BR8604643A - Instalacao de dissipacao para elementos semicondutores de potencia - Google Patents

Instalacao de dissipacao para elementos semicondutores de potencia

Info

Publication number
BR8604643A
BR8604643A BR8604643A BR8604643A BR8604643A BR 8604643 A BR8604643 A BR 8604643A BR 8604643 A BR8604643 A BR 8604643A BR 8604643 A BR8604643 A BR 8604643A BR 8604643 A BR8604643 A BR 8604643A
Authority
BR
Brazil
Prior art keywords
fluid
evaporation
heat exchanger
power elements
circuit
Prior art date
Application number
BR8604643A
Other languages
English (en)
Inventor
Claude Chauvet
Original Assignee
Jeumont Schneider
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jeumont Schneider filed Critical Jeumont Schneider
Publication of BR8604643A publication Critical patent/BR8604643A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
BR8604643A 1985-09-30 1986-09-25 Instalacao de dissipacao para elementos semicondutores de potencia BR8604643A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8514419A FR2588072B1 (fr) 1985-09-30 1985-09-30 Installation de dissipation pour elements semi-conducteurs de puissance

Publications (1)

Publication Number Publication Date
BR8604643A true BR8604643A (pt) 1987-06-09

Family

ID=9323360

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8604643A BR8604643A (pt) 1985-09-30 1986-09-25 Instalacao de dissipacao para elementos semicondutores de potencia

Country Status (6)

Country Link
US (1) US4733331A (pt)
EP (1) EP0218526A1 (pt)
JP (1) JPS6292455A (pt)
BR (1) BR8604643A (pt)
CA (1) CA1252508A (pt)
FR (1) FR2588072B1 (pt)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2928603B2 (ja) * 1990-07-30 1999-08-03 キヤノン株式会社 Ｘ線露光装置用ウエハ冷却装置
FR2674990A1 (fr) * 1991-04-04 1992-10-09 Merlin Gerin Dispositif de refroidissement a liquide vaporisable pour un disjoncteur electronique.
US5343358A (en) * 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
US6578628B1 (en) * 1996-10-21 2003-06-17 Carrier Corporation Article exhibiting increased resistance to galvanic corrosion
US6239502B1 (en) * 1999-11-22 2001-05-29 Bae Systems Controls Phase change assisted heat sink
US20030033398A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for generating and using configuration policies
US20030033346A1 (en) * 2001-08-10 2003-02-13 Sun Microsystems, Inc. Method, system, and program for managing multiple resources in a system
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US7133907B2 (en) * 2001-10-18 2006-11-07 Sun Microsystems, Inc. Method, system, and program for configuring system resources
US6965559B2 (en) * 2001-10-19 2005-11-15 Sun Microsystems, Inc. Method, system, and program for discovering devices communicating through a switch
US20030135609A1 (en) * 2002-01-16 2003-07-17 Sun Microsystems, Inc. Method, system, and program for determining a modification of a system resource configuration
US6640575B2 (en) * 2002-02-01 2003-11-04 Mac Word Apparatus and method for closed circuit cooling tower with corrugated metal tube elements
TW511891U (en) * 2002-03-13 2002-11-21 Hon Hai Prec Ind Co Ltd A heat dissipating device
US7103889B2 (en) 2002-07-23 2006-09-05 Sun Microsystems, Inc. Method, system, and article of manufacture for agent processing
US20040022200A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for providing information on components within a network
US20040024887A1 (en) * 2002-07-31 2004-02-05 Sun Microsystems, Inc. Method, system, and program for generating information on components within a network
US7143615B2 (en) 2002-07-31 2006-12-05 Sun Microsystems, Inc. Method, system, and program for discovering components within a network
US6953227B2 (en) * 2002-12-05 2005-10-11 Sun Microsystems, Inc. High-power multi-device liquid cooling
US7327578B2 (en) * 2004-02-06 2008-02-05 Sun Microsystems, Inc. Cooling failure mitigation for an electronics enclosure
ATE532401T1 (de) 2008-05-16 2011-11-15 Parker Hannifin Corp Mit einer verdampfbaren dielektrischen füssigkeit gekühlter modularer hochleistungsantriebsblock
DE102008030308A1 (de) 2008-06-30 2009-12-31 Lindenstruth, Volker, Prof. Gebäude für ein Rechenzentrum mit Einrichtungen zur effizienten Kühlung
EP2555605A1 (en) * 2011-08-01 2013-02-06 GSI Helmholtzzentrum für Schwerionenforschung GmbH Mobile data centre unit with efficient cooling means
EP2663172A1 (en) 2012-05-11 2013-11-13 eCube Computing GmbH Method for operating a data centre with efficient cooling means
EP2704190A1 (en) * 2012-09-03 2014-03-05 ABB Technology AG Modular cooling system
US11488927B2 (en) 2021-02-18 2022-11-01 Abb Schweiz Ag Press-pack semiconductor fixtures

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2414270A1 (de) * 1971-01-19 1975-10-09 Bosch Gmbh Robert Kuehlvorrichtung fuer leistungshalbleiterbauelemente
JPS5512740B2 (pt) * 1974-03-15 1980-04-03
JPS5241193B2 (pt) * 1974-03-16 1977-10-17
DE2417106A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule
DE2417031A1 (de) * 1974-04-08 1975-10-16 Siemens Ag Thyristorsaeule
JPS56140651A (en) * 1980-04-02 1981-11-04 Mitsubishi Electric Corp Semiconductor device
JPS583383A (ja) * 1981-06-29 1983-01-10 Sony Corp ビデオデ−タ記録再生方式
DE3307703A1 (de) * 1983-03-04 1984-09-06 BBC Aktiengesellschaft Brown, Boveri & Cie., Baden, Aargau Dosen-siedekuehleinrichtung fuer leistungshalbleiterelemente
EP0144579B1 (de) * 1983-11-02 1987-10-14 BBC Brown Boveri AG Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen

Also Published As

Publication number Publication date
EP0218526A1 (fr) 1987-04-15
FR2588072B1 (fr) 1987-12-11
FR2588072A1 (fr) 1987-04-03
JPS6292455A (ja) 1987-04-27
CA1252508A (fr) 1989-04-11
US4733331A (en) 1988-03-22

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