JPS56140651A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS56140651A JPS56140651A JP4377280A JP4377280A JPS56140651A JP S56140651 A JPS56140651 A JP S56140651A JP 4377280 A JP4377280 A JP 4377280A JP 4377280 A JP4377280 A JP 4377280A JP S56140651 A JPS56140651 A JP S56140651A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- pipe
- hollow pipe
- expanded
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To connect a hollow pipe to a distribution pipe by a simple manner by providing two-stage expanded parts at the end part of the hollow pipe on the side of the distribution pipe, with a small distance being provided in the other direction from said end part, and holding the wall of a connecting hole of the distributing pipe between the two stages. CONSTITUTION:The hollow pipe 12 is inserted into a heat transporting pipe of a semiconducting device 11. Two stages of expanded parts 12A and 12B are provided on the hollow pipe 12 with a small distance being provided from the end. The part 12A is expanded to form a bugle shape, and the parts 12B are of an elastic tongue shape. The hollow pipe 12 and the parts 12B are made of Teflon and the like. A refrigerant-medium distributing pipe 13 has a hole 13A for inserting the hollow pipe and a connecting hole 13B at the top and bottom parts of the circumference. When the surrounding wall of the hole 13B is held by the parts 12A and 12B, the pipes are not separated. The outer periphery of the parts 13B is compressed by the elasticity of the parts 12B, and the parts 12A and 13B are engaged air-tightly. Therefore, the bubbles from the evaporator never enter the distributing pipe 13. In this constitution, the pipes can be quickly and precisely coupled together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4377280A JPS56140651A (en) | 1980-04-02 | 1980-04-02 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4377280A JPS56140651A (en) | 1980-04-02 | 1980-04-02 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56140651A true JPS56140651A (en) | 1981-11-04 |
Family
ID=12673036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4377280A Pending JPS56140651A (en) | 1980-04-02 | 1980-04-02 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56140651A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574877A (en) * | 1983-03-03 | 1986-03-11 | Brown, Boveri & Cie Ag | Can-type evaporative cooling device for power semiconductor elements |
| JPS6292455A (en) * | 1985-09-30 | 1987-04-27 | ジユモン シユナイダ− | Heat radiating equipment for output semiconductor element |
-
1980
- 1980-04-02 JP JP4377280A patent/JPS56140651A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4574877A (en) * | 1983-03-03 | 1986-03-11 | Brown, Boveri & Cie Ag | Can-type evaporative cooling device for power semiconductor elements |
| JPS6292455A (en) * | 1985-09-30 | 1987-04-27 | ジユモン シユナイダ− | Heat radiating equipment for output semiconductor element |
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