JPS5585049A - Cooling fin - Google Patents

Cooling fin

Info

Publication number
JPS5585049A
JPS5585049A JP15685778A JP15685778A JPS5585049A JP S5585049 A JPS5585049 A JP S5585049A JP 15685778 A JP15685778 A JP 15685778A JP 15685778 A JP15685778 A JP 15685778A JP S5585049 A JPS5585049 A JP S5585049A
Authority
JP
Japan
Prior art keywords
fins
base
auxiliary
pitches
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15685778A
Other languages
Japanese (ja)
Inventor
Kenji Kijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15685778A priority Critical patent/JPS5585049A/en
Publication of JPS5585049A publication Critical patent/JPS5585049A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To produce cooling fins for self-cooling with excellent efficiency, by adopting the pitches of grids ensuring the lowest thermal resistance decided by the hardness or ease of the flowing of the air of grid fins and the area of heat transmission.
CONSTITUTION: Auxiliary fins 3 formed by continuously bending sheets of aluminum or copper are inserted among a pluraliry of flat fins 2 provided by mounting 2 in parallel on a base 1, and fixed by means of brazing, etc. A semiconductor element 4 is installed to the base 1. When the pitches of grids are made to be 10W 12mm, efficiency can extremely be bettered. Thus, heat generated by means of the semiconductor element 4 is transmitted to the fins 2 and the auxiliary fins 3 from the base 1, and this device can efficiently be cooled by the streams of air by natural convection. The auxiliary fins can also be formed in truss-like or wavy shapes. U-shaped fins or wavelike fins can also be used in place of the flat fins 2.
COPYRIGHT: (C)1980,JPO&Japio
JP15685778A 1978-12-21 1978-12-21 Cooling fin Pending JPS5585049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15685778A JPS5585049A (en) 1978-12-21 1978-12-21 Cooling fin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15685778A JPS5585049A (en) 1978-12-21 1978-12-21 Cooling fin

Publications (1)

Publication Number Publication Date
JPS5585049A true JPS5585049A (en) 1980-06-26

Family

ID=15636888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15685778A Pending JPS5585049A (en) 1978-12-21 1978-12-21 Cooling fin

Country Status (1)

Country Link
JP (1) JPS5585049A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116651A (en) * 1980-02-20 1981-09-12 Toshiba Corp Air-cooling fin
JPS59189248U (en) * 1983-06-03 1984-12-15 三菱アルミニウム株式会社 Heatsink for electrical elements
US5535816A (en) * 1993-10-15 1996-07-16 Diamond Electroic Mfg. Co. Ltd. Heat sink
US5603376A (en) * 1994-08-31 1997-02-18 Fujitsu Network Communications, Inc. Heat exchanger for electronics cabinet
US5771966A (en) * 1995-12-15 1998-06-30 Jacoby; John Folded conducting member heatsinks and method of making same
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
US6234246B1 (en) * 1995-05-04 2001-05-22 Alusuisse Technology & Management Ltd. Heat exchanger for cooling semi-conductor components
JP2016166734A (en) * 2016-05-25 2016-09-15 パナソニックＩｐマネジメント株式会社 Heat sink and air conditioning device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56116651A (en) * 1980-02-20 1981-09-12 Toshiba Corp Air-cooling fin
JPS6214101B2 (en) * 1980-02-20 1987-03-31 Tokyo Shibaura Electric Co
JPS59189248U (en) * 1983-06-03 1984-12-15 三菱アルミニウム株式会社 Heatsink for electrical elements
JPS6336691Y2 (en) * 1983-06-03 1988-09-28
US5535816A (en) * 1993-10-15 1996-07-16 Diamond Electroic Mfg. Co. Ltd. Heat sink
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
US5603376A (en) * 1994-08-31 1997-02-18 Fujitsu Network Communications, Inc. Heat exchanger for electronics cabinet
US6234246B1 (en) * 1995-05-04 2001-05-22 Alusuisse Technology & Management Ltd. Heat exchanger for cooling semi-conductor components
US5771966A (en) * 1995-12-15 1998-06-30 Jacoby; John Folded conducting member heatsinks and method of making same
JP2016166734A (en) * 2016-05-25 2016-09-15 パナソニックＩｐマネジメント株式会社 Heat sink and air conditioning device

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