ATE532401T1 - Mit einer verdampfbaren dielektrischen füssigkeit gekühlter modularer hochleistungsantriebsblock - Google Patents
Mit einer verdampfbaren dielektrischen füssigkeit gekühlter modularer hochleistungsantriebsblockInfo
- Publication number
- ATE532401T1 ATE532401T1 AT09747753T AT09747753T ATE532401T1 AT E532401 T1 ATE532401 T1 AT E532401T1 AT 09747753 T AT09747753 T AT 09747753T AT 09747753 T AT09747753 T AT 09747753T AT E532401 T1 ATE532401 T1 AT E532401T1
- Authority
- AT
- Austria
- Prior art keywords
- high performance
- drive block
- dielectric liquid
- modular drive
- vaporizable dielectric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/005—Electrical coupling combined with fluidic coupling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5368608P | 2008-05-16 | 2008-05-16 | |
| PCT/US2009/044311 WO2009140672A1 (en) | 2008-05-16 | 2009-05-18 | Modular high-power drive stack cooled with vaporizable dielectric fluid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE532401T1 true ATE532401T1 (de) | 2011-11-15 |
Family
ID=40852223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT09747753T ATE532401T1 (de) | 2008-05-16 | 2009-05-18 | Mit einer verdampfbaren dielektrischen füssigkeit gekühlter modularer hochleistungsantriebsblock |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8305760B2 (de) |
| EP (1) | EP2277365B1 (de) |
| JP (1) | JP5457435B2 (de) |
| AT (1) | ATE532401T1 (de) |
| ES (1) | ES2376525T3 (de) |
| WO (1) | WO2009140672A1 (de) |
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| US9307674B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component |
| US9027360B2 (en) | 2011-05-06 | 2015-05-12 | International Business Machines Corporation | Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system |
| US9061382B2 (en) | 2011-07-25 | 2015-06-23 | International Business Machines Corporation | Heat sink structure with a vapor-permeable membrane for two-phase cooling |
| US8564952B2 (en) | 2011-07-25 | 2013-10-22 | International Business Machines Corporation | Flow boiling heat sink structure with vapor venting and condensing |
| US9069532B2 (en) * | 2011-07-25 | 2015-06-30 | International Business Machines Corporation | Valve controlled, node-level vapor condensation for two-phase heat sink(s) |
| US8687364B2 (en) * | 2011-10-28 | 2014-04-01 | International Business Machines Corporation | Directly connected heat exchanger tube section and coolant-cooled structure |
| AU2012232967B2 (en) | 2011-10-31 | 2015-01-15 | Abb Technology Ag | Cabinet with modules having a thermosiphon cooler arrangement |
| AU2012232968B2 (en) | 2011-10-31 | 2014-11-13 | Abb Technology Ag | Thermosiphon cooler arrangement in modules with electric and/or electronic components |
| US9043035B2 (en) | 2011-11-29 | 2015-05-26 | International Business Machines Corporation | Dynamically limiting energy consumed by cooling apparatus |
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| US9363930B2 (en) | 2013-03-11 | 2016-06-07 | Teco-Westinghouse Motor Company | Passive two phase cooling solution for low, medium and high voltage drive systems |
| US9153374B2 (en) * | 2013-06-28 | 2015-10-06 | Teco-Westinghouse Motor Company | Cooling arrangements for drive systems |
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| US11028947B2 (en) | 2013-11-22 | 2021-06-08 | Ford Global Technologies, Llc | Coupling for electric vehicle battery pack |
| CN106033934B (zh) | 2015-03-18 | 2019-05-21 | 台达电子工业股份有限公司 | 集成式功率转换电路组装模块 |
| US9537291B1 (en) * | 2015-06-08 | 2017-01-03 | Amazon Technologies, Inc. | Elevated automatic transfer switch cabinet |
| US10476298B1 (en) | 2015-09-02 | 2019-11-12 | Amazon Technologies, Inc. | Elevated automatic transfer switch cabinet |
| GB2542353A (en) * | 2015-09-15 | 2017-03-22 | Alstom Technology Ltd | A busbar assembly |
| US20170094842A1 (en) * | 2015-09-28 | 2017-03-30 | Infineon Technologies Austria Ag | Power Supply and Method |
| EP3179837B1 (de) | 2015-12-09 | 2020-06-03 | ABB Schweiz AG | Wandlerzellenkondensatorkühlung |
| US10486548B2 (en) * | 2016-01-13 | 2019-11-26 | Ford Global Technologies, Llc | Power inverter for a vehicle |
| US10178803B2 (en) * | 2016-03-11 | 2019-01-08 | Eaton Intelligent Power Limited | Thermosyphon cooling apparatus with isolation of cooled components |
| WO2018001464A1 (en) | 2016-06-28 | 2018-01-04 | Abb Schweiz Ag | Converter cell arrangement with cooling system |
| US10098260B2 (en) | 2016-07-18 | 2018-10-09 | Hamilton Sundstrand Corporation | Thermal management systems for electronics |
| WO2018050217A1 (en) * | 2016-09-14 | 2018-03-22 | Abb Schweiz Ag | Cooling arrangement |
| CN117382398A (zh) | 2016-11-01 | 2024-01-12 | 伊顿智能动力有限公司 | 具有发动机熄火滑行和双重模式hvac的变速器系统 |
| JP2018074100A (ja) * | 2016-11-04 | 2018-05-10 | 富士通株式会社 | ラックマウント型情報処理装置 |
| FR3062518B1 (fr) | 2017-01-31 | 2019-04-19 | Supergrid Institute | Module electronique de puissance comportant un support dielectrique |
| CN108962853A (zh) | 2017-05-17 | 2018-12-07 | 通用电气公司 | 集成的功率半导体封装装置和功率变换器 |
| DE102017115636B4 (de) * | 2017-07-12 | 2026-03-26 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Leistungselektronische Anlage |
| JP6628327B2 (ja) * | 2017-10-20 | 2020-01-08 | Necプラットフォームズ株式会社 | サーバ |
| WO2019092023A2 (en) | 2017-11-07 | 2019-05-16 | Eaton Intelligent Power Limited | Transmission mounted electrical charging system with dual mode load and engine off motive load power |
| US11472287B2 (en) | 2017-11-07 | 2022-10-18 | Eaton Intelligent Power Limited | Transmission mounted electrical charging system with improved battery assembly |
| US11938825B2 (en) | 2017-11-07 | 2024-03-26 | Eaton Intelligent Power Limited | System and method of a mobile electrical system |
| AT521040B1 (de) * | 2018-05-25 | 2019-10-15 | Miba Energy Holding Gmbh | Leistungsbaugruppe mit tragendem Kühlkörper |
| CN112237055A (zh) * | 2018-05-25 | 2021-01-15 | 米巴能源控股有限公司 | 具有支承的冷却体的功率结构组件 |
| US12500398B2 (en) * | 2018-10-31 | 2025-12-16 | Lear Corporation | Electrical assembly |
| JP7095580B2 (ja) * | 2018-12-07 | 2022-07-05 | トヨタ自動車株式会社 | 車両 |
| US11122705B2 (en) | 2019-01-14 | 2021-09-14 | Cisco Technology, Inc. | Liquid cooled optical cages for optical modules |
| WO2020175848A1 (ko) * | 2019-02-25 | 2020-09-03 | 주식회사 아모그린텍 | 전기자동차용 전력반도체 냉각모듈 |
| MX2021011282A (es) * | 2019-03-18 | 2021-10-01 | Dcbel Inc | Sistema de enfriamiento para usar en convertidores de energia. |
| WO2020187989A1 (en) | 2019-03-18 | 2020-09-24 | Eaton Intelligent Power Limited | Transmission mounted electrical charging system pto gear arrangement |
| US11272638B2 (en) * | 2019-06-20 | 2022-03-08 | Eaton Intelligent Power Limited | System, method, and apparatus for integrating high power density power electronics on a mobile application |
| US11428168B2 (en) | 2020-01-06 | 2022-08-30 | Hamilton Sundstrand Corporation | Starter/generator arrangements for gas turbine engines |
| CN114252204A (zh) * | 2020-09-21 | 2022-03-29 | 华为技术有限公司 | 一种节点及电子设备 |
| US11531383B1 (en) | 2020-09-30 | 2022-12-20 | Amazon Technologies, Inc. | Mist cooling for computer systems |
| CN116321911A (zh) * | 2021-12-03 | 2023-06-23 | 泰连服务有限公司 | 用于汇流排组件的冷却剂系统 |
| DE102023110394A1 (de) * | 2023-04-24 | 2024-10-24 | Bayerische Motoren Werke Aktiengesellschaft | Stromschienenanordnung und Brennstoffzelle |
| US12382607B1 (en) | 2023-05-02 | 2025-08-05 | Amazon Technologies, Inc. | Liquid immersion chassis liner |
| US20240396276A1 (en) * | 2023-05-24 | 2024-11-28 | Te Connectivity Solutions Gmbh | Power conector system |
| EP4704505A1 (de) * | 2024-08-30 | 2026-03-04 | Siemens Aktiengesellschaft | Stromrichtermodul und betriebsverfahren |
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| ITBG20090030A1 (it) * | 2009-05-28 | 2010-11-29 | Abb Spa | Dispositivo per la connessione di una linea elettrica ad un interruttore. |
| US7952875B2 (en) * | 2009-05-29 | 2011-05-31 | GM Global Technology Operations LLC | Stacked busbar assembly with integrated cooling |
| US7768783B1 (en) * | 2009-06-16 | 2010-08-03 | Microsoft Corporation | Electronic module cooling |
-
2009
- 2009-05-18 WO PCT/US2009/044311 patent/WO2009140672A1/en not_active Ceased
- 2009-05-18 EP EP09747753A patent/EP2277365B1/de not_active Not-in-force
- 2009-05-18 ES ES09747753T patent/ES2376525T3/es active Active
- 2009-05-18 US US12/921,238 patent/US8305760B2/en not_active Expired - Fee Related
- 2009-05-18 AT AT09747753T patent/ATE532401T1/de active
- 2009-05-18 JP JP2011509788A patent/JP5457435B2/ja not_active Expired - Fee Related
-
2012
- 2012-11-05 US US13/668,875 patent/US8760855B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20130063897A1 (en) | 2013-03-14 |
| ES2376525T3 (es) | 2012-03-14 |
| WO2009140672A1 (en) | 2009-11-19 |
| EP2277365A1 (de) | 2011-01-26 |
| JP2011524081A (ja) | 2011-08-25 |
| US8305760B2 (en) | 2012-11-06 |
| EP2277365B1 (de) | 2011-11-02 |
| JP5457435B2 (ja) | 2014-04-02 |
| US20110013364A1 (en) | 2011-01-20 |
| US8760855B2 (en) | 2014-06-24 |
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