IT1184616B - Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati - Google Patents

Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati

Info

Publication number
IT1184616B
IT1184616B IT21248/85A IT2124885A IT1184616B IT 1184616 B IT1184616 B IT 1184616B IT 21248/85 A IT21248/85 A IT 21248/85A IT 2124885 A IT2124885 A IT 2124885A IT 1184616 B IT1184616 B IT 1184616B
Authority
IT
Italy
Prior art keywords
welding
procedure
carrying
equipment
printed circuits
Prior art date
Application number
IT21248/85A
Other languages
English (en)
Other versions
IT8521248A0 (it
Inventor
Federico Vassallo
Original Assignee
Iemme Italia Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iemme Italia Spa filed Critical Iemme Italia Spa
Priority to IT21248/85A priority Critical patent/IT1184616B/it
Publication of IT8521248A0 publication Critical patent/IT8521248A0/it
Priority to EP86108269A priority patent/EP0206231A3/en
Application granted granted Critical
Publication of IT1184616B publication Critical patent/IT1184616B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
IT21248/85A 1985-06-21 1985-06-21 Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati IT1184616B (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IT21248/85A IT1184616B (it) 1985-06-21 1985-06-21 Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati
EP86108269A EP0206231A3 (en) 1985-06-21 1986-06-18 A method and device for soldering electronic components on printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT21248/85A IT1184616B (it) 1985-06-21 1985-06-21 Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati

Publications (2)

Publication Number Publication Date
IT8521248A0 IT8521248A0 (it) 1985-06-21
IT1184616B true IT1184616B (it) 1987-10-28

Family

ID=11179001

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21248/85A IT1184616B (it) 1985-06-21 1985-06-21 Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati

Country Status (2)

Country Link
EP (1) EP0206231A3 (it)
IT (1) IT1184616B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9204205U1 (it) * 1992-03-25 1992-06-04 Detewe-Deutsche Telephonwerke Ag & Co, 1000 Berlin, De
DE4329000C2 (de) * 1993-08-28 1996-12-05 Woerthmann Rainer Dipl Ing Fh Lötdüse für eine Lötwelle zum Löten von Werkstücken
DE19512902A1 (de) * 1995-04-06 1996-10-10 Philips Patentverwaltung Verfahren zum Wellenlöten von Baugruppen
US6513702B2 (en) * 2000-10-23 2003-02-04 Senju Metal Industry Co., Ltd. Automatic wave soldering apparatus and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB895737A (en) * 1958-02-10 1962-05-09 Radio And Allied Iindustries L Improvements in and relating to the manufacture of electronic and like apparatus
DE3176527D1 (en) * 1980-12-26 1987-12-17 Matsushita Electric Ind Co Ltd Apparatus for soldering chip type components
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
JPS6051940B2 (ja) * 1981-06-16 1985-11-16 松下電器産業株式会社 プリント基板半田付装置

Also Published As

Publication number Publication date
EP0206231A2 (en) 1986-12-30
EP0206231A3 (en) 1987-05-20
IT8521248A0 (it) 1985-06-21

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