DE3685688D1 - Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten. - Google Patents

Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.

Info

Publication number
DE3685688D1
DE3685688D1 DE8686200329T DE3685688T DE3685688D1 DE 3685688 D1 DE3685688 D1 DE 3685688D1 DE 8686200329 T DE8686200329 T DE 8686200329T DE 3685688 T DE3685688 T DE 3685688T DE 3685688 D1 DE3685688 D1 DE 3685688D1
Authority
DE
Germany
Prior art keywords
soldering
printed circuits
printed
circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686200329T
Other languages
English (en)
Other versions
DE3685688T2 (de
Inventor
Roberto Scorta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Italtel SpA
Original Assignee
Italtel SpA
Italtel Societa Italiana Telecomunicazioni SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Italtel SpA, Italtel Societa Italiana Telecomunicazioni SpA filed Critical Italtel SpA
Publication of DE3685688D1 publication Critical patent/DE3685688D1/de
Application granted granted Critical
Publication of DE3685688T2 publication Critical patent/DE3685688T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
DE8686200329T 1985-03-06 1986-03-03 Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten. Expired - Lifetime DE3685688T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8519785A IT1200402B (it) 1985-03-06 1985-03-06 Apparecchiatura di saldatura ad onda,in particolare per la saldatura su circuiti stampati

Publications (2)

Publication Number Publication Date
DE3685688D1 true DE3685688D1 (de) 1992-07-23
DE3685688T2 DE3685688T2 (de) 1993-01-14

Family

ID=11161193

Family Applications (2)

Application Number Title Priority Date Filing Date
DE8686200329T Expired - Lifetime DE3685688T2 (de) 1985-03-06 1986-03-03 Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.
DE198686200329T Pending DE203623T1 (de) 1985-03-06 1986-03-03 Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE198686200329T Pending DE203623T1 (de) 1985-03-06 1986-03-03 Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.

Country Status (3)

Country Link
EP (1) EP0203623B1 (de)
DE (2) DE3685688T2 (de)
IT (1) IT1200402B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0280022A1 (de) * 1987-01-28 1988-08-31 Epm Ag Verfahren und Anlage zum Löten von bestückten Leiterplatten
GB8705931D0 (en) * 1987-03-12 1987-04-15 British Aerospace Solder coating processes
IT1216594B (it) * 1988-04-19 1990-03-08 Italtel Spa Metodo e dispositivo per la saldatura ad onda.
MY104879A (en) * 1988-12-31 1994-06-30 Yokota Kikai Kk An automatic soldering method and the apparatus thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2487857A1 (fr) * 1980-07-29 1982-02-05 Silicium Semiconducteur Ssc Procede et dispositif d'etamage des fils de connexion d'un composant electrique
DE3205276C2 (de) * 1981-03-25 1984-03-08 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen Vorrichtung zum maschinellen Löten von Werkstücken
JPS5994570A (ja) * 1982-11-22 1984-05-31 Misuzu Seiki:Kk 噴流半田付け装置
EP0159425B1 (de) * 1984-04-17 1988-06-15 Nihon Den-Netsu Keiki Co., Ltd. Lötvorrichtung

Also Published As

Publication number Publication date
EP0203623B1 (de) 1992-06-17
IT8519785A0 (it) 1985-03-06
IT1200402B (it) 1989-01-18
DE3685688T2 (de) 1993-01-14
DE203623T1 (de) 1987-02-26
EP0203623A3 (en) 1987-12-23
EP0203623A2 (de) 1986-12-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition