ja) 2005-06-29 2010-03-10 古河電気工業株式会社 キャリア付き極薄銅箔及びキャリア付き極薄銅箔の製造方法
JP2007314855A (ja) * 2006-05-29 2007-12-06 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、銅張積層板及びプリント配線基板
JP4157898B2 (ja) * 2006-10-02 2008-10-01 株式会社神戸製鋼所 プレス打ち抜き性に優れた電気電子部品用銅合金板
WO2008126522A1 (ja) * 2007-03-15 2008-10-23 Nippon Mining & Metals Co., Ltd. 銅電解液及びそれを用いて得られた２層フレキシブル基板
JP5129642B2 (ja) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 表面処理銅箔及びその表面処理銅箔を用いて得られる銅張積層板並びにその銅張積層板を用いて得られるプリント配線板
WO2009057823A1 (ja) * 2007-10-31 2009-05-07 Jfe Steel Corporation 表面処理鋼板及びその製造方法、並びに樹脂被覆鋼板
KR101351928B1 (ko) * 2007-12-28 2014-01-21 일진머티리얼즈 주식회사 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한프린트 배선 기판
TWI499690B (zh) * 2009-03-13 2015-09-11 Ajinomoto Kk Paste metal laminates
JP2010236072A (ja) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd 積層銅箔及びその製造方法
JP5282675B2 (ja) * 2009-06-23 2013-09-04 日立電線株式会社 プリント配線板用銅箔およびその製造方法
JP2010006071A (ja) 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板
JP5356968B2 (ja) * 2009-09-30 2013-12-04 Ｊｘ日鉱日石金属株式会社 Ｓｎめっき被膜、及びそれを有する複合材料
JP2011116074A (ja) * 2009-12-07 2011-06-16 Jx Nippon Mining & Metals Corp 電気抵抗膜を備えた金属箔及び同金属箔を用いたプリント回路用基板
TWI525221B (zh) * 2010-10-06 2016-03-11 Furukawa Electric Co Ltd Copper foil and its manufacturing method, carrier copper foil and its manufacturing method, printed circuit board and multilayer printed circuit board
CN102452197B (zh) * 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
KR20140009323A (ko) * 2011-01-26 2014-01-22 스미토모 베이클리트 컴퍼니 리미티드 프린트 배선판 및 프린트 배선판의 제조 방법
JP2012167297A (ja) * 2011-02-09 2012-09-06 Jfe Steel Corp 電気亜鉛めっき鋼板

Also Published As

Publication number Publication date
TW201533280A (zh) 2015-09-01
CN104619889A (zh) 2015-05-13
TWI504788B (zh) 2015-10-21
CN107641820A (zh) 2018-01-30
JP5481577B1 (ja) 2014-04-23
KR101766554B1 (ko) 2017-08-08
MY188679A (en) 2021-12-22
KR20170046822A (ko) 2017-05-02
CN104619889B (zh) 2018-10-09
KR20150052315A (ko) 2015-05-13
WO2014042201A1 (ja) 2014-03-20
PH12015500529B1 (en) 2015-04-27
CN108588766B (zh) 2020-02-18
CN109379858A (zh) 2019-02-22
JP2014139336A (ja) 2014-07-31
CN108588766A (zh) 2018-09-28
TW201428144A (zh) 2014-07-16
TWI575120B (zh) 2017-03-21
KR102050646B1 (ko) 2019-11-29
MY167704A (en) 2018-09-21

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