ES8702082A1 - Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia. - Google Patents
Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia.Info
- Publication number
- ES8702082A1 ES8702082A1 ES543609A ES543609A ES8702082A1 ES 8702082 A1 ES8702082 A1 ES 8702082A1 ES 543609 A ES543609 A ES 543609A ES 543609 A ES543609 A ES 543609A ES 8702082 A1 ES8702082 A1 ES 8702082A1
- Authority
- ES
- Spain
- Prior art keywords
- thyristors
- exchangers
- evaporation
- employing
- cooling method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
PROCEDIMIENTO PARA EL ENFRIAMIENTO DE COMPONENTES ELECTRONICOS DE POTENCIA. EL COMPONENTE ELECTRONICO (1) SE ENCUENTRA EN UNOS INTERCAMBIADORES (2) DOTADOS DE ALETAS QUE CONSTITUYEN LOS EVAPORADORES DEL SISTEMA DE ENFRIAMIENTO, Y QUE PERMITEN EVAPORAR GRAN CANTIDAD DE CALOR POR LA EVAPORACION DEL FLUIDO QUE CIRCULA POR EL CIRCUITO. EL VAPOR QUE CIRCULA POR UNO DE LOS CONDUCTOS (8) LLEGA A UN CONDENSADOR DE ALETAS (3) CEDIENDO CALOR AL AIRE DE ENFRIAMIENTO, SIENDO ESE VAPOR EL DE UN LIQUIDO NO CONDUCTOR DE LA ELECTRICIDAD. EL CIRCUITO SE CIERRA CON EL RETORNO POR OTRO CONDUCTO (9) DE ENFRIAMIENTO DEL TIPO DE TERMOSIFON BIFASICO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8504027A FR2579371B1 (fr) | 1985-03-19 | 1985-03-19 | Procede et dispositif de refroidissement pour diodes et thyristors de puissance, mettant en oeuvre le principe du thermosiphon biphase |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8702082A1 true ES8702082A1 (es) | 1987-01-01 |
ES543609A0 ES543609A0 (es) | 1987-01-01 |
Family
ID=9317330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES543609A Expired ES8702082A1 (es) | 1985-03-19 | 1985-05-29 | Perfeccionamientos en los sistemas de enfriaiento de dispositivos electronicos de potencia. |
Country Status (2)
Country | Link |
---|---|
ES (1) | ES8702082A1 (es) |
FR (1) | FR2579371B1 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6302192B1 (en) | 1999-05-12 | 2001-10-16 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US6896039B2 (en) | 1999-05-12 | 2005-05-24 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
JP5757086B2 (ja) * | 2008-10-29 | 2015-07-29 | 日本電気株式会社 | 冷却構造及び電子機器並びに冷却方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2102254B2 (de) * | 1971-01-19 | 1973-05-30 | Robert Bosch Gmbh, 7000 Stuttgart | Kuehlvorrichtung fuer leistungshalbleiterbauelemente |
-
1985
- 1985-03-19 FR FR8504027A patent/FR2579371B1/fr not_active Expired
- 1985-05-29 ES ES543609A patent/ES8702082A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2579371A1 (fr) | 1986-09-26 |
FR2579371B1 (fr) | 1987-09-11 |
ES543609A0 (es) | 1987-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 19960603 |