IT1218271B - Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento - Google Patents

Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento

Info

Publication number
IT1218271B
IT1218271B IT21117/81A IT2111781A IT1218271B IT 1218271 B IT1218271 B IT 1218271B IT 21117/81 A IT21117/81 A IT 21117/81A IT 2111781 A IT2111781 A IT 2111781A IT 1218271 B IT1218271 B IT 1218271B
Authority
IT
Italy
Prior art keywords
procedure
plastic containers
dissipators
usable
mold
Prior art date
Application number
IT21117/81A
Other languages
English (en)
Other versions
IT8121117A0 (it
Inventor
Giuseppe Marchisi
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Priority to IT21117/81A priority Critical patent/IT1218271B/it
Publication of IT8121117A0 publication Critical patent/IT8121117A0/it
Priority to FR8204387A priority patent/FR2503978A1/fr
Priority to DE19823212903 priority patent/DE3212903A1/de
Priority to JP57056104A priority patent/JPS58173853A/ja
Priority to NLAANVRAGE8201513,A priority patent/NL189533B/xx
Priority to US06/367,602 priority patent/US4467522A/en
Priority to GB08210726A priority patent/GB2101516B/en
Priority to CA000400903A priority patent/CA1184671A/en
Application granted granted Critical
Publication of IT1218271B publication Critical patent/IT1218271B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IT21117/81A 1981-04-11 1981-04-13 Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento IT1218271B (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
IT21117/81A IT1218271B (it) 1981-04-13 1981-04-13 Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
FR8204387A FR2503978A1 (fr) 1981-04-13 1982-03-16 Procede pour la fabrication de boitiers en matiere plastique avec dissipateur thermique incorpore pour circuits integres; combinaison de moule et de dissipateurs utilisable avec un tel procede
DE19823212903 DE3212903A1 (de) 1981-04-13 1982-04-06 Verfahren zur herstellung von kunststoff-gehaeusen mit eingebautem waermeableiter fuer integrierte schaltungen und zur ausfuehrung des verfahrens geeignete kombination aus formwerkzeug und waermeableiter
JP57056104A JPS58173853A (ja) 1981-04-11 1982-04-06 集積回路用容器の製造方法及びダイス−ヒ−トシンク組合せ
NLAANVRAGE8201513,A NL189533B (nl) 1981-04-13 1982-04-08 Werkwijze voor het aanbrengen van een kunststofhouder met warmte-afvoer rond een geintegreerde schakeling, alsmede combinatie van een matrijs en een warmte-afvoerelement voor gebruik bij deze werkwijze.
US06/367,602 US4467522A (en) 1981-04-11 1982-04-12 Process for manufacturing plastic containers incorporating a heat disperser for integrated circuits
GB08210726A GB2101516B (en) 1981-04-13 1982-04-13 Method of manufacture of plastics containers with incorporated heat sinks for integrated circuits and mould and heat sink combination for use with this method
CA000400903A CA1184671A (en) 1981-04-13 1982-04-13 Method of manufacture of plastics containers with incorporated heat sinks for integrated circuits and die and heat sink combination for use with this method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT21117/81A IT1218271B (it) 1981-04-13 1981-04-13 Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento

Publications (2)

Publication Number Publication Date
IT8121117A0 IT8121117A0 (it) 1981-04-13
IT1218271B true IT1218271B (it) 1990-04-12

Family

ID=11176982

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21117/81A IT1218271B (it) 1981-04-11 1981-04-13 Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento

Country Status (8)

Country Link
US (1) US4467522A (it)
JP (1) JPS58173853A (it)
CA (1) CA1184671A (it)
DE (1) DE3212903A1 (it)
FR (1) FR2503978A1 (it)
GB (1) GB2101516B (it)
IT (1) IT1218271B (it)
NL (1) NL189533B (it)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2148865B (en) * 1983-10-26 1986-12-31 Reliability Inc Automated burn-in board unloader and ic package sorter
EP0206771B1 (en) * 1985-06-20 1992-03-11 Kabushiki Kaisha Toshiba Packaged semiconductor device
US4724611A (en) * 1985-08-23 1988-02-16 Nec Corporation Method for producing semiconductor module
CA1327710C (en) * 1987-12-07 1994-03-15 Kazuhiko Umezawa Cooling system for ic package
EP0341950B1 (en) * 1988-05-09 1994-09-14 Nec Corporation Flat cooling structure of integrated circuit
US4975766A (en) * 1988-08-26 1990-12-04 Nec Corporation Structure for temperature detection in a package
JPH06100408B2 (ja) * 1988-09-09 1994-12-12 日本電気株式会社 冷却装置
EP0363687B1 (en) * 1988-09-20 1996-01-10 Nec Corporation Cooling structure for electronic components
JP2602380B2 (ja) * 1991-10-23 1997-04-23 富士通株式会社 半導体装置及びその製造方法
EP0817261B1 (en) 1996-06-28 2003-04-23 STMicroelectronics S.r.l. Method for manufacturing plastic package for electronic device having a fully insulated dissipator
DE19640255C2 (de) * 1996-09-30 2001-01-18 Tyco Electronics Logistics Ag Verfahren zur Herstellung eines elektronischen Moduls mit einem kunststoffumspritzten Leadframe
US6732590B1 (en) * 2002-11-20 2004-05-11 Infineon Technologies Ag Pressure sensor and process for producing the pressure sensor

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US531242A (en) * 1894-12-18 William s
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
DE2030271A1 (de) * 1969-06-25 1971-01-14 U.S. Electronic Services Corp. Isolierkörper mit eingebeten Zuleitungen für Mikroschaltkreise
JPS4866973A (it) * 1971-12-16 1973-09-13
DE2253627A1 (de) * 1972-11-02 1974-05-16 Philips Patentverwaltung Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement
US4066839A (en) * 1972-11-16 1978-01-03 Sgs-Ates Componenti Elettronici S.P.A. Molded body incorporating heat dissipator
IT974672B (it) * 1972-11-16 1974-07-10 Ates Componenti Elettronici So Dissipatore di calore da incorpo rare in circuiti integrati con contenitore in resina
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
US4084312A (en) * 1976-01-07 1978-04-18 Motorola, Inc. Electrically isolated heat sink lead frame for plastic encapsulated semiconductor assemblies
US4368168A (en) * 1978-07-17 1983-01-11 Dusan Slepcevic Method for encapsulating electrical components

Also Published As

Publication number Publication date
GB2101516A (en) 1983-01-19
NL189533B (nl) 1992-12-01
DE3212903A1 (de) 1982-11-11
FR2503978A1 (fr) 1982-10-15
FR2503978B1 (it) 1985-04-19
US4467522A (en) 1984-08-28
IT8121117A0 (it) 1981-04-13
NL8201513A (nl) 1982-11-01
JPS58173853A (ja) 1983-10-12
GB2101516B (en) 1985-06-26
CA1184671A (en) 1985-03-26

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Effective date: 19950428