IT8519785A0 - Apparecchiatura di saldatura ad onda, in particolare per la saldatura su circuiti stampati. - Google Patents

Apparecchiatura di saldatura ad onda, in particolare per la saldatura su circuiti stampati.

Info

Publication number
IT8519785A0
IT8519785A0 IT8519785A IT1978585A IT8519785A0 IT 8519785 A0 IT8519785 A0 IT 8519785A0 IT 8519785 A IT8519785 A IT 8519785A IT 1978585 A IT1978585 A IT 1978585A IT 8519785 A0 IT8519785 A0 IT 8519785A0
Authority
IT
Italy
Prior art keywords
soldering
printed circuits
equipment
wave
wave soldering
Prior art date
Application number
IT8519785A
Other languages
English (en)
Other versions
IT1200402B (it
Inventor
Roberto Scorta
Original Assignee
Roberto Scorta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Roberto Scorta filed Critical Roberto Scorta
Priority to IT8519785A priority Critical patent/IT1200402B/it
Publication of IT8519785A0 publication Critical patent/IT8519785A0/it
Priority to EP86200329A priority patent/EP0203623B1/en
Priority to DE8686200329T priority patent/DE3685688T2/de
Priority to DE198686200329T priority patent/DE203623T1/de
Application granted granted Critical
Publication of IT1200402B publication Critical patent/IT1200402B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09418Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1581Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
IT8519785A 1985-03-06 1985-03-06 Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati IT1200402B (it)

Priority Applications (4)

Application Number Priority Date Filing Date Title
IT8519785A IT1200402B (it) 1985-03-06 1985-03-06 Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati
EP86200329A EP0203623B1 (en) 1985-03-06 1986-03-03 Wavesoldering device, particularly for printed circuits
DE8686200329T DE3685688T2 (de) 1985-03-06 1986-03-03 Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.
DE198686200329T DE203623T1 (de) 1985-03-06 1986-03-03 Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8519785A IT1200402B (it) 1985-03-06 1985-03-06 Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati

Publications (2)

Publication Number Publication Date
IT8519785A0 true IT8519785A0 (it) 1985-03-06
IT1200402B IT1200402B (it) 1989-01-18

Family

ID=11161193

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8519785A IT1200402B (it) 1985-03-06 1985-03-06 Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati

Country Status (3)

Country Link
EP (1) EP0203623B1 (it)
DE (2) DE3685688T2 (it)
IT (1) IT1200402B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0280022A1 (de) * 1987-01-28 1988-08-31 Epm Ag Verfahren und Anlage zum Löten von bestückten Leiterplatten
GB8705931D0 (en) * 1987-03-12 1987-04-15 British Aerospace Solder coating processes
IT1216594B (it) * 1988-04-19 1990-03-08 Italtel Spa Metodo e dispositivo per la saldatura ad onda.
MY104879A (en) * 1988-12-31 1994-06-30 Yokota Kikai Kk An automatic soldering method and the apparatus thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2487857A1 (fr) * 1980-07-29 1982-02-05 Silicium Semiconducteur Ssc Procede et dispositif d'etamage des fils de connexion d'un composant electrique
DE3205276C2 (de) * 1981-03-25 1984-03-08 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen Vorrichtung zum maschinellen Löten von Werkstücken
EP0159425B1 (en) * 1984-04-17 1988-06-15 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus

Also Published As

Publication number Publication date
DE203623T1 (de) 1987-02-26
EP0203623B1 (en) 1992-06-17
EP0203623A2 (en) 1986-12-03
IT1200402B (it) 1989-01-18
DE3685688D1 (de) 1992-07-23
EP0203623A3 (en) 1987-12-23
DE3685688T2 (de) 1993-01-14

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970313