SE8103779L - Kylkropp for halvledare eller liknande - Google Patents
Kylkropp for halvledare eller liknandeInfo
- Publication number
- SE8103779L SE8103779L SE8103779A SE8103779A SE8103779L SE 8103779 L SE8103779 L SE 8103779L SE 8103779 A SE8103779 A SE 8103779A SE 8103779 A SE8103779 A SE 8103779A SE 8103779 L SE8103779 L SE 8103779L
- Authority
- SE
- Sweden
- Prior art keywords
- half conductor
- similar refrigerator
- fins
- refrigerator
- similar
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/10—Secondary fins, e.g. projections or recesses on main fins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3024748A DE3024748C2 (de) | 1980-06-30 | 1980-06-30 | Kühlkörper für Halbleiterbauelemente |
Publications (2)
Publication Number | Publication Date |
---|---|
SE8103779L true SE8103779L (sv) | 1981-12-31 |
SE457584B SE457584B (sv) | 1989-01-09 |
Family
ID=6106046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE8103779A SE457584B (sv) | 1980-06-30 | 1981-06-16 | Kylkropp foer halvledare |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE3024748C2 (sv) |
FR (1) | FR2485807A1 (sv) |
GB (1) | GB2079052B (sv) |
SE (1) | SE457584B (sv) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3518310A1 (de) * | 1985-05-22 | 1986-11-27 | Aluminium-Walzwerke Singen Gmbh, 7700 Singen | Kuehlkoerper fuer halbleiterbauelemente und verfahren zu seiner herstellung |
DE8703604U1 (de) * | 1987-03-11 | 1988-07-21 | Euroatlas GmbH für Umformertechnik und Optronik, 2800 Bremen | Kühlkörper mit Halbleiterschalter |
DE59106364D1 (de) * | 1990-10-24 | 1995-10-05 | Alusuisse Lonza Services Ag | Kühlkörper für Halbleiterbauelemente. |
DE9319259U1 (de) * | 1993-12-15 | 1994-03-24 | Siemens AG, 80333 München | Kühlkörper |
GB2333353A (en) * | 1998-01-16 | 1999-07-21 | Kuo Ching Sung | Heat dissipating device |
DE19806978B4 (de) * | 1998-02-19 | 2008-08-21 | Behr Gmbh & Co. Kg | Kühlvorrichtung zur Kühlung durch Konvektion |
DE102004040557A1 (de) * | 2004-08-16 | 2006-02-23 | Kern, Dietmar, Dr.-Ing. | Elektronikkühlkörper |
DE102009037259B4 (de) * | 2009-08-12 | 2012-04-19 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul |
US20160369995A1 (en) * | 2015-06-16 | 2016-12-22 | Posco Led Company Ltd. | Optical semiconductor lighting apparatus |
EP3403937B1 (en) * | 2017-05-19 | 2021-01-13 | Goodrich Lighting Systems GmbH | Exterior aircraft light unit |
DE102019107280A1 (de) * | 2019-03-21 | 2020-09-24 | apt Extrusions GmbH & Co. KG | Kühleinrichtung zur Kühlung eines zu kühlenden Drittgegenstands |
EP3973749A1 (en) * | 2019-06-03 | 2022-03-30 | Huawei Technologies Co., Ltd. | An apparatus for transferring heat from a heat source to air |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1959193A1 (de) * | 1969-11-25 | 1971-05-27 | Leonhard Roesch | Vorrichtung zum Ermitteln der Maschen- und Reihenzahl bei Strickwaren |
DE7913126U1 (de) * | 1979-05-07 | 1979-08-23 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Kuehlkoerper aus stranggepresstem aluminium fuer leistungshalbleiter |
-
1980
- 1980-06-30 DE DE3024748A patent/DE3024748C2/de not_active Expired
-
1981
- 1981-06-16 SE SE8103779A patent/SE457584B/sv not_active IP Right Cessation
- 1981-06-30 GB GB8120125A patent/GB2079052B/en not_active Expired
- 1981-06-30 FR FR8112876A patent/FR2485807A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
GB2079052A (en) | 1982-01-13 |
DE3024748A1 (de) | 1982-02-04 |
DE3024748C2 (de) | 1986-09-04 |
FR2485807A1 (fr) | 1981-12-31 |
SE457584B (sv) | 1989-01-09 |
FR2485807B3 (sv) | 1983-07-18 |
GB2079052B (en) | 1984-10-24 |
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Legal Events
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