JPS6214101B2 - - Google Patents
Info
- Publication number
- JPS6214101B2 JPS6214101B2 JP55018956A JP1895680A JPS6214101B2 JP S6214101 B2 JPS6214101 B2 JP S6214101B2 JP 55018956 A JP55018956 A JP 55018956A JP 1895680 A JP1895680 A JP 1895680A JP S6214101 B2 JPS6214101 B2 JP S6214101B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- fins
- base
- fin
- round bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000005219 brazing Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
【発明の詳細な説明】
本発明は電力用半導体素子などの冷却に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to cooling of power semiconductor devices and the like.
従来半導体素子は種々の方法で冷却されている
が、それぞれ次の様な不具合点がある。 Conventionally, semiconductor devices have been cooled by various methods, but each method has the following drawbacks.
(1) 自冷（自然風冷）式……小容量向のみ。(1) Natural cooling (natural wind cooling) type...Only for small capacity applications.
(2) 風冷（強制 〃）式……ブロアの騒音及び保
守、ほこりの吸い込みによる絶縁劣化フイルタ
の保守等。(2) Air cooling (forced 〃) type...Blower noise and maintenance, insulation deterioration due to dust inhalation, maintenance of filters, etc.
(3) 油冷式……補機としてポンプが必要、油の交
換要す。(3) Oil-cooled type: A pump is required as an auxiliary machine, and oil needs to be replaced.
(4) フロン冷却式……構造複雑圧力容器の使用が
必要。(4) Freon cooling type: Requires the use of a pressure vessel with a complex structure.
第１図に、従来使用している自冷あるいは風冷
式用の冷却フインを示すが、これは体積のわりに
冷却能力が低く、冷却装置の小型化を困難にして
いるものである。本発明は、この様な不具合点を
解消するため、効率の良い自冷用の冷却フインを
提供するのが目的である。 FIG. 1 shows a conventionally used cooling fin for self-cooling or air-cooling, but this has a low cooling capacity relative to its volume, making it difficult to downsize the cooling device. An object of the present invention is to provide an efficient cooling fin for self-cooling in order to eliminate such problems.
本発明の構成を図面に従つて説明する。第２図
は一実施例で素材としては、アルミニウムあるい
は銅の様な熱伝導の良好な材料を使用する。ベー
ス１に複数枚の平板状フイン２を平行に設け、そ
の間にさらに細い丸棒３等を千鳥状に通して、ロ
ー付等により取付ける。ベース１には半導体素子
４を取付ける。この時フイン２及び丸棒３の形状
として最適のものは、以下の様に決められる。フ
イン２のピツチは大きい程空気の流れが良くなる
が、伝熱面積が減少する。逆にピツチが小さいと
伝熱面積は増えるが流れが悪くなる。つまり最適
の値があるが種々の計算及び試験により自然対流
の場合、ピツチが10〜12ミリ程度が最も放熱上良
好である。また、丸棒３の方も伝熱面積、重量、
及びフイン間の対流の乱流効果の点から最適な形
状があるが直径で３〜４ミリメートル、ピツチで
15〜20ミリメートルの千鳥配列が効果的である。
この様な値になる様にフイン２と丸棒３の形状を
構成するわけである。本発明は、この様に構成さ
れているので次の作用効果がある。素子による発
生熱はベース１よりフイン２に伝わり自然対流に
よる上下方向の空気の流れにより効率良く冷却さ
れる。この時、丸棒３の部分は放熱部となるだけ
でなく、フイン間の自然対流の流れを乱して熱伝
達率を上げる様に作用する。素子に平型素子７を
使用する時は、該素子を締めつける必要がある。
この時第４図に示す様にベースと圧接板６とによ
り素子を締めつけるが、この時フイン２と丸棒３
とよりなる構造がベース１を補強することになり
ベース１に反りを生じさせない効果がありベース
１を薄くすることができる。 The configuration of the present invention will be explained according to the drawings. FIG. 2 shows one embodiment in which a material with good thermal conductivity such as aluminum or copper is used as the material. A plurality of flat plate-like fins 2 are provided in parallel on a base 1, thin round rods 3, etc. are passed between them in a staggered manner, and attached by brazing or the like. A semiconductor element 4 is attached to the base 1. At this time, the optimal shape of the fins 2 and round bar 3 is determined as follows. The larger the pitch of the fins 2, the better the air flow, but the heat transfer area decreases. Conversely, if the pitch is small, the heat transfer area will increase, but the flow will be poor. In other words, there is an optimal value, but according to various calculations and tests, in the case of natural convection, a pitch of about 10 to 12 mm is the best for heat dissipation. Also, for round bar 3, the heat transfer area, weight,
There is an optimal shape in terms of the turbulent flow effect of convection between the fins, but the diameter is 3 to 4 mm, and the pitch is 3 to 4 mm.
A staggered arrangement of 15 to 20 millimeters is effective.
The shapes of the fins 2 and the round bar 3 are configured to have such values. Since the present invention is configured as described above, it has the following effects. The heat generated by the element is transmitted from the base 1 to the fins 2 and is efficiently cooled by vertical air flow due to natural convection. At this time, the round bar 3 not only serves as a heat radiating section, but also acts to disturb the natural convection flow between the fins and increase the heat transfer coefficient. When using the flat element 7 as the element, it is necessary to tighten the element.
At this time, as shown in FIG. 4, the element is tightened by the base and the pressure contact plate 6.
This structure reinforces the base 1 and has the effect of preventing the base 1 from warping, allowing the base 1 to be made thinner.
上記の如き本発明により次の効果がある。 The present invention as described above has the following effects.
(1) 空気の流れが乱流になり熱伝達率が上がり冷
却効率が良くなる。（第１図の従来例と比較
し、同一体積で熱抵抗に換算し、15〜20％性能
がアツプする）
(2) フインの冷却面積が増加し、(1)の効果ととも
に全体として小型で効率の良い冷却フインが得
られる。(1) Air flow becomes turbulent, increasing heat transfer coefficient and improving cooling efficiency. (Compared to the conventional example shown in Figure 1, the performance is increased by 15 to 20% in terms of thermal resistance with the same volume.) (2) The cooling area of the fins is increased, and in addition to the effect of (1), the overall design is smaller. A highly efficient cooling fin can be obtained.
(3) フインとベース、丸棒の固定は炉中ロー付に
よる加工が可能で製造が容易である。(3) The fins, base, and round bar can be fixed by furnace brazing, making manufacturing easy.
(4) フイン及び丸棒の部分の構造が補強となり、
フイン全体の剛性が高くなる。これにより特に
圧接を必要とする平型素子を使用することがで
きる様になつた。(4) The structure of the fins and round bars is reinforced,
The rigidity of the entire fin increases. This has made it possible to use flat elements that particularly require pressure welding.
(5) スタツド型素子に比し熱放散の良好な平型素
子の使用可能により、自冷式の容量が大とな
り、さらに小型軽量な半導体装置が可能になつ
た。(5) The ability to use flat elements, which have better heat dissipation than stud-type elements, has increased the capacity of self-cooling systems, making it possible to create smaller and lighter semiconductor devices.
第１図は従来の冷却フイン、第２図は本発明に
よる冷却フインの正面図、第３図は第２図の側面
図、第４図は本発明を使用した例、
１…ベース、２…フイン、３…丸棒、４…スタ
ツド型半導体素子、５…端子（リード線）、６…
平型素子締付機構、７…平型素子。
FIG. 1 is a conventional cooling fin, FIG. 2 is a front view of the cooling fin according to the present invention, FIG. 3 is a side view of FIG. 2, and FIG. 4 is an example using the present invention. 1...Base, 2... Fin, 3... Round bar, 4... Stud type semiconductor element, 5... Terminal (lead wire), 6...
Flat element tightening mechanism, 7...Flat element.
Claims (1)
用の冷却フインにおいて、前記複数枚の冷却フイ
ンに、熱伝導の良い複数本の金属丸棒を所定のピ
ツチで貫通、固定させてなることを特長とする空
冷フイン。1. In a cooling fin for natural air cooling, which has a plurality of flat plates provided on a base, a plurality of metal round rods with good thermal conductivity are penetrated and fixed at a predetermined pitch through the plurality of cooling fins. Features air cooling fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1895680A JPS56116651A (en) | 1980-02-20 | 1980-02-20 | Air-cooling fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1895680A JPS56116651A (en) | 1980-02-20 | 1980-02-20 | Air-cooling fin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56116651A JPS56116651A (en) | 1981-09-12 |
| JPS6214101B2 true JPS6214101B2 (en) | 1987-03-31 |
Family
ID=11986092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1895680A Granted JPS56116651A (en) | 1980-02-20 | 1980-02-20 | Air-cooling fin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56116651A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4485835B2 (en) * | 2004-04-09 | 2010-06-23 | 古河スカイ株式会社 | Radiator |
| JP2017069522A (en) * | 2015-10-02 | 2017-04-06 | 株式会社フジクラ | Cold plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5585049A (en) * | 1978-12-21 | 1980-06-26 | Toshiba Corp | Cooling fin |
-
1980
- 1980-02-20 JP JP1895680A patent/JPS56116651A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5585049A (en) * | 1978-12-21 | 1980-06-26 | Toshiba Corp | Cooling fin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56116651A (en) | 1981-09-12 |
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