IT8519785A0 - Apparecchiatura di saldatura ad onda, in particolare per la saldatura su circuiti stampati. - Google Patents
Apparecchiatura di saldatura ad onda, in particolare per la saldatura su circuiti stampati.Info
- Publication number
- IT8519785A0 IT8519785A0 IT8519785A IT1978585A IT8519785A0 IT 8519785 A0 IT8519785 A0 IT 8519785A0 IT 8519785 A IT8519785 A IT 8519785A IT 1978585 A IT1978585 A IT 1978585A IT 8519785 A0 IT8519785 A0 IT 8519785A0
- Authority
- IT
- Italy
- Prior art keywords
- soldering
- printed circuits
- equipment
- wave
- wave soldering
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8519785A IT1200402B (it) | 1985-03-06 | 1985-03-06 | Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati |
EP86200329A EP0203623B1 (en) | 1985-03-06 | 1986-03-03 | Wavesoldering device, particularly for printed circuits |
DE8686200329T DE3685688T2 (de) | 1985-03-06 | 1986-03-03 | Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten. |
DE198686200329T DE203623T1 (de) | 1985-03-06 | 1986-03-03 | Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8519785A IT1200402B (it) | 1985-03-06 | 1985-03-06 | Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8519785A0 true IT8519785A0 (it) | 1985-03-06 |
IT1200402B IT1200402B (it) | 1989-01-18 |
Family
ID=11161193
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8519785A IT1200402B (it) | 1985-03-06 | 1985-03-06 | Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0203623B1 (it) |
DE (2) | DE3685688T2 (it) |
IT (1) | IT1200402B (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0280022A1 (de) * | 1987-01-28 | 1988-08-31 | Epm Ag | Verfahren und Anlage zum Löten von bestückten Leiterplatten |
GB8705931D0 (en) * | 1987-03-12 | 1987-04-15 | British Aerospace | Solder coating processes |
IT1216594B (it) * | 1988-04-19 | 1990-03-08 | Italtel Spa | Metodo e dispositivo per la saldatura ad onda. |
MY104879A (en) * | 1988-12-31 | 1994-06-30 | Yokota Kikai Kk | An automatic soldering method and the apparatus thereof |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2487857A1 (fr) * | 1980-07-29 | 1982-02-05 | Silicium Semiconducteur Ssc | Procede et dispositif d'etamage des fils de connexion d'un composant electrique |
DE3205276C2 (de) * | 1981-03-25 | 1984-03-08 | Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen | Vorrichtung zum maschinellen Löten von Werkstücken |
EP0159425B1 (en) * | 1984-04-17 | 1988-06-15 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
-
1985
- 1985-03-06 IT IT8519785A patent/IT1200402B/it active
-
1986
- 1986-03-03 DE DE8686200329T patent/DE3685688T2/de not_active Expired - Lifetime
- 1986-03-03 DE DE198686200329T patent/DE203623T1/de active Pending
- 1986-03-03 EP EP86200329A patent/EP0203623B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE203623T1 (de) | 1987-02-26 |
EP0203623B1 (en) | 1992-06-17 |
EP0203623A2 (en) | 1986-12-03 |
IT1200402B (it) | 1989-01-18 |
DE3685688D1 (de) | 1992-07-23 |
EP0203623A3 (en) | 1987-12-23 |
DE3685688T2 (de) | 1993-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970313 |