IT1193984B - Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati - Google Patents

Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati

Info

Publication number
IT1193984B
IT1193984B IT25123/80A IT2512380A IT1193984B IT 1193984 B IT1193984 B IT 1193984B IT 25123/80 A IT25123/80 A IT 25123/80A IT 2512380 A IT2512380 A IT 2512380A IT 1193984 B IT1193984 B IT 1193984B
Authority
IT
Italy
Prior art keywords
glue
procedure
carrying
application
plate
Prior art date
Application number
IT25123/80A
Other languages
English (en)
Other versions
IT8025123A0 (it
Inventor
Beniamino Ferri
Giovanni Caimi
Original Assignee
Ferco Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferco Spa filed Critical Ferco Spa
Priority to IT25123/80A priority Critical patent/IT1193984B/it
Publication of IT8025123A0 publication Critical patent/IT8025123A0/it
Priority to EP81107690A priority patent/EP0049451A1/en
Priority to CA000387181A priority patent/CA1175157A/en
Priority to JP56156356A priority patent/JPS5791766A/ja
Application granted granted Critical
Publication of IT1193984B publication Critical patent/IT1193984B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
IT25123/80A 1980-10-03 1980-10-03 Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati IT1193984B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT25123/80A IT1193984B (it) 1980-10-03 1980-10-03 Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati
EP81107690A EP0049451A1 (en) 1980-10-03 1981-09-28 A process and apparatus to provide the application of glue on preselected zones of printed circuit boards
CA000387181A CA1175157A (en) 1980-10-03 1981-10-02 Process and apparatus to provide the application of glue on preselected zones of printed circuit boards
JP56156356A JPS5791766A (en) 1980-10-03 1981-10-02 Method and apparatus for coating printed circuit board with adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT25123/80A IT1193984B (it) 1980-10-03 1980-10-03 Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati

Publications (2)

Publication Number Publication Date
IT8025123A0 IT8025123A0 (it) 1980-10-03
IT1193984B true IT1193984B (it) 1988-08-31

Family

ID=11215764

Family Applications (1)

Application Number Title Priority Date Filing Date
IT25123/80A IT1193984B (it) 1980-10-03 1980-10-03 Procedimento e apparecchiatura atta a realizzare l'applicazione di colla su zone prescelte di una piastra per circuiti stampati

Country Status (4)

Country Link
EP (1) EP0049451A1 (it)
JP (1) JPS5791766A (it)
CA (1) CA1175157A (it)
IT (1) IT1193984B (it)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1219843A (en) * 1982-11-15 1987-03-31 Robert A. Kidder Adhesive dispenser
US4946708A (en) * 1988-11-18 1990-08-07 International Business Machines Corporation Pin transfer adhesive application for surface mount component processes
CH705930B1 (de) * 2011-12-22 2015-08-28 Esec Ag Verfahren zum Auftragen von Klebstoff auf ein Substrat.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4292116A (en) * 1978-04-18 1981-09-29 Tokyo Denki Kagaku Kogyo Kabushiki Kaisha Apparatus for mounting chip type circuit elements on a printed circuit board
NL7905518A (nl) * 1978-07-19 1980-01-22 Matsushita Electric Ind Co Ltd Werkwijze voor het monteren van elektronische delen.

Also Published As

Publication number Publication date
CA1175157A (en) 1984-09-25
EP0049451A1 (en) 1982-04-14
IT8025123A0 (it) 1980-10-03
JPS5791766A (en) 1982-06-08

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