NL7905518A - Werkwijze voor het monteren van elektronische delen. - Google Patents
Werkwijze voor het monteren van elektronische delen. Download PDFInfo
- Publication number
- NL7905518A NL7905518A NL7905518A NL7905518A NL7905518A NL 7905518 A NL7905518 A NL 7905518A NL 7905518 A NL7905518 A NL 7905518A NL 7905518 A NL7905518 A NL 7905518A NL 7905518 A NL7905518 A NL 7905518A
- Authority
- NL
- Netherlands
- Prior art keywords
- mounting
- substrate
- substrates
- electronic parts
- administering
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 41
- 239000000758 substrate Substances 0.000 claims description 187
- 239000000853 adhesive Substances 0.000 claims description 75
- 230000001070 adhesive effect Effects 0.000 claims description 75
- 239000000463 material Substances 0.000 claims description 38
- 238000012545 processing Methods 0.000 claims description 22
- 238000003754 machining Methods 0.000 claims description 3
- 239000003356 suture material Substances 0.000 claims 7
- 210000000056 organ Anatomy 0.000 claims 2
- 239000004848 polyfunctional curative Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 23
- 238000012546 transfer Methods 0.000 description 19
- 239000011230 binding agent Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010409 ironing Methods 0.000 description 1
- 235000019645 odor Nutrition 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1093—All laminae planar and face to face with covering of discrete laminae with additional lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1097—Lamina is running length web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
- Y10T156/1097—Lamina is running length web
- Y10T156/1098—Feeding of discrete laminae from separate sources
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8883378A JPS5515270A (en) | 1978-07-19 | 1978-07-19 | Method of attaching electronic part |
JP8883378 | 1978-07-19 | ||
JP453079 | 1979-01-18 | ||
JP54004530A JPS588156B2 (ja) | 1979-01-18 | 1979-01-18 | 電子部品の装着方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7905518A true NL7905518A (nl) | 1980-01-22 |
Family
ID=26338330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7905518A NL7905518A (nl) | 1978-07-19 | 1979-07-16 | Werkwijze voor het monteren van elektronische delen. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4239576A (fr) |
CA (1) | CA1111628A (fr) |
DE (1) | DE2929314C2 (fr) |
FR (1) | FR2431812A1 (fr) |
GB (1) | GB2025804B (fr) |
NL (1) | NL7905518A (fr) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55118698A (en) * | 1979-03-05 | 1980-09-11 | Matsushita Electric Ind Co Ltd | Device for mounting electronic part |
IT1193984B (it) * | 1980-10-03 | 1988-08-31 | Ferco Spa | Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati |
US4396140A (en) * | 1981-01-27 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Method of bonding electronic components |
JPS5851530A (ja) * | 1981-09-22 | 1983-03-26 | Toshiba Corp | 半導体ペレツト配列装置および方法 |
US4569305A (en) * | 1981-10-09 | 1986-02-11 | Ferco S.R.L. | Apparatus to provide the application of glue on preselected zones of printed circuit boards |
DE3390320T1 (de) * | 1982-11-11 | 1985-02-21 | Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka | Vorrichtung zur Montage von elektronischen Teilen |
CA1219843A (fr) * | 1982-11-15 | 1987-03-31 | Robert A. Kidder | Debiteur de colle |
JPS59161040A (ja) * | 1983-03-03 | 1984-09-11 | Shinkawa Ltd | インナ−リ−ドボンダ− |
JPS6012799A (ja) * | 1983-07-01 | 1985-01-23 | 三洋電機株式会社 | チップ状電子部品の自動装着装置 |
NL8304185A (nl) * | 1983-12-06 | 1985-07-01 | Philips Nv | Stempel en inrichting voor het aanbrengen van druppels van een viskeuze vloeistof op een substraat. |
EP0171466A1 (fr) * | 1984-07-24 | 1986-02-19 | Siemens Aktiengesellschaft | Méthode pour appliquer du gluten sur un support de puces et dispositif pour la mise en application de la méthode |
DE3532500C2 (de) * | 1984-09-17 | 1996-03-14 | Tdk Corp | Pneumatisch betätigter Bestückungskopf mit Saugkammer für eine Saugpipette |
US4978414A (en) * | 1985-01-18 | 1990-12-18 | Nippon Cmk Corp. | Apparatus for stretching silk including means to move cramp members independently of each other |
DE3675734D1 (de) * | 1985-09-30 | 1991-01-03 | Siemens Ag | Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage. |
US4803124A (en) * | 1987-01-12 | 1989-02-07 | Alphasem Corporation | Bonding semiconductor chips to a mounting surface utilizing adhesive applied in starfish patterns |
US5187123A (en) * | 1988-04-30 | 1993-02-16 | Matsushita Electric Industrial Co., Ltd. | Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots |
KR900015590A (ko) * | 1989-03-23 | 1990-10-27 | 프레데릭 얀 스미트 | 캐리어상에 부품을 배치하는 방법 및 그 방법을 수행하기 위한 장치 |
GB2236217A (en) * | 1989-08-23 | 1991-03-27 | Itt Ind Ltd | Improvement relating to electrical connectors |
JP2547895B2 (ja) * | 1990-03-20 | 1996-10-23 | シャープ株式会社 | 半導体装置の実装方法 |
DE59202991D1 (de) * | 1991-01-28 | 1995-08-31 | Siemens Ag | Vorrichtung zum Bestücken von Leiterplatten. |
US5336357A (en) * | 1993-03-12 | 1994-08-09 | Quantum Materials, Inc. | Manually operable die attach apparatus |
US5435481A (en) * | 1994-01-18 | 1995-07-25 | Motorola, Inc. | Soldering process |
US5686226A (en) * | 1995-08-03 | 1997-11-11 | Motorola, Inc. | Method of forming an applicator for applying tacking media to a circuit substrate |
KR100431031B1 (ko) * | 1996-10-10 | 2004-07-27 | 삼성전자주식회사 | 반도체칩의장착방법 |
DE19808171A1 (de) * | 1998-02-26 | 1999-09-02 | Resma Gmbh | Anordnung zur Bestückung von Leiterplatten mit integrierten Schaltungen |
US8225739B2 (en) * | 2009-07-25 | 2012-07-24 | Cheng Uei Precision Industry Co., Ltd. | Automatic dispensing machine |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3552177A (en) * | 1968-02-19 | 1971-01-05 | Ibm | Strap former and placement apparatus |
US3600246A (en) * | 1968-05-17 | 1971-08-17 | Rca Corp | Method of making laminated semiconductor devices |
US3611561A (en) * | 1969-04-21 | 1971-10-12 | Paul A Dosier | Transfer mechanism with loading nest |
US3666588A (en) * | 1970-01-26 | 1972-05-30 | Western Electric Co | Method of retaining and bonding articles |
US3965277A (en) * | 1972-05-09 | 1976-06-22 | Massachusetts Institute Of Technology | Photoformed plated interconnection of embedded integrated circuit chips |
-
1979
- 1979-07-16 NL NL7905518A patent/NL7905518A/nl not_active IP Right Cessation
- 1979-07-17 US US06/058,319 patent/US4239576A/en not_active Expired - Lifetime
- 1979-07-18 GB GB7924966A patent/GB2025804B/en not_active Expired
- 1979-07-18 CA CA332,023A patent/CA1111628A/fr not_active Expired
- 1979-07-18 FR FR7918655A patent/FR2431812A1/fr active Granted
- 1979-07-19 DE DE2929314A patent/DE2929314C2/de not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2431812A1 (fr) | 1980-02-15 |
US4239576A (en) | 1980-12-16 |
FR2431812B1 (fr) | 1984-03-30 |
DE2929314C2 (de) | 1984-04-19 |
DE2929314A1 (de) | 1980-02-14 |
GB2025804A (en) | 1980-01-30 |
GB2025804B (en) | 1982-06-09 |
CA1111628A (fr) | 1981-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A1A | A request for search or an international-type search has been filed | ||
BB | A search report has been drawn up | ||
BC | A request for examination has been filed | ||
V4 | Discontinued because of reaching the maximum lifetime of a patent |
Free format text: 19990716 |