IT1291488B1 - Preapplicazione di grasso a dissipatori di calore con un rivestimento protettivo. - Google Patents
Preapplicazione di grasso a dissipatori di calore con un rivestimento protettivo.Info
- Publication number
- IT1291488B1 IT1291488B1 ITTO970075A IT1291488B1 IT 1291488 B1 IT1291488 B1 IT 1291488B1 IT TO970075 A ITTO970075 A IT TO970075A IT 1291488 B1 IT1291488 B1 IT 1291488B1
- Authority
- IT
- Italy
- Prior art keywords
- heat sink
- covered
- electronic component
- contact surface
- surface coated
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Lubricants (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66987596A | 1996-06-21 | 1996-06-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
ITTO970075A1 ITTO970075A1 (it) | 1998-07-31 |
IT1291488B1 true IT1291488B1 (it) | 1999-01-11 |
Family
ID=24688075
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT97TO000020U ITTO970020U3 (it) | 1996-06-21 | 1997-01-31 | Preapplicazione di grasso a dissipatori di calore con un rivestimento protettivo. |
IT000075 IT1291488B1 (it) | 1996-06-21 | 1997-01-31 | Preapplicazione di grasso a dissipatori di calore con un rivestimento protettivo. |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT97TO000020U ITTO970020U3 (it) | 1996-06-21 | 1997-01-31 | Preapplicazione di grasso a dissipatori di calore con un rivestimento protettivo. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5897917A (it) |
JP (1) | JPH11511909A (it) |
KR (1) | KR19990036429A (it) |
CN (1) | CN1150399C (it) |
IT (2) | ITTO970020U3 (it) |
TW (1) | TW421986B (it) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW358565U (en) * | 1997-12-01 | 1999-05-11 | Hon Hai Prec Ind Co Ltd | Protection back lid for heat transfer dielectric plate |
TW359383U (en) * | 1997-12-19 | 1999-05-21 | Hon Hai Prec Ind Co Ltd | Protection cover for heat transfer dielectrics |
TW444158B (en) * | 1998-07-08 | 2001-07-01 | Hon Hai Prec Ind Co Ltd | Heat sink device and its manufacture method |
US6644395B1 (en) * | 1999-11-17 | 2003-11-11 | Parker-Hannifin Corporation | Thermal interface material having a zone-coated release linear |
US6475962B1 (en) * | 2000-09-14 | 2002-11-05 | Aos Thermal Compounds, Llc | Dry thermal grease |
US6890987B2 (en) * | 2000-10-18 | 2005-05-10 | Nanofilm, Ltd. | Product for vapor deposition of films of amphiphilic molecules or polymers |
US20030112603A1 (en) * | 2001-12-13 | 2003-06-19 | Roesner Arlen L. | Thermal interface |
US6881265B2 (en) * | 2002-04-12 | 2005-04-19 | International Business Machines Corporation | Grease rework applicator |
US6945312B2 (en) * | 2002-12-20 | 2005-09-20 | Saint-Gobain Performance Plastics Corporation | Thermal interface material and methods for assembling and operating devices using such material |
TW573905U (en) * | 2003-06-11 | 2004-01-21 | Hon Hai Prec Ind Co Ltd | A retainer for mounting a grease cap |
CN2681331Y (zh) * | 2003-12-26 | 2005-02-23 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
JP4641423B2 (ja) * | 2004-02-18 | 2011-03-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US6935420B1 (en) * | 2004-06-16 | 2005-08-30 | Hon Hai Precision Ind. Co., Ltd. | Heat dissipation assembly |
CN2727961Y (zh) * | 2004-08-25 | 2005-09-21 | 鸿富锦精密工业(深圳)有限公司 | 散热装置 |
CN2800718Y (zh) * | 2005-05-24 | 2006-07-26 | 富准精密工业(深圳)有限公司 | 热传介质保护装置 |
CN2800705Y (zh) * | 2005-05-29 | 2006-07-26 | 富准精密工业(深圳)有限公司 | 保护盖及具有该保护盖的散热装置 |
TWM283223U (en) * | 2005-07-15 | 2005-12-11 | Foxconn Tech Co Ltd | Protective cap |
CN100534280C (zh) * | 2006-03-16 | 2009-08-26 | 富准精密工业(深圳)有限公司 | 热传介质保护装置 |
US20070235177A1 (en) * | 2006-04-07 | 2007-10-11 | Feng-Ku Wang | Heat conducting medium protection device |
US7319592B2 (en) * | 2006-04-11 | 2008-01-15 | Inventec Corporation | Recyclable protective cover for a heat-conductive medium |
US7589969B2 (en) | 2006-04-12 | 2009-09-15 | Inventec Corporation | Folding protective cover for heat-conductive medium |
CN101562964B (zh) * | 2008-04-14 | 2013-01-09 | 鸿富锦精密工业(深圳)有限公司 | 导热介质保护盖及具有该保护盖的散热装置 |
US7779895B2 (en) * | 2008-04-14 | 2010-08-24 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Protective device for protecting thermal interface material and fasteners of heat dissipation device |
CN101573020A (zh) * | 2008-04-28 | 2009-11-04 | 富准精密工业(深圳)有限公司 | 保护盖 |
CN101583261A (zh) * | 2008-05-16 | 2009-11-18 | 富准精密工业(深圳)有限公司 | 热传介质保护装置 |
US20110116242A1 (en) * | 2009-11-18 | 2011-05-19 | Seagate Technology Llc | Tamper evident pcba film |
JP6371245B2 (ja) * | 2015-03-20 | 2018-08-08 | 日本電気株式会社 | 熱伝導性部材、冷却構造及び装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL82981C (it) * | 1950-10-14 | 1900-01-01 | ||
US2711382A (en) * | 1951-02-08 | 1955-06-21 | Gen Electric | Method of forming and applying metal heat exchange fins |
US3301315A (en) * | 1965-03-12 | 1967-01-31 | James E Webb | Thermal conductive connection and method of making same |
US3509429A (en) * | 1968-01-15 | 1970-04-28 | Ibm | Heat sink assembly for semiconductor devices |
US3972821A (en) * | 1973-04-30 | 1976-08-03 | Amchem Products, Inc. | Heat transfer composition and method of making |
US4602678A (en) * | 1983-09-02 | 1986-07-29 | The Bergquist Company | Interfacing of heat sinks with electrical devices, and the like |
US5168926A (en) * | 1991-09-25 | 1992-12-08 | Intel Corporation | Heat sink design integrating interface material |
KR960703723A (ko) * | 1993-07-14 | 1996-08-31 | 죠지 에이. 리 | 열 전도성 상사 계면 물질(Conformal Thermally Conductive Interface Material) |
-
1996
- 1996-12-30 KR KR1019980701098A patent/KR19990036429A/ko not_active Application Discontinuation
- 1996-12-30 JP JP10502902A patent/JPH11511909A/ja active Pending
- 1996-12-30 CN CNB961964480A patent/CN1150399C/zh not_active Expired - Fee Related
- 1996-12-31 TW TW085116325A patent/TW421986B/zh active
-
1997
- 1997-01-31 IT IT97TO000020U patent/ITTO970020U3/it unknown
- 1997-01-31 IT IT000075 patent/IT1291488B1/it active IP Right Grant
- 1997-08-13 US US08/910,314 patent/US5897917A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1150399C (zh) | 2004-05-19 |
TW421986B (en) | 2001-02-11 |
JPH11511909A (ja) | 1999-10-12 |
US5897917A (en) | 1999-04-27 |
ITTO970020U3 (it) | 1998-07-31 |
CN1194030A (zh) | 1998-09-23 |
KR19990036429A (ko) | 1999-05-25 |
ITTO970075A1 (it) | 1998-07-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted |