IT8521248A0 - Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati. - Google Patents
Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati.Info
- Publication number
- IT8521248A0 IT8521248A0 IT8521248A IT2124885A IT8521248A0 IT 8521248 A0 IT8521248 A0 IT 8521248A0 IT 8521248 A IT8521248 A IT 8521248A IT 2124885 A IT2124885 A IT 2124885A IT 8521248 A0 IT8521248 A0 IT 8521248A0
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- equipment
- electronic components
- printed circuits
- soldering electronic
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000005476 soldering Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT21248/85A IT1184616B (it) | 1985-06-21 | 1985-06-21 | Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati |
EP86108269A EP0206231A3 (en) | 1985-06-21 | 1986-06-18 | A method and device for soldering electronic components on printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT21248/85A IT1184616B (it) | 1985-06-21 | 1985-06-21 | Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8521248A0 true IT8521248A0 (it) | 1985-06-21 |
IT1184616B IT1184616B (it) | 1987-10-28 |
Family
ID=11179001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT21248/85A IT1184616B (it) | 1985-06-21 | 1985-06-21 | Procedimento ed apparecchiatura per effettuare la saldatura di componenti elettronici a piastre di circuiti stampati |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0206231A3 (it) |
IT (1) | IT1184616B (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9204205U1 (de) * | 1992-03-25 | 1992-06-04 | Detewe-Deutsche Telephonwerke Ag & Co, 1000 Berlin | Schwallschutzschienen für Leiterplatten |
DE4329000C2 (de) * | 1993-08-28 | 1996-12-05 | Woerthmann Rainer Dipl Ing Fh | Lötdüse für eine Lötwelle zum Löten von Werkstücken |
DE19512902A1 (de) * | 1995-04-06 | 1996-10-10 | Philips Patentverwaltung | Verfahren zum Wellenlöten von Baugruppen |
MY124946A (en) * | 2000-10-23 | 2006-07-31 | Senju Metal Industry Co | Automatic wave soldering apparatus and method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB895737A (en) * | 1958-02-10 | 1962-05-09 | Radio And Allied Iindustries L | Improvements in and relating to the manufacture of electronic and like apparatus |
DE3176527D1 (en) * | 1980-12-26 | 1987-12-17 | Matsushita Electric Ind Co Ltd | Apparatus for soldering chip type components |
JPS6051939B2 (ja) * | 1981-06-02 | 1985-11-16 | 権士 近藤 | 噴流式はんだ槽 |
JPS6051940B2 (ja) * | 1981-06-16 | 1985-11-16 | 松下電器産業株式会社 | プリント基板半田付装置 |
-
1985
- 1985-06-21 IT IT21248/85A patent/IT1184616B/it active
-
1986
- 1986-06-18 EP EP86108269A patent/EP0206231A3/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP0206231A2 (en) | 1986-12-30 |
IT1184616B (it) | 1987-10-28 |
EP0206231A3 (en) | 1987-05-20 |
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