ES543609A0 - Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia. - Google Patents
Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia.Info
- Publication number
- ES543609A0 ES543609A0 ES543609A ES543609A ES543609A0 ES 543609 A0 ES543609 A0 ES 543609A0 ES 543609 A ES543609 A ES 543609A ES 543609 A ES543609 A ES 543609A ES 543609 A0 ES543609 A0 ES 543609A0
- Authority
- ES
- Spain
- Prior art keywords
- electronic devices
- power electronic
- cooling systems
- cooling
- systems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8504027A FR2579371B1 (fr) | 1985-03-19 | 1985-03-19 | Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase |
Publications (2)
Publication Number | Publication Date |
---|---|
ES543609A0 true ES543609A0 (es) | 1987-01-01 |
ES8702082A1 ES8702082A1 (es) | 1987-01-01 |
Family
ID=9317330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES543609A Expired ES8702082A1 (es) | 1985-03-19 | 1985-05-29 | Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia. |
Country Status (2)
Country | Link |
---|---|
ES (1) | ES8702082A1 (es) |
FR (1) | FR2579371B1 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6302192B1 (en) | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6896039B2 (en) | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
JP5757086B2 (ja) * | 2008-10-29 | 2015-07-29 | 日本電気株式会社 | 冷却構造及び電子機器並びに冷却方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2102254B2 (de) * | 1971-01-19 | 1973-05-30 | Robert Bosch Gmbh, 7000 Stuttgart | Kuehlvorrichtung fuer leistungshalbleiterbauelemente |
-
1985
- 1985-03-19 FR FR8504027A patent/FR2579371B1/fr not_active Expired
- 1985-05-29 ES ES543609A patent/ES8702082A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
ES8702082A1 (es) | 1987-01-01 |
FR2579371B1 (fr) | 1987-09-11 |
FR2579371A1 (fr) | 1986-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19960603 |