DE3650719T2 - Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis - Google Patents

Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis

Info

Publication number
DE3650719T2
DE3650719T2 DE19863650719 DE3650719T DE3650719T2 DE 3650719 T2 DE3650719 T2 DE 3650719T2 DE 19863650719 DE19863650719 DE 19863650719 DE 3650719 T DE3650719 T DE 3650719T DE 3650719 T2 DE3650719 T2 DE 3650719T2
Authority
DE
Germany
Prior art keywords
electronic circuit
circuit devices
cooling modules
modules
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19863650719
Other languages
English (en)
Other versions
DE3650719D1 (de
Inventor
Haruhiko Yamamoto
Masahiro Suzuki
Yoshiaki Udagawa
Mitsuhiko Nakata
Koji Katsuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP25928485A external-priority patent/JPS62119947A/ja
Priority claimed from JP1703186A external-priority patent/JPS62282452A/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE3650719D1 publication Critical patent/DE3650719D1/de
Application granted granted Critical
Publication of DE3650719T2 publication Critical patent/DE3650719T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE19863650719 1985-11-19 1986-10-03 Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis Expired - Fee Related DE3650719T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25928485A JPS62119947A (ja) 1985-11-19 1985-11-19 集積回路素子の冷却装置
JP1703186A JPS62282452A (ja) 1986-01-28 1986-01-28 集積回路冷却装置

Publications (2)

Publication Number Publication Date
DE3650719D1 DE3650719D1 (de) 1999-06-02
DE3650719T2 true DE3650719T2 (de) 2000-04-13

Family

ID=26353488

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863650719 Expired - Fee Related DE3650719T2 (de) 1985-11-19 1986-10-03 Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis

Country Status (2)

Country Link
EP (1) EP0484320B1 (de)
DE (1) DE3650719T2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
DE4322933A1 (de) * 1993-07-09 1995-01-12 Abb Patent Gmbh Flüssigkeitskühlkörper mit hydraulischem Kühlmittelanschluß
DE10017971A1 (de) * 2000-04-11 2001-10-25 Bosch Gmbh Robert Kühlvorrichtung zur Kühlung von Bauelementen der Leistungselektronik mit einem Mikrowärmeübertrager
RU2523022C1 (ru) * 2012-12-10 2014-07-20 Общество с ограниченной ответственностью "Гамем" (ООО "Гамем") Устройство для охлаждения силовых электронных модулей

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式

Also Published As

Publication number Publication date
DE3650719D1 (de) 1999-06-02
EP0484320A2 (de) 1992-05-06
EP0484320A3 (de) 1995-05-17
EP0484320B1 (de) 1999-04-28

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee