IT8619667A0 - Complessi di circuiti elettronici. - Google Patents

Complessi di circuiti elettronici.

Info

Publication number
IT8619667A0
IT8619667A0 IT8619667A IT1966786A IT8619667A0 IT 8619667 A0 IT8619667 A0 IT 8619667A0 IT 8619667 A IT8619667 A IT 8619667A IT 1966786 A IT1966786 A IT 1966786A IT 8619667 A0 IT8619667 A0 IT 8619667A0
Authority
IT
Italy
Prior art keywords
complexes
electronic circuits
circuits
electronic
circuits complexes
Prior art date
Application number
IT8619667A
Other languages
English (en)
Other versions
IT1188581B (it
IT8619667A1 (it
Inventor
Conrad Raymond Crewe Maloney
Edward Stuart Eccles
Original Assignee
Smith Ind Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smith Ind Plc filed Critical Smith Ind Plc
Publication of IT8619667A0 publication Critical patent/IT8619667A0/it
Publication of IT8619667A1 publication Critical patent/IT8619667A1/it
Application granted granted Critical
Publication of IT1188581B publication Critical patent/IT1188581B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382—Adaptable interconnections, e.g. for engineering changes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Burglar Alarm Systems (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
IT19667/86A 1985-03-15 1986-03-07 Complessi di circuiti elettronici IT1188581B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB858506714A GB8506714D0 (en) 1985-03-15 1985-03-15 Electronic circuit assemblies

Publications (3)

Publication Number Publication Date
IT8619667A0 true IT8619667A0 (it) 1986-03-07
IT8619667A1 IT8619667A1 (it) 1987-09-07
IT1188581B IT1188581B (it) 1988-01-20

Family

ID=10576034

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19667/86A IT1188581B (it) 1985-03-15 1986-03-07 Complessi di circuiti elettronici

Country Status (5)

Country Link
JP (1) JPS61214549A (it)
DE (1) DE3607093A1 (it)
FR (1) FR2579022A1 (it)
GB (2) GB8506714D0 (it)
IT (1) IT1188581B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021869A (en) * 1988-12-27 1991-06-04 Hewlett-Packard Company Monolithic semiconductor chip interconnection technique and arrangement
JPH05335529A (ja) * 1992-05-28 1993-12-17 Fujitsu Ltd 半導体装置およびその製造方法
DE4225138A1 (de) * 1992-07-30 1994-02-03 Daimler Benz Ag Multichipmodul und Verfahren zu dessen Herstellung
DE59510807D1 (de) * 1994-07-05 2003-11-20 Infineon Technologies Ag Verfahren zur herstellung einer dreidimensionalen schaltungsanordnung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1112992A (en) * 1964-08-18 1968-05-08 Texas Instruments Inc Three-dimensional integrated circuits and methods of making same
US3879839A (en) * 1973-06-04 1975-04-29 Ibm Method of manufacturing multi-function LSI wafers
FR2471048A1 (fr) * 1979-12-07 1981-06-12 Silicium Semiconducteur Ssc Structure et procede de montage d'un composant semi-conducteur principal et d'un circuit auxiliaire
GB2117564B (en) * 1982-03-26 1985-11-06 Int Computers Ltd Mounting one integrated circuit upon another

Also Published As

Publication number Publication date
DE3607093A1 (de) 1986-09-18
JPS61214549A (ja) 1986-09-24
IT1188581B (it) 1988-01-20
GB8605664D0 (en) 1986-04-16
FR2579022A1 (fr) 1986-09-19
GB2172429A (en) 1986-09-17
IT8619667A1 (it) 1987-09-07
GB8506714D0 (en) 1985-04-17

Similar Documents

Publication Publication Date Title
DE3678808D1 (de) Induktive schaltungsanordnungen.
DE3481107D1 (de) Elektronische schaltungsanordnung.
DE3774911D1 (de) Matrix-strukturierte multiplizierschaltung.
DE3670154D1 (de) Elektronisches hubodometer.
NL191912C (nl) Geïntegreerd circuit.
FI853410L (fi) Kopplingsanordning.
DE3688088T2 (de) Integrierte halbleiterschaltung.
DE3481880D1 (de) Schaltkreis.
IT8423413A0 (it) Connettore elettrico incorporante componenti di circuiti elettrici.
DE3587715T2 (de) Integrierte Schaltung.
DE3685071D1 (de) Integrierte halbleiterschaltung.
DE3672748D1 (de) Spannungsmultipliziererschaltung.
DE3679928D1 (de) Monolitisch integrierte mikrowellenschaltungsanordnung.
DE3685759D1 (de) Integrierte halbleiterschaltung.
DE3575246D1 (de) Stromflussumkehrschaltkreis.
DE3680265D1 (de) Halbleiterschaltungsanordnung.
DE3684364D1 (de) Integrierte halbleiterschaltung.
DE3679962D1 (de) Elektronischer frankiermaschinenschaltkreis.
DE3677165D1 (de) Integrierte halbleiterschaltungsanordnung.
IT8423065A0 (it) Armadietto per circuiti stampati.
DE3586810D1 (de) Halbleiterschaltung.
DE3482084D1 (de) Integrierte schaltung.
DE3669793D1 (de) Halbleiterkreiseinrichtung.
FI852164A0 (fi) Kopplingsanordning.
DE3485292D1 (de) Lade-entladekreis.